The Experts below are selected from a list of 20748 Experts worldwide ranked by ideXlab platform
Matteo Mariantoni - One of the best experts on this subject based on the ideXlab platform.
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Thermocompression Bonding Technology for multilayer superconducting quantum circuits
Applied Physics Letters, 2017Co-Authors: Adel Abdallah, C. R.h. Mcrae, J. H. Béjanin, T. G. Mcconkey, C. T. Earnest, J. R. Rinehart, Zachary Pagel, Matteo MariantoniAbstract:Extensible quantum computing architectures require a large array of quantum bits operating with low error rates. A quantum processor based on superconducting devices can be scaled up by stacking microchips that perform wiring, shielding, and computational functionalities. In this article, we demonstrate a vacuum thermocompression Bonding Technology that utilizes thin indium films as a welding agent to attach pairs of lithographically patterned chips. At 10 mK, we find a specific dc bond resistance of 49.2 μΩ cm2. We show good transmission up to 6.8 GHz in a tunnel-capped, bonded device as compared to a similar uncapped device. Finally, we fabricate and measure a set of tunnel-capped superconducting resonators, demonstrating that our Bonding Technology can be used in quantum computing applications.
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Thermocompression Bonding Technology for multilayer superconducting quantum circuits
Applied Physics Letters, 2017Co-Authors: C. R.h. Mcrae, J. H. Béjanin, A. O. Abdallah, T. G. Mcconkey, C. T. Earnest, J. R. Rinehart, Zachary Pagel, Matteo MariantoniAbstract:Extensible quantum computing architectures require a large array of quantum devices operating with low error rates. A quantum processor based on superconducting quantum bits can be scaled up by stacking microchips that each perform different computational functions. In this article, we experimentally demonstrate a thermocompression Bonding Technology that utilizes indium films as a welding agent to attach pairs of lithographically-patterned chips. We perform chip-to-chip indium Bonding in vacuum at $190^{\circ}C$ with indium film thicknesses of $150 nm$. We characterize the dc and microwave performance of bonded devices at room and cryogenic temperatures. At $10 mK$, we find a dc bond resistance of $515 n{\Omega}mm^2$. Additionally, we show minimal microwave reflections and good transmission up to $6.8 GHz$ in a tunnel-capped, bonded device as compared to a similar uncapped device. As a proof of concept, we fabricate and measure a set of tunnel-capped superconducting resonators, demonstrating that our Bonding Technology can be used in quantum computing applications.
C. R.h. Mcrae - One of the best experts on this subject based on the ideXlab platform.
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Thermocompression Bonding Technology for multilayer superconducting quantum circuits
Applied Physics Letters, 2017Co-Authors: Adel Abdallah, C. R.h. Mcrae, J. H. Béjanin, T. G. Mcconkey, C. T. Earnest, J. R. Rinehart, Zachary Pagel, Matteo MariantoniAbstract:Extensible quantum computing architectures require a large array of quantum bits operating with low error rates. A quantum processor based on superconducting devices can be scaled up by stacking microchips that perform wiring, shielding, and computational functionalities. In this article, we demonstrate a vacuum thermocompression Bonding Technology that utilizes thin indium films as a welding agent to attach pairs of lithographically patterned chips. At 10 mK, we find a specific dc bond resistance of 49.2 μΩ cm2. We show good transmission up to 6.8 GHz in a tunnel-capped, bonded device as compared to a similar uncapped device. Finally, we fabricate and measure a set of tunnel-capped superconducting resonators, demonstrating that our Bonding Technology can be used in quantum computing applications.
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Thermocompression Bonding Technology for multilayer superconducting quantum circuits
Applied Physics Letters, 2017Co-Authors: C. R.h. Mcrae, J. H. Béjanin, A. O. Abdallah, T. G. Mcconkey, C. T. Earnest, J. R. Rinehart, Zachary Pagel, Matteo MariantoniAbstract:Extensible quantum computing architectures require a large array of quantum devices operating with low error rates. A quantum processor based on superconducting quantum bits can be scaled up by stacking microchips that each perform different computational functions. In this article, we experimentally demonstrate a thermocompression Bonding Technology that utilizes indium films as a welding agent to attach pairs of lithographically-patterned chips. We perform chip-to-chip indium Bonding in vacuum at $190^{\circ}C$ with indium film thicknesses of $150 nm$. We characterize the dc and microwave performance of bonded devices at room and cryogenic temperatures. At $10 mK$, we find a dc bond resistance of $515 n{\Omega}mm^2$. Additionally, we show minimal microwave reflections and good transmission up to $6.8 GHz$ in a tunnel-capped, bonded device as compared to a similar uncapped device. As a proof of concept, we fabricate and measure a set of tunnel-capped superconducting resonators, demonstrating that our Bonding Technology can be used in quantum computing applications.
Xinliang Zhang - One of the best experts on this subject based on the ideXlab platform.
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Bandwidth improvement for germanium photodetector using wire Bonding Technology.
Optics express, 2015Co-Authors: Guanyu Chen, Shupeng Deng, Lei Liu, Xinliang ZhangAbstract:We demonstrate an ultrahigh speed germanium photodetector by introducing gold wires into the discrete ground electrodes with standard wire Bonding Technology. To engineer the parasitic parameter, the physical dimension of the gold wire used for wire Bonding is specially designed with an inductance of about 450 pH. Simulation and experimental results show that the bandwidth of the photodetector can be effectively extended from less than 30 GHz to over 60 GHz.
