The Experts below are selected from a list of 147 Experts worldwide ranked by ideXlab platform
Dias T - One of the best experts on this subject based on the ideXlab platform.
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Automated insertion of package dies onto wire and into a textile Yarn sheath
'Springer Science and Business Media LLC', 2019Co-Authors: Da Hardy, Nashed M-n, Hughes-riley T, Komolafe A, Tudor J, Torah R, Beeby S, Dias TAbstract:Wider adoption of electronic textiles requires integration of small electronic components into textile fabrics, without comprising the textile qualities. A solution is to create a flexible Yarn that incorporates electronic components within the fibres of the Yarn (E-Yarn). The production of these novel E-Yarns was initially a craft skill, with the inclusion of package dies within the fibres of the Yarn taking about 90 minutes. The research described here demonstrated that it is possible to produce E-Yarns on an industrial scale by automating the manufacturing process. This involved adapting printed circuit board manufacturing technology and textile Yarn covering machinery. The production process started with re-flow soldering of package dies onto fine multi-strand copper wire. A Carrier Yarn was then placed in parallel with the copper wire to provide tensile strength. The package die and adjacent Carrier Yarn were then encapsulated in a polymer micro-pod to provide protection from moisture ingress and from mechanical strain on the die and solder joints. The process was then completed by surrounding the micro-pod and copper interconnects with additional fibres, held tightly together with a knitted fibre-sheath. This prototype, automated production process reduced the time for embedding one micro-device within a Yarn to six minutes, thus increasing the production speed, demonstrating that automation of the E-Yarn production process is feasible. Prototype garments have been created using E- Yarns. Further developments can include automated transfer of the Yarn components from one stage of production to the next, enabling greater increases in speed of manufacture of E Yarns
Tilak Dias - One of the best experts on this subject based on the ideXlab platform.
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Automated insertion of package dies onto wire and into a textile Yarn sheath
Microsystem Technologies, 2019Co-Authors: Dorothy Anne Hardy, Theodore Hughes-riley, Mohamad-nour Nashed, Steve Beeby, Carlos Oliveira, Abiodun Komolafe, John Tudor, Russel Torah, Ioannis Anastasopoulos, Tilak DiasAbstract:Wider adoption of electronic textiles requires integration of small electronic components into textile fabrics, without comprising the textile qualities. A solution is to create a flexible Yarn that incorporates electronic components within the fibres of the Yarn (E-Yarn). The production of these novel E-Yarns was initially a craft skill, with the inclusion of package dies within the fibres of the Yarn taking about 90 min. The research described here demonstrated that it is possible to produce E-Yarns on an industrial scale by automating the manufacturing process. This involved adapting printed circuit board manufacturing technology and textile Yarn covering machinery. The production process started with re-flow soldering of package dies onto fine multi-strand copper wire. A Carrier Yarn was then placed in parallel with the copper wire to provide tensile strength. The package die and adjacent Carrier Yarn were then encapsulated in a polymer micro-pod to provide protection from moisture ingress and from mechanical strain on the die and solder joints. The process was then completed by surrounding the micro-pod and copper interconnects with additional fibres, held tightly together with a knitted fibre-sheath. This prototype, automated production process reduced the time for embedding one micro-device within a Yarn to 6 min, thus increasing the production speed, demonstrating that automation of the E-Yarn production process is feasible. Prototype garments have been created using E- Yarns. Further developments can include automated transfer of the Yarn components from one stage of production to the next, enabling greater increases in speed of manufacture of E Yarns.
Da Hardy - One of the best experts on this subject based on the ideXlab platform.
