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Alloying System

The Experts below are selected from a list of 57 Experts worldwide ranked by ideXlab platform

Hans Rudolf Elsener – 1st expert on this subject based on the ideXlab platform

  • Au-Ge Based Alloys for Novel High-T Lead Free Solder Materials – Fundamentals and Applications
    Proc. Int. Brazing Soldering Conf. 5th, 2012
    Co-Authors: Shan Jin, Fabrizio Valenza, Italian National, Donatella Giuranno, Christian Leinenbach, J. Wang, Hans Rudolf Elsener

    Abstract:

    Low melting Au based alloys offer a combination of high corrosion and creep resistance as well as good electrical and thermal conductivity, and they support the capability for fluxless soldering. Despite their high price, Au alloys are of special interest for high temperature solder applications where these characteristics are essential, e.g. special MEMS devices, sensors exposed to aggressive media, biomedical applications or in space technology. The Alloying System Au-Ge is characterized by a deep eutectic point with a melting temperature of 360°C, but information on the use of eutectic Au-Ge as solder material is very limited. In this work, the results of a group project within the European COST Action MP0602 “High Temperature Lead Free Solders” on the feasibility of Au-Ge based alloys as high-temperature lead free solder will be summarized. Beside the thermodynamic assessment of a number of important Alloying Systems (Cu-Ge, Ge-Ni, Au-Ge-Sb, Au-Ge-Si, Au-Ge-Sn) wetting and soldering tests using eutectic Au-Ge alloy and Cu and Ni substrates were performed. Sound joints with a high strength could be produced. Copyright 2012 ASM International® All rights reserved.

  • Au-Ge based alloys for novel High-T Lead Free Solder materials – Fundamentals and applications
    IBSC 2012 – Proceedings of the 5th International Brazing and Soldering Conference, 2012
    Co-Authors: Christian Leinenbach, Shan Jin, Hans Rudolf Elsener, Fabrizio Valenza, Donatella Giuranno, J. Wang, Radmila Novakovic, S Delsante, G. Borzone, A Watson

    Abstract:

    Low melting Au based alloys offer a combination of high corrosion and creep resistance as well as good electrical and thermal conductivity, and they support the capability for fluxless soldering. Despite their high price, Au alloys are of special interest for high temperature solder applications where these characteristics are essential, e.g. special MEMS devices, sensors exposed to aggressive media, biomedical applications or in space technology. The Alloying System Au-Ge is characterized by a deep eutectic point with a melting temperature of 360°C, but information on the use of eutectic Au-Ge as solder material is very limited. In this work, the results of a group project within the European COST Action MP0602 “High Temperature Lead Free Solders” on the feasibility of Au-Ge based alloys as high-temperature lead free solder will be summarized. Beside the thermodynamic assessment of a number of important Alloying Systems (Cu-Ge, Ge-Ni, Au-Ge-Sb, Au-Ge-Si, Au-Ge-Sn) wetting and soldering tests using eutectic Au-Ge alloy and Cu and Ni substrates were performed. Sound joints with a high strength could be produced. Copyright 2012 ASM International® All rights reserved.

Christian Leinenbach – 2nd expert on this subject based on the ideXlab platform

  • Au-Ge Based Alloys for Novel High-T Lead Free Solder Materials – Fundamentals and Applications
    Proc. Int. Brazing Soldering Conf. 5th, 2012
    Co-Authors: Shan Jin, Fabrizio Valenza, Italian National, Donatella Giuranno, Christian Leinenbach, J. Wang, Hans Rudolf Elsener

    Abstract:

    Low melting Au based alloys offer a combination of high corrosion and creep resistance as well as good electrical and thermal conductivity, and they support the capability for fluxless soldering. Despite their high price, Au alloys are of special interest for high temperature solder applications where these characteristics are essential, e.g. special MEMS devices, sensors exposed to aggressive media, biomedical applications or in space technology. The Alloying System Au-Ge is characterized by a deep eutectic point with a melting temperature of 360°C, but information on the use of eutectic Au-Ge as solder material is very limited. In this work, the results of a group project within the European COST Action MP0602 “High Temperature Lead Free Solders” on the feasibility of Au-Ge based alloys as high-temperature lead free solder will be summarized. Beside the thermodynamic assessment of a number of important Alloying Systems (Cu-Ge, Ge-Ni, Au-Ge-Sb, Au-Ge-Si, Au-Ge-Sn) wetting and soldering tests using eutectic Au-Ge alloy and Cu and Ni substrates were performed. Sound joints with a high strength could be produced. Copyright 2012 ASM International® All rights reserved.

