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Elsayed M Sherif - One of the best experts on this subject based on the ideXlab platform.

  • inhibition of Copper Corrosion in acidic chloride pickling solutions by 5 3 aminophenyl tetrazole as a Corrosion inhibitor
    Corrosion Science, 2008
    Co-Authors: Elsayed M Sherif, R M Erasmus, J D Comins
    Abstract:

    Inhibition of Copper Corrosion in acidic chloride pickling (0.5 M HCl) solutions by 5-(3-Aminophenyl)-tetrazole (APT) as a Corrosion inhibitor has been studied using potentiodynamic polarization, chronoamperometry (CA), electrochemical impedance spectroscopy (EIS), weight-loss and Raman spectroscopy investigations. Electrochemical measurements showed that the presence of APT and the increase of its concentration significantly decrease the cathodic, anodic, and Corrosion currents as well as Corrosion rates. This effect also decreases the dissolution currents of Copper at 200 mV vs. Ag/AgCl, and greatly increases surface and polarization resistances and inhibition efficiency as indicated by CA and EIS measurements. Weight-loss data revealed that the Corrosion rate of Copper decreases to a minimum and the inhibition efficiency increases to a maximum in the presence of APT and upon increasing of its concentration even after 72 h of Copper coupons immersion. Comparing the Raman spectrum obtained on the Copper surface after its immersion in HCl solution containing 1.0 mM APT for 72 h to the spectrum obtained for the solid APT alone indicated that APT molecules inhibit the Corrosion of Copper via their adsorption onto its surface.

  • effects of 3 amino 1 2 4 triazole on the inhibition of Copper Corrosion in acidic chloride solutions
    Journal of Colloid and Interface Science, 2007
    Co-Authors: Elsayed M Sherif, R M Erasmus, J D Comins
    Abstract:

    Abstract Effects of 3-amino-1,2,4-triazole (ATA) on the inhibition of Copper Corrosion in 0.5 M HCl solutions have been studied using gravimetric, electrochemical, and Raman spectroscopy investigations. Weight-loss measurements after varied immersion periods revealed that the dissolution rate of Copper decreased to a minimum, while the inhibition efficiency ( ζ % ) and consequently the degree of surface coverage ( θ ) increased with the presence of ATA and the increase of its concentration. Potentiodynamic polarization, chronoamperometric, and electrochemical impedance spectroscopy (EIS) measurements after 0, 24, and 48 h immersion of the Copper electrode in the test solutions showed that the presence of ATA molecules significantly decreased cathodic, anodic, and Corrosion ( j corr ) currents and Corrosion rates ( R corr ) and greatly increased polarization resistance ( R p ) , ζ %, and θ ; this effect was increased on increasing the ATA content in the solution. Raman spectroscopy confirmed that ATA molecules strongly adsorbed onto the Copper surface, blocking its active sites and preventing it from being corroded easily.

  • effects of 2 amino 5 ethylthio 1 3 4 thiadiazole on Copper Corrosion as a Corrosion inhibitor in aerated acidic pickling solutions
    Electrochimica Acta, 2006
    Co-Authors: Elsayed M Sherif, Sumoon Park
    Abstract:

    Abstract Effects of 2-amino-5-ethylthio-1,3,4-thiadiazole (AETD) on Copper Corrosion as a Corrosion inhibitor in an aerated acidic pickling solution of 0.50 M HCl have been investigated using gravimetric and electrochemical techniques. Weight losses of Copper coupons in 0.50 M HCl measured after varied exposure periods of 2–12 h indicate that the addition of AETD significantly decreases the dissolution rate and the effect increases upon increasing its concentration. Results of potentiodynamic polarization experiments show a large decrease in cathodic, anodic, and Corrosion currents due to the presence of the organic molecules. Potentiostatic current–time measurements at 200 mV versus Ag/AgCl for 120 min, scanning electron microscope (SEM), and energy dispersive X-ray (EDX) investigations also indicate that AETD greatly lowers the dissolution currents as a result of its strong adsorption onto the Copper surface preventing it from being corroded easily. EIS measurements confirmed that the charge transfer resistance increases and mass transport decreases in the presence of AETD upon increasing its concentration.

  • inhibition of Copper Corrosion in acidic pickling solutions by n phenyl 1 4 phenylenediamine
    Electrochimica Acta, 2006
    Co-Authors: Elsayed M Sherif, Sumoon Park
    Abstract:

    Abstract Inhibition of Copper Corrosion by N -phenyl-1,4-phenylenediamine (NPPD) has been investigated in de-aerated, aerated, and oxygenated aqueous 0.50 M HCl solutions by using potentiodynamic polarization, potentiostatic current–time, electrochemical impedance spectroscopy, and weight-loss measurements, along with scanning electron microscopic (SEM) and energy dispersive X-ray (EDX) experiments. Potentiodynamic polarization measurements showed that the NPPD molecules significantly decrease cathodic, anodic, and Corrosion currents in all these solutions. Potentiostatic current–time measurements as well as SEM and EDX investigations of the Copper surface revealed that NPPD suppresses the Copper dissolution current due to its adsorption on the Copper surface as a Cu(I)–NPPD complex. Impedance measurements also supported the results obtained from both the potentiodynamic and potentiostatic experiments. The inhibition efficiencies measured from polarization, electrochemical impedance spectroscopy (EIS), and weight-loss experiments are all internally consistent with each other. These results together showed that NPPD is a good mixed-type inhibitor for Copper Corrosion in all solutions studied.

  • inhibition of Copper Corrosion in 3 0 nacl solution by n phenyl 1 4 phenylenediamine
    Journal of The Electrochemical Society, 2005
    Co-Authors: Elsayed M Sherif, Sumoon Park
    Abstract:

    Inhibition of Copper Corrosion by N-phenyl-1,4-phenylenediamine (NPPD) has been investigated in deaerated, aerated, and oxygenated aqueous 3.0% NaCI solutions using potentiodynamic polarization, electrochemical impedance spectroscopy, weight loss, infrared and UV-visible absorption spectroscopic, scanning electron microscopic (SEM), and energy-dispersive X-ray (EDX) measurements. Potentiodynamic polarization measurements showed that the presence of NPPD significantly decreases cathodic, anodic, and Corrosion currents in these solutions. Impedance measurements indicated that the charge-transfer resistances increase upon increasing the NPPD concentration. The inhibition efficiency of 1.0 mM NPPD obtained by weight-loss measurements is about 90%, increasing to about 96% at its concentration of 5.0 mM. Fourier transform infrared, UV-visible, SEM, and EDX measurements revealed that NPPD is adsorbed on the Copper surface at open-circuit potentials, preventing Copper from being corroded by forming a protective layer on its surface. All these results showed that Corrosion of Copper decreases in the order of oxygenated > aerated > deaerated solutions, and NPPD is a good mixed-type inhibitor for Copper Corrosion with its inhibition efficiency in the order of oxygenated > aerated > deaerated solutions.

Sumoon Park - One of the best experts on this subject based on the ideXlab platform.

  • effects of 2 amino 5 ethylthio 1 3 4 thiadiazole on Copper Corrosion as a Corrosion inhibitor in aerated acidic pickling solutions
    Electrochimica Acta, 2006
    Co-Authors: Elsayed M Sherif, Sumoon Park
    Abstract:

    Abstract Effects of 2-amino-5-ethylthio-1,3,4-thiadiazole (AETD) on Copper Corrosion as a Corrosion inhibitor in an aerated acidic pickling solution of 0.50 M HCl have been investigated using gravimetric and electrochemical techniques. Weight losses of Copper coupons in 0.50 M HCl measured after varied exposure periods of 2–12 h indicate that the addition of AETD significantly decreases the dissolution rate and the effect increases upon increasing its concentration. Results of potentiodynamic polarization experiments show a large decrease in cathodic, anodic, and Corrosion currents due to the presence of the organic molecules. Potentiostatic current–time measurements at 200 mV versus Ag/AgCl for 120 min, scanning electron microscope (SEM), and energy dispersive X-ray (EDX) investigations also indicate that AETD greatly lowers the dissolution currents as a result of its strong adsorption onto the Copper surface preventing it from being corroded easily. EIS measurements confirmed that the charge transfer resistance increases and mass transport decreases in the presence of AETD upon increasing its concentration.

  • inhibition of Copper Corrosion in acidic pickling solutions by n phenyl 1 4 phenylenediamine
    Electrochimica Acta, 2006
    Co-Authors: Elsayed M Sherif, Sumoon Park
    Abstract:

    Abstract Inhibition of Copper Corrosion by N -phenyl-1,4-phenylenediamine (NPPD) has been investigated in de-aerated, aerated, and oxygenated aqueous 0.50 M HCl solutions by using potentiodynamic polarization, potentiostatic current–time, electrochemical impedance spectroscopy, and weight-loss measurements, along with scanning electron microscopic (SEM) and energy dispersive X-ray (EDX) experiments. Potentiodynamic polarization measurements showed that the NPPD molecules significantly decrease cathodic, anodic, and Corrosion currents in all these solutions. Potentiostatic current–time measurements as well as SEM and EDX investigations of the Copper surface revealed that NPPD suppresses the Copper dissolution current due to its adsorption on the Copper surface as a Cu(I)–NPPD complex. Impedance measurements also supported the results obtained from both the potentiodynamic and potentiostatic experiments. The inhibition efficiencies measured from polarization, electrochemical impedance spectroscopy (EIS), and weight-loss experiments are all internally consistent with each other. These results together showed that NPPD is a good mixed-type inhibitor for Copper Corrosion in all solutions studied.

  • inhibition of Copper Corrosion in 3 0 nacl solution by n phenyl 1 4 phenylenediamine
    Journal of The Electrochemical Society, 2005
    Co-Authors: Elsayed M Sherif, Sumoon Park
    Abstract:

    Inhibition of Copper Corrosion by N-phenyl-1,4-phenylenediamine (NPPD) has been investigated in deaerated, aerated, and oxygenated aqueous 3.0% NaCI solutions using potentiodynamic polarization, electrochemical impedance spectroscopy, weight loss, infrared and UV-visible absorption spectroscopic, scanning electron microscopic (SEM), and energy-dispersive X-ray (EDX) measurements. Potentiodynamic polarization measurements showed that the presence of NPPD significantly decreases cathodic, anodic, and Corrosion currents in these solutions. Impedance measurements indicated that the charge-transfer resistances increase upon increasing the NPPD concentration. The inhibition efficiency of 1.0 mM NPPD obtained by weight-loss measurements is about 90%, increasing to about 96% at its concentration of 5.0 mM. Fourier transform infrared, UV-visible, SEM, and EDX measurements revealed that NPPD is adsorbed on the Copper surface at open-circuit potentials, preventing Copper from being corroded by forming a protective layer on its surface. All these results showed that Corrosion of Copper decreases in the order of oxygenated > aerated > deaerated solutions, and NPPD is a good mixed-type inhibitor for Copper Corrosion with its inhibition efficiency in the order of oxygenated > aerated > deaerated solutions.

Yabin Wang - One of the best experts on this subject based on the ideXlab platform.

  • the polymeric nanofilm of triazinedithiolsilane fabricated by self assembled technique on Copper surface part 2 characterization of composition and morphology
    Applied Surface Science, 2015
    Co-Authors: Yabin Wang, Zhong Liu, Yudong Huang
    Abstract:

    Abstract In the first part, a novel design route for metal protection against Corrosion was proposed, and a class of triazinedithiolsilane compounds was conceived as protector for Copper. The protective capability of the polymeric nanofilm, fabricated by self-assembling one representative (abbreviated as TESPA) of triazinedithiolsilane compounds onto Copper surface, has been investigated and evaluated by electrochemical tests. The results show that the polymeric nanofilm significantly inhibits Copper Corrosion. This study, on the one hand, concentrates on the chemical composition of the TESPA polymeric nanofilm by means of X-ray photoelectron spectroscopy (XPS). The XPS results reveal that the chemical bonds between Copper and TESPA monomers, three dimensional disulfide units and siloxane networks are responsible for the satisfactory protection of TESPA polymeric nanofilm against Copper Corrosion. On the other hand, scanning electron microscope (SEM) and energy-dispersive spectroscopy (EDS) are utilized to reveal the morphology and the uniformity of the TESPA polymeric nanofilm. The SEM-EDS results demonstrate that the Copper surfaces are uniformly covered with TESPA self-assembled monolayer and the polymeric nanofilm. The TESPA-covered Copper surfaces turn out to be smoother than that of the bare Copper surface.

  • the polymeric nanofilm of triazinedithiolsilane fabricated by self assembled technique on Copper surface part 1 design route and Corrosion resistance
    Corrosion Science, 2015
    Co-Authors: Yabin Wang, Zhong Liu, Yaping Dong
    Abstract:

    Abstract A novel design route for metal protection against Corrosion is proposed for the first time, which lies in assembling two or more categories of protective groups to produce brand-new compounds and fabricating the corresponding resistance structure by means of various techniques. A kind of triazinedithiolsilane compound has been successfully synthesized as protector for Copper by combining protective triazinedithiol and silane groups. The protective capability of the polymeric nanofilm prepared by heating the self-assembled monolayer (SAM) of the synthesized triazinedithiolsilane molecule was examined by electrochemical tests. The results show that the polymeric nanofilm significantly inhibits Copper Corrosion.

Hong Qun Luo - One of the best experts on this subject based on the ideXlab platform.

  • protection of Copper Corrosion in 0 5 m nacl solution by modification of 5 mercapto 3 phenyl 1 3 4 thiadiazole 2 thione potassium self assembled monolayer
    Corrosion Science, 2012
    Co-Authors: Wen Chen, Song Hong, Hong Qun Luo
    Abstract:

    Abstract 5-Mercapto-3-phenyl-1,3,4-thiadiazole-2-thione potassium (MPTT) self-assembled monolayer (SAM) on Copper surface has been investigated by FT-IR and contact angle (CA) and the results showed that MPTT was adsorbed on Copper surface and yielded a hydrophobic film. The inhibition effect of MPTT SAM on Copper Corrosion in 0.5 M NaCl solution was investigated by using electrochemical methods. The protection ability of SAM was found to depend on the MPTT concentration, assembly time and assembly temperature. Adsorption of MPTT on Copper surface follows the Langmuir isotherm. The quantum chemical calculations were conducted to correlate the adsorption mechanism with the structure of MPTT molecule.

  • Corrosion inhibition of Copper by 2 5 dimercapto 1 3 4 thiadiazole monolayer in acidic solution
    Corrosion Science, 2011
    Co-Authors: Ting Ting Qin, Hong Qun Luo
    Abstract:

    Abstract 2,5-Dimercapto-1,3,4-thiadiazole (DMTD) monolayer was self-assembled on the fresh Copper surface to form protective monolayer against Copper Corrosion in acidic solution. Its Corrosion inhibition was investigated in 0.5 M HCl by cyclic voltammetry, potentiodynamic polarization and electrochemical impedance spectroscopy methods. The results revealed that the DMTD monolayer inhibited the Copper Corrosion effectively with the optimum self-assembly time of 10 h and the optimum self-assembly concentration of 7.5 mM. Surface observation was performed using scanning electron microscope, contact angle goniometer and Fourier transform infrared spectrometer. The molecular simulation has been used to simulate the adsorption model of DMTD molecule on Cu(1 1 1) surface.

Marc Edwards - One of the best experts on this subject based on the ideXlab platform.

  • phosphate inhibition of soluble Copper Corrosion by product release
    Corrosion Science, 2002
    Co-Authors: Marc Edwards, Loay Hidmi, Dawn Gladwell
    Abstract:

    Copper Corrosion by-product release to potable water is a complex function of pipe age, water quality, stagnation time, and type of phosphate inhibitor. Moderate (≈1 mg/l as P) doses of polyphosphate or orthophosphate generally decreased Copper release in pipe rig tests of >3 years duration. The exception was pH 7.2 and alkalinity 300 mg/l as CaCO3, in which phosphate dosing significantly increased Copper release over long time periods by hindering the formation of relatively insoluble malachite scale. Dosing of polyphosphates, which is invariably a blend of orthophosphate and polyphosphate due to reversion, was not as beneficial as orthophosphate. These relative effects are consistent with expectations based on simplistic solubility models, in which Copper complexation by polyphosphate tends to increase soluble Copper release, whereas higher doses of orthophosphate tend to decrease Copper solubility.

  • role of aluminosilicate deposits in lead and Copper Corrosion
    Journal American Water Works Association, 2001
    Co-Authors: Steven Kvech, Marc Edwards
    Abstract:

    Aluminosilicates frequently deposit onto plumbing materials in distribution systems. Such solids were previously believed to provide some degree of Corrosion protection to pipes-although at the expense of increased head loss, reduced flow, and consumer complaints related to postprecipitation. However, this work demonstrates that new Copper and lead pipe sections did not benefit from the deposition of aluminosilicate solids. In fact, in most situations the presence of solids actually caused the release of more metal to drinking water compared with solutions without solids. Final pH played a key role in determining the extent of Copper Corrosion, and the aluminum deposits prevented increases in pH during stagnation through a buffering action.

  • role of temperature chlorine and organic matter in Copper Corrosion by product release in soft water
    Water Research, 2001
    Co-Authors: Nicolle Boulay, Marc Edwards
    Abstract:

    Abstract Soft, low alkalinity drinking waters tend to cause relatively high Copper Corrosion by-product release in plumbing systems. Long-term tests (6–8 months) in a synthetic, microbially stable soft tap water confirmed that lower pHs and higher temperatures increased Copper release to water. Soluble Copper release increased at lower temperature and lower pH. Low levels of free chlorine (0.7 mg/L) slightly increased Copper release at pH 9.5, in marked contrast to the dramatic reductions in Copper release that have been observed in soft waters in which Type III pitting Corrosion is occurring. Gum xanthan and sodium alginate produced a microbially unstable water that reduced the pH and DO during stagnation in pipes — these indirect effects far outweighed their possible role in chelation or other modes of direct attack on Copper surfaces.

  • organic matter and Copper Corrosion by product release a mechanistic study
    Corrosion Science, 2001
    Co-Authors: Marc Edwards, Nicolle Sprague
    Abstract:

    Abstract The adverse effects of natural organic matter on Copper Corrosion by-product release to drinking water result from soluble complex formation, colloid mobilization/dispersion, and interference with aging processes that tend to decrease scale solubility. Organic matter can also reverse Copper Corrosion by-product release to drinking water by (1) fueling microbial removal of oxygen, causing re-deposition of Cu(I) to the pipe wall, and (2) sorption of soluble organic matter onto pipe surfaces during stagnation, which decreases the solution’s complexation capacity for Copper.

  • alkalinity ph and Copper Corrosion by product release
    Journal American Water Works Association, 1996
    Co-Authors: Marc Edwards, Michael R Schock, Travis E Meyer
    Abstract:

    Contrary to expectations, higher bicarbonate concentrations exacerbate Copper Corrosion rates and by-product release. In fact, as illustrated by monitoring experiences of large utilities and by laboratory data, the concentration of Copper Corrosion by-products in drinking water increases linearly with bicarbonate concentration at constant pH. This relationship implicates cupric hydroxide solubility in control of Copper release from relatively new (less than a few years old) Copper plumbing. Decision-marking guidance from a traditional Larson`s ratio or Langelier index approach can aggravate Copper Corrosion problems; consequently, their use should be discontinued for Copper Corrosion mitigation. In contrast, aeration-CO{sub 2} stripping is a particularly attractive strategy because benefits from higher pH are realized without adverse effects from higher alkalinity.