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Automated insertion of package dies onto wire and into a textile Yarn sheath
'Springer Science and Business Media LLC', 2019Co-Authors: Da Hardy, Nashed M-n, Hughes-riley T, Komolafe A, Tudor J, Torah R, Beeby S, Dias TAbstract:Wider adoption of electronic textiles requires integration of small electronic components into textile fabrics, without comprising the textile qualities. A solution is to create a flexible Yarn that incorporates electronic components within the fibres of the Yarn (E-Yarn). The production of these novel E-Yarns was initially a craft skill, with the inclusion of package dies within the fibres of the Yarn taking about 90 minutes. The research described here demonstrated that it is possible to produce E-Yarns on an industrial scale by automating the manufacturing process. This involved adapting printed circuit board manufacturing technology and textile Yarn covering machinery. The production process started with re-flow soldering of package dies onto fine multi-strand copper wire. A Carrier Yarn was then placed in parallel with the copper wire to provide tensile strength. The package die and adjacent Carrier Yarn were then encapsulated in a polymer micro-pod to provide protection from moisture ingress and from mechanical strain on the die and solder joints. The process was then completed by surrounding the micro-pod and copper interconnects with additional fibres, held tightly together with a knitted fibre-sheath. This prototype, automated production process reduced the time for embedding one micro-device within a Yarn to six minutes, thus increasing the production speed, demonstrating that automation of the E-Yarn production process is feasible. Prototype garments have been created using E- Yarns. Further developments can include automated transfer of the Yarn components from one stage of production to the next, enabling greater increases in speed of manufacture of E Yarns
Dorothy Anne Hardy - One of the best experts on this subject based on the ideXlab platform.
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Automated insertion of package dies onto wire and into a textile Yarn sheath
Microsystem Technologies, 2019Co-Authors: Dorothy Anne Hardy, Theodore Hughes-riley, Mohamad-nour Nashed, Steve Beeby, Carlos Oliveira, Abiodun Komolafe, John Tudor, Russel Torah, Ioannis Anastasopoulos, Tilak DiasAbstract:Wider adoption of electronic textiles requires integration of small electronic components into textile fabrics, without comprising the textile qualities. A solution is to create a flexible Yarn that incorporates electronic components within the fibres of the Yarn (E-Yarn). The production of these novel E-Yarns was initially a craft skill, with the inclusion of package dies within the fibres of the Yarn taking about 90 min. The research described here demonstrated that it is possible to produce E-Yarns on an industrial scale by automating the manufacturing process. This involved adapting printed circuit board manufacturing technology and textile Yarn covering machinery. The production process started with re-flow soldering of package dies onto fine multi-strand copper wire. A Carrier Yarn was then placed in parallel with the copper wire to provide tensile strength. The package die and adjacent Carrier Yarn were then encapsulated in a polymer micro-pod to provide protection from moisture ingress and from mechanical strain on the die and solder joints. The process was then completed by surrounding the micro-pod and copper interconnects with additional fibres, held tightly together with a knitted fibre-sheath. This prototype, automated production process reduced the time for embedding one micro-device within a Yarn to 6 min, thus increasing the production speed, demonstrating that automation of the E-Yarn production process is feasible. Prototype garments have been created using E- Yarns. Further developments can include automated transfer of the Yarn components from one stage of production to the next, enabling greater increases in speed of manufacture of E Yarns.
Mohamad-nour Nashed - One of the best experts on this subject based on the ideXlab platform.
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Automated insertion of package dies onto wire and into a textile Yarn sheath
Microsystem Technologies, 2019Co-Authors: Dorothy Anne Hardy, Theodore Hughes-riley, Mohamad-nour Nashed, Steve Beeby, Carlos Oliveira, Abiodun Komolafe, John Tudor, Russel Torah, Ioannis Anastasopoulos, Tilak DiasAbstract:Wider adoption of electronic textiles requires integration of small electronic components into textile fabrics, without comprising the textile qualities. A solution is to create a flexible Yarn that incorporates electronic components within the fibres of the Yarn (E-Yarn). The production of these novel E-Yarns was initially a craft skill, with the inclusion of package dies within the fibres of the Yarn taking about 90 min. The research described here demonstrated that it is possible to produce E-Yarns on an industrial scale by automating the manufacturing process. This involved adapting printed circuit board manufacturing technology and textile Yarn covering machinery. The production process started with re-flow soldering of package dies onto fine multi-strand copper wire. A Carrier Yarn was then placed in parallel with the copper wire to provide tensile strength. The package die and adjacent Carrier Yarn were then encapsulated in a polymer micro-pod to provide protection from moisture ingress and from mechanical strain on the die and solder joints. The process was then completed by surrounding the micro-pod and copper interconnects with additional fibres, held tightly together with a knitted fibre-sheath. This prototype, automated production process reduced the time for embedding one micro-device within a Yarn to 6 min, thus increasing the production speed, demonstrating that automation of the E-Yarn production process is feasible. Prototype garments have been created using E- Yarns. Further developments can include automated transfer of the Yarn components from one stage of production to the next, enabling greater increases in speed of manufacture of E Yarns.