  • Au-Ge based alloys for novel High-T Lead Free Solder materials – Fundamentals and applications
    IBSC 2012 – Proceedings of the 5th International Brazing and Soldering Conference, 2012
    Co-Authors: Christian Leinenbach, Shan Jin, Hans Rudolf Elsener, Fabrizio Valenza, Donatella Giuranno, J. Wang, Radmila Novakovic, S Delsante, G. Borzone, A Watson

    Abstract:

    Low melting Au based alloys offer a combination of high corrosion and creep resistance as well as good electrical and thermal conductivity, and they support the capability for fluxless soldering. Despite their high price, Au alloys are of special interest for high temperature solder applications where these characteristics are essential, e.g. special MEMS devices, sensors exposed to aggressive media, biomedical applications or in space technology. The Alloying System Au-Ge is characterized by a deep eutectic point with a melting temperature of 360°C, but information on the use of eutectic Au-Ge as solder material is very limited. In this work, the results of a group project within the European COST Action MP0602 “High Temperature Lead Free Solders” on the feasibility of Au-Ge based alloys as high-temperature lead free solder will be summarized. Beside the thermodynamic assessment of a number of important Alloying Systems (Cu-Ge, Ge-Ni, Au-Ge-Sb, Au-Ge-Si, Au-Ge-Sn) wetting and soldering tests using eutectic Au-Ge alloy and Cu and Ni substrates were performed. Sound joints with a high strength could be produced. Copyright 2012 ASM International® All rights reserved.

Shan Jin – 3rd expert on this subject based on the ideXlab platform

  • Au-Ge Based Alloys for Novel High-T Lead Free Solder Materials – Fundamentals and Applications
    Proc. Int. Brazing Soldering Conf. 5th, 2012
    Co-Authors: Shan Jin, Fabrizio Valenza, Italian National, Donatella Giuranno, Christian Leinenbach, J. Wang, Hans Rudolf Elsener

    Abstract:

    Low melting Au based alloys offer a combination of high corrosion and creep resistance as well as good electrical and thermal conductivity, and they support the capability for fluxless soldering. Despite their high price, Au alloys are of special interest for high temperature solder applications where these characteristics are essential, e.g. special MEMS devices, sensors exposed to aggressive media, biomedical applications or in space technology. The Alloying System Au-Ge is characterized by a deep eutectic point with a melting temperature of 360°C, but information on the use of eutectic Au-Ge as solder material is very limited. In this work, the results of a group project within the European COST Action MP0602 “High Temperature Lead Free Solders” on the feasibility of Au-Ge based alloys as high-temperature lead free solder will be summarized. Beside the thermodynamic assessment of a number of important Alloying Systems (Cu-Ge, Ge-Ni, Au-Ge-Sb, Au-Ge-Si, Au-Ge-Sn) wetting and soldering tests using eutectic Au-Ge alloy and Cu and Ni substrates were performed. Sound joints with a high strength could be produced. Copyright 2012 ASM International® All rights reserved.

  • Au-Ge based alloys for novel High-T Lead Free Solder materials – Fundamentals and applications
    IBSC 2012 – Proceedings of the 5th International Brazing and Soldering Conference, 2012
    Co-Authors: Christian Leinenbach, Shan Jin, Hans Rudolf Elsener, Fabrizio Valenza, Donatella Giuranno, J. Wang, Radmila Novakovic, S Delsante, G. Borzone, A Watson

    Abstract:

    Low melting Au based alloys offer a combination of high corrosion and creep resistance as well as good electrical and thermal conductivity, and they support the capability for fluxless soldering. Despite their high price, Au alloys are of special interest for high temperature solder applications where these characteristics are essential, e.g. special MEMS devices, sensors exposed to aggressive media, biomedical applications or in space technology. The Alloying System Au-Ge is characterized by a deep eutectic point with a melting temperature of 360°C, but information on the use of eutectic Au-Ge as solder material is very limited. In this work, the results of a group project within the European COST Action MP0602 “High Temperature Lead Free Solders” on the feasibility of Au-Ge based alloys as high-temperature lead free solder will be summarized. Beside the thermodynamic assessment of a number of important Alloying Systems (Cu-Ge, Ge-Ni, Au-Ge-Sb, Au-Ge-Si, Au-Ge-Sn) wetting and soldering tests using eutectic Au-Ge alloy and Cu and Ni substrates were performed. Sound joints with a high strength could be produced. Copyright 2012 ASM International® All rights reserved.