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60 GHz Germanium Photodetector Using Wire Bonding Technology
Asia Communications and Photonics Conference 2015, 2015Co-Authors: Guanyu Chen, Chunlei Sun, Shupeng Deng, Lei Liu, Xinliang ZhangAbstract:We propose a new method for increasing the bandwidth of the Ge photodetector using wire Bonding Technology. Simulation and experimental results show that the bandwidth can be extended from less than 30GHz to over 60GHz.
Zachary Pagel - One of the best experts on this subject based on the ideXlab platform.
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Thermocompression Bonding Technology for multilayer superconducting quantum circuits
Applied Physics Letters, 2017Co-Authors: Adel Abdallah, C. R.h. Mcrae, J. H. Béjanin, T. G. Mcconkey, C. T. Earnest, J. R. Rinehart, Zachary Pagel, Matteo MariantoniAbstract:Extensible quantum computing architectures require a large array of quantum bits operating with low error rates. A quantum processor based on superconducting devices can be scaled up by stacking microchips that perform wiring, shielding, and computational functionalities. In this article, we demonstrate a vacuum thermocompression Bonding Technology that utilizes thin indium films as a welding agent to attach pairs of lithographically patterned chips. At 10 mK, we find a specific dc bond resistance of 49.2 μΩ cm2. We show good transmission up to 6.8 GHz in a tunnel-capped, bonded device as compared to a similar uncapped device. Finally, we fabricate and measure a set of tunnel-capped superconducting resonators, demonstrating that our Bonding Technology can be used in quantum computing applications.
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Thermocompression Bonding Technology for multilayer superconducting quantum circuits
Applied Physics Letters, 2017Co-Authors: C. R.h. Mcrae, J. H. Béjanin, A. O. Abdallah, T. G. Mcconkey, C. T. Earnest, J. R. Rinehart, Zachary Pagel, Matteo MariantoniAbstract:Extensible quantum computing architectures require a large array of quantum devices operating with low error rates. A quantum processor based on superconducting quantum bits can be scaled up by stacking microchips that each perform different computational functions. In this article, we experimentally demonstrate a thermocompression Bonding Technology that utilizes indium films as a welding agent to attach pairs of lithographically-patterned chips. We perform chip-to-chip indium Bonding in vacuum at $190^{\circ}C$ with indium film thicknesses of $150 nm$. We characterize the dc and microwave performance of bonded devices at room and cryogenic temperatures. At $10 mK$, we find a dc bond resistance of $515 n{\Omega}mm^2$. Additionally, we show minimal microwave reflections and good transmission up to $6.8 GHz$ in a tunnel-capped, bonded device as compared to a similar uncapped device. As a proof of concept, we fabricate and measure a set of tunnel-capped superconducting resonators, demonstrating that our Bonding Technology can be used in quantum computing applications.
J. H. Béjanin - One of the best experts on this subject based on the ideXlab platform.
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Thermocompression Bonding Technology for multilayer superconducting quantum circuits
Applied Physics Letters, 2017Co-Authors: Adel Abdallah, C. R.h. Mcrae, J. H. Béjanin, T. G. Mcconkey, C. T. Earnest, J. R. Rinehart, Zachary Pagel, Matteo MariantoniAbstract:Extensible quantum computing architectures require a large array of quantum bits operating with low error rates. A quantum processor based on superconducting devices can be scaled up by stacking microchips that perform wiring, shielding, and computational functionalities. In this article, we demonstrate a vacuum thermocompression Bonding Technology that utilizes thin indium films as a welding agent to attach pairs of lithographically patterned chips. At 10 mK, we find a specific dc bond resistance of 49.2 μΩ cm2. We show good transmission up to 6.8 GHz in a tunnel-capped, bonded device as compared to a similar uncapped device. Finally, we fabricate and measure a set of tunnel-capped superconducting resonators, demonstrating that our Bonding Technology can be used in quantum computing applications.
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Thermocompression Bonding Technology for multilayer superconducting quantum circuits
Applied Physics Letters, 2017Co-Authors: C. R.h. Mcrae, J. H. Béjanin, A. O. Abdallah, T. G. Mcconkey, C. T. Earnest, J. R. Rinehart, Zachary Pagel, Matteo MariantoniAbstract:Extensible quantum computing architectures require a large array of quantum devices operating with low error rates. A quantum processor based on superconducting quantum bits can be scaled up by stacking microchips that each perform different computational functions. In this article, we experimentally demonstrate a thermocompression Bonding Technology that utilizes indium films as a welding agent to attach pairs of lithographically-patterned chips. We perform chip-to-chip indium Bonding in vacuum at $190^{\circ}C$ with indium film thicknesses of $150 nm$. We characterize the dc and microwave performance of bonded devices at room and cryogenic temperatures. At $10 mK$, we find a dc bond resistance of $515 n{\Omega}mm^2$. Additionally, we show minimal microwave reflections and good transmission up to $6.8 GHz$ in a tunnel-capped, bonded device as compared to a similar uncapped device. As a proof of concept, we fabricate and measure a set of tunnel-capped superconducting resonators, demonstrating that our Bonding Technology can be used in quantum computing applications.