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Jian Zhang - One of the best experts on this subject based on the ideXlab platform.

  • anisotropy of high temperature Creep Properties of a co base single crystal superalloy
    Materials Science and Engineering A-structural Materials Properties Microstructure and Processing, 2018
    Co-Authors: Y Lu, Dong Wang, Shaohua Zhang, W Zheng, Jian Shen, Jian Zhang
    Abstract:

    Abstract The orientation dependence of Creep Properties of a Co-base single crystal superalloy at 982 °C/248 MPa was investigated. The orientations of specimens tested were near [001, 011] and [111]. The results showed the deformation of these specimens was all controlled by a/3   slip and stacking faults. The specimens with orientation near [001] exhibited the best Creep resistance. There were a few stacking faults with two orientations in the specimens with [001] orientation. Specimens with orientations near [111] and [011] showed shorter Creep lives, and stacking faults with single orientation were observed.

  • effect of mo concentration on Creep Properties of a single crystal nickel base superalloy
    Materials Science and Engineering A-structural Materials Properties Microstructure and Processing, 2010
    Co-Authors: Jian Zhang, Jinguo Li, Zhuangqi Hu
    Abstract:

    The effect of Mo concentration on Creep Properties of a single crystal nickel-base superalloy has been studied at 1010 degrees C and 800 degrees C by using three kinds of alloys with 1%, 2% and 4% of Mo (wt.). The Creep Properties of alloys were measured and microstructure evolution was analyzed. The results showed that after heat treatment, all the three alloys were composed of gamma and gamma' phase without TCP phase precipitation. The increase of Mo concentration from 1 wt.% to 2 wt.% pronouncedly enhanced the Creep Properties. Compared with 1 wt.% Mo content, 2 wt.% Mo addition can generate denser gamma/gamma' interfacial dislocation networks during high temperature Creep test, thus lower minimum Creep rate. At medium temperature Creep condition, Mo addition enhanced Creep Properties by decreasing the stacking fault energy. When the Mo content reached to 4%, the over-saturation of Mo content in gamma phase led to the formation of p. phase precipitation which degraded the Creep Properties at both high and medium temperature Creep conditions. (C) 2010 Elsevier B.V. All rights reserved.

Zhuangqi Hu - One of the best experts on this subject based on the ideXlab platform.

  • effect of mo concentration on Creep Properties of a single crystal nickel base superalloy
    Materials Science and Engineering A-structural Materials Properties Microstructure and Processing, 2010
    Co-Authors: Jian Zhang, Jinguo Li, Zhuangqi Hu
    Abstract:

    The effect of Mo concentration on Creep Properties of a single crystal nickel-base superalloy has been studied at 1010 degrees C and 800 degrees C by using three kinds of alloys with 1%, 2% and 4% of Mo (wt.). The Creep Properties of alloys were measured and microstructure evolution was analyzed. The results showed that after heat treatment, all the three alloys were composed of gamma and gamma' phase without TCP phase precipitation. The increase of Mo concentration from 1 wt.% to 2 wt.% pronouncedly enhanced the Creep Properties. Compared with 1 wt.% Mo content, 2 wt.% Mo addition can generate denser gamma/gamma' interfacial dislocation networks during high temperature Creep test, thus lower minimum Creep rate. At medium temperature Creep condition, Mo addition enhanced Creep Properties by decreasing the stacking fault energy. When the Mo content reached to 4%, the over-saturation of Mo content in gamma phase led to the formation of p. phase precipitation which degraded the Creep Properties at both high and medium temperature Creep conditions. (C) 2010 Elsevier B.V. All rights reserved.

R Sahoo - One of the best experts on this subject based on the ideXlab platform.

T. K. Sahoo - One of the best experts on this subject based on the ideXlab platform.

Miaosen Yang - One of the best experts on this subject based on the ideXlab platform.

  • High temperature Creep Properties of low-Ag Cu/Sn-Ag-Cu-Bi-Ni/Cu solder joints by nanoindentation method
    Soldering & Surface Mount Technology, 2016
    Co-Authors: Xiangxia Kong, Miaosen Yang
    Abstract:

    Purpose This paper aims to investigate the Creep Properties of the bulks of low-Ag Cu/Sn-Ag-Cu-Bi-Ni/Cu micro solder joints from 298 to 358 K. The Creep constitutive modelling was developed. Meanwhile, the Creep mechanism of the bulks of Cu/Sn-Ag-Cu-Bi-Ni/Cu micro solder joints was discussed. Design/methodology/approach The Creep Properties of the bulks of low-Ag Cu/Sn-Ag-Cu-Bi-Ni/Cu micro solder joints from 298 to 358 K were investigated using the nanoindentation method. Findings The results of the experiments showed that the indentation depth and area increased with increasing temperatures. At the test temperature of 298-358 K, the Creep strain rate of the bulks of the micro solder joints increases with the rising of the tested temperature. The values of Creep stress exponent and activation energy calculated for the bulks of Cu/Sn-Ag-Cu-Bi-Ni/Cu micro solder joints were reasonably close to the published data. At the tested temperatures, dislocation climb took place and the dislocation climb motion was controlled by the dislocation pipe mechanism, and the second-phase particles enhancement mechanism played a very important role. Originality/value This study provides the Creep Properties of low-Ag Cu/Sn-Ag-Cu-Bi-Ni/Cu solder joints at different temperatures. The Creep constitutive modelling has been developed for low-Ag Cu/Sn-Ag-Cu-Bi-Ni/Cu solder joints.

  • High temperature Creep Properties of low-Ag Cu/Sn-Ag-Cu-Bi-Ni/Cu solder joints by nanoindentation method
    Soldering and Surface Mount Technology, 2016
    Co-Authors: Xiangxia Kong, F Sun, Miaosen Yang
    Abstract:

    © 2016 Emerald Group Publishing Limited. Purpose - This paper aims to investigate the Creep Properties of the bulks of low-Ag Cu/Sn-Ag-Cu-Bi-Ni/Cu micro solder joints from 298 to 358 K. The Creep constitutive modelling was developed. Meanwhile, the Creep mechanism of the bulks of Cu/Sn-Ag-Cu-Bi-Ni/Cu micro solder joints was discussed. Design/methodology/approach - The Creep Properties of the bulks of low-Ag Cu/Sn-Ag-Cu-Bi-Ni/Cu micro solder joints from 298 to 358 K were investigated using the nanoindentation method. Findings - The results of the experiments showed that the indentation depth and area increased with increasing temperatures. At the test temperature of 298-358 K, the Creep strain rate of the bulks of the micro solder joints increases with the rising of the tested temperature. The values of Creep stress exponent and activation energy calculated for the bulks of Cu/Sn-Ag-Cu-Bi-Ni/Cu micro solder joints were reasonably close to the published data. At the tested temperatures, dislocation climb took place and the dislocation climb motion was controlled by the dislocation pipe mechanism, and the second-phase particles enhancement mechanism played a very important role. Originality/value - This study provides the Creep Properties of low-Ag Cu/Sn-Ag-Cu-Bi-Ni/Cu solder joints at different temperatures. The Creep constitutive modelling has been developed for low-Ag Cu/Sn-Ag-Cu-Bi-Ni/Cu solder joints.