The Experts below are selected from a list of 12 Experts worldwide ranked by ideXlab platform
K.b. Unser - One of the best experts on this subject based on the ideXlab platform.
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Fast bunch-to-bunch current sampling in the Cornell electron-positron collider
Proceedings of International Conference on Particle Accelerators, 1993Co-Authors: C.r. Dunnam, K.b. UnserAbstract:Preliminary studies of a high resolution Cornell Electron-positron Storage Ring (CESR) bunch-to-bunch signal processing system are described. In these studies, a prototype inductive-integrating, sampling current monitor is evaluated for improved estimation of bunch lifetimes over a series of planned CESR luminosity upgrades. Initial test data indicate significant performance advantages over conventional electrostatic pickup systems in the areas of linearity, dynamic range and beam position sensitivity. Novel features of the fast bunch current monitor include its wideband passive integrating pickup, Diplex Filter section and high resolution bunch signal processor (BSP). Evaluation studies in CESR indicate this fast bunch monitor is potentially useful in colliders and other storage rings utilizing bunch-to-bunch or bunch train separations down to 80 nanoseconds. Proposed system revisions to permit fast, high resolution bunch train current measurements in future CESR operations are discussed. Commercial availability of several principal bunch-to-bunch current monitor components is noted.
Ralph Dr Oppelt - One of the best experts on this subject based on the ideXlab platform.
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Diplex Filter and method for Filtering signals
2008Co-Authors: Ralph Dr OppeltAbstract:The Diplex Filter has two impedance-Filter with separate transmission frequency ranges and with separate lock-frequency ranges and a connection node, are connected to said two longitudinal elements of the two Filters which are each configured as a parallel resonant circuit, wherein the respective parallel resonant circuit a predetermined reactance in a midband of having respective transmission frequency range and a parallel resonance in a band center of the respective cut-off frequency range. The present invention provides a simple and inexpensive manner, a Diplex Filter without ferrite-containing special components, such as inductively coupled coils or tapped coils, realized. This DiplexFilter the invention can be used for example in magnetic resonance imaging. Schematic diagrams of embodiments of the invention Diplex and associated transmission and reflection responses are given.
C.r. Dunnam - One of the best experts on this subject based on the ideXlab platform.
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Fast bunch-to-bunch current sampling in the Cornell electron-positron collider
Proceedings of International Conference on Particle Accelerators, 1993Co-Authors: C.r. Dunnam, K.b. UnserAbstract:Preliminary studies of a high resolution Cornell Electron-positron Storage Ring (CESR) bunch-to-bunch signal processing system are described. In these studies, a prototype inductive-integrating, sampling current monitor is evaluated for improved estimation of bunch lifetimes over a series of planned CESR luminosity upgrades. Initial test data indicate significant performance advantages over conventional electrostatic pickup systems in the areas of linearity, dynamic range and beam position sensitivity. Novel features of the fast bunch current monitor include its wideband passive integrating pickup, Diplex Filter section and high resolution bunch signal processor (BSP). Evaluation studies in CESR indicate this fast bunch monitor is potentially useful in colliders and other storage rings utilizing bunch-to-bunch or bunch train separations down to 80 nanoseconds. Proposed system revisions to permit fast, high resolution bunch train current measurements in future CESR operations are discussed. Commercial availability of several principal bunch-to-bunch current monitor components is noted.
W. Weekamp - One of the best experts on this subject based on the ideXlab platform.
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A new thin film passive integration technology for miniaturisation of mobile phone front end modules: integration of a dual-band power amplifier, switch and Diplexer for GSM
2000 IEEE MTT-S International Microwave Symposium Digest (Cat. No.00CH37017), 2000Co-Authors: A. De Graauw, C. Copetti, W. WeekampAbstract:The use of a new thin film substrate technology for integrating the critical passive parts of RF-circuits of mobile communication equipment is demonstrated. A very compact module that contains two power-amplifiers, two receive/transmit-switches and a Diplex-Filter for dual-band GSM mobile phone applications was designed, manufactured and tested in order to demonstrate the miniaturisation possibilities with this technology. With a size of 160 sq. mm, the module meets the GSM output power specifications (2 W at 900 MHz and 1 W at 1800 MHz) and the harmonic attenuation requirements. The realised insertion loss of less then 1.5 dB in the receive- and transmit chain together with a receive-transmit-isolation of over