The Experts below are selected from a list of 7554 Experts worldwide ranked by ideXlab platform
Masahiro Irie - One of the best experts on this subject based on the ideXlab platform.
-
Photoreductive Deposition of Palladium for Electroless Copper Plating
Chemistry Letters, 1992Co-Authors: Koji Kondo, Futoshi Ishikawa, Nobumasa Ishida, Masahiro IrieAbstract:Selective seeding of palladium catalysts on an alumina plate for electroless Copper Plating was made by photoirradiation. The adsorbed Pd(II)-tartrate were selectively converted to Pd(0) by photoir...
-
Photoreductive deposition of palladium for electroless Copper Plating
Chemistry Letters, 1992Co-Authors: Kondo Koji, Futoshi Ishikawa, Ishida Nobumasa, Masahiro IrieAbstract:Selective seeding of palladium catalysts on an alumina plate for electroless Copper Plating was made by photoirradiation. The adsorbed Pd(II)-tartrate were selectively converted to Pd(0) by photoirradiation and the photogenerated Pd(0) catalyzed the electroless Copper Plating.
-
Electroless Copper Plating in the Presence of Excess Triethanol Amine
Journal of The Electrochemical Society, 1990Co-Authors: Koji Kondo, O. Takenaka, J. Ishikawa, T. Matsubara, Masahiro IrieAbstract:EDTA, Rochelle salt, and their derivatives have been used so far as the ligand in electroless Copper Plating. Although these ligands are useful for high-quality Copper Plating, a serious drawback is the low deposition rate. In attempting to increase the rate, the authors searched for several ligands and found that excess TEA is effective for accelerating the rate. This paper reports on the effect of triethanol amine (TEA) on the deposition rate in electroless Copper Plating. The deposition rate initially increased with increasing concentration of TEA. The rate reached a maximum at a concentration of 0.18 M. After passing the maximum, the rate decreased with increasing concentration. The maximum rate was 20 times larger than the rate obtained when ethylenediaminetetraacetic acid (EDTA) was used as the ligand.
Li Ya-long - One of the best experts on this subject based on the ideXlab platform.
-
Electroless Copper Plating using sodium hypophosphite on cast iron
Journal of Shaanxi Normal University, 2010Co-Authors: Li Ya-longAbstract:The effect of Plating bath in composition,pH ,temperature,time and volume on the electroless plated Copper was studied. An alkaline electroless Copper Plating bath including Copper sulfate as main salt,sodium hypophosphite as reducing agent,EDTA and sodium citrate as blending chelating agent,was established. A continuous self-catalyzed deposition of bright red-yellow Copper coating on cast iron substrate was obtained successfully. Compared with traditional electro plated Copper from cyanide-based Plating,the electroless Copper Plating has a similar performence in the combination face to the substrate,better in brightness,and surface roughness of the electroless Copper Plating arrived at 8.
-
Electroless Copper Plating Using Sodium Hypophosphite as Reductant
Electroplating & Pollution Control, 2009Co-Authors: Li Ya-longAbstract:The process of the electroless Copper Plating using sodium hypophosphite as reductant was studied.An alkaline electroless Copper Plating bath with Copper sulfate as main salt,sodium hypophosphite as reducing agent,EDTA and sodium citrate as blending chelating agent,was established.A continuous self-catalyzed deposition of bright red-yellow Copper coating on cast iron substrate was obtained.
Yuan Shi-pu - One of the best experts on this subject based on the ideXlab platform.
-
Experience in self-making brighteners for acid Copper Plating and the formulations
Electroplating & Finishing, 2013Co-Authors: Yuan Shi-puAbstract:The advantages of self-making brighteners for acid Copper Plating were described. The problem and improvement of the simplest brightener formulation comprising M (2-mercaptobenzimidazole), N (ethylene thiourea), SP (sodium 3,3′-dithiobispropanesulfonate), and P (polyethylene glycol) were introduced. The formulation of a two-part brightener for acid Copper Plating was presented. The reasons for failure of self-making brighteners for acid Copper Plating were summarized.
-
Equipment configuration of bright acid Copper Plating—Part I
Electroplating & Finishing, 2010Co-Authors: Yuan Shi-puAbstract:The perfection and improvement of equipments and facilities often result in better effectiveness than the modification and treatment of Plating bath. The requirement of equipments for bright acid Copper Plating with sulfate bath is strict due to the specialties of the process. The equipment configuration for bright acid Copper Plating was discussed in detail based on the technological features of brightening agents used in different systems. In the first part of this paper, the selection of continuous filter and constanttemperature electric heater was described.
-
Advances in experimental study and production practice of cyanide-free Copper Plating——Part II
Electroplating & Finishing, 2009Co-Authors: Yuan Shi-puAbstract:The unfeasibility of dip Plating of Copper on iron and steel workpiece from a bright acid Copper sulfate bath and the features of acid Copper Plating process characterized by the combination of dip Plating with electrodeposition were analyzed. The latest progress in the studies of acid Copper brightener, iron and steel activation principle, and complexing agent for cyanide-free alkaline Copper Plating were introduced. It is pointed out that cyanide-free HEDP Copper Plating bath has chemical activation effect and pre-dipping can improve the adhesion of deposit to substrate.
Paul A Kohl - One of the best experts on this subject based on the ideXlab platform.
-
the acceleration of nonformaldehyde electroless Copper Plating
Journal of The Electrochemical Society, 2002Co-Authors: Jun Li, Paul A KohlAbstract:Nonformaldehyde, low pH (compared to highly alkaline bath) electroless Copper Plating has been investigated. Thiourea and its derivatives have been shown to increase the deposition rate of electroless Copper Plating solutions using HEDTA [N-(2-hydroxyethyl)ethylenediaminetriacetic acid trisodium salt hydrate] as the complexing agent and sodium hypophosphite as the reducing agent. A thiourea concentration of 1.0 ppm produced a fourfold increase in the deposition rate of Copper from about 1 to 4 μm/h. The effect of thiourea on the electrochemical reactions, and the crystal structures and electrical properties of the Copper deposits were examined. A small amount of thiourea, or its derivatives, in the electroless Copper solution improves the catalytic activity of the Copper surface for the oxidation of hypophosphite, resulting in a higher electroless deposition rate. The thiourea also increases the growth colony size of the Copper deposits and improves its conductivity. A reaction mechanism is proposed to describe the function of the thiourea and its derivatives on the process.
Guo Xueyi - One of the best experts on this subject based on the ideXlab platform.
-
Research progress on electroless Copper Plating
Electroplating & Finishing, 2007Co-Authors: Guo XueyiAbstract:In recent years,the status of electroless Copper Plating technique is rising constantly in surface treating industry,which is more and more extensive applied in several fields including electronics industry,mechanical industry,aerospace,etc.The investigation on the mechanism of electroless Copper Plating and process improvement have become one of the most interesting topics.In this paper,the general situation and the recent research progress of electroless Copper Plating were introduced.Some new advanced technologies were reviewed.The future research directions were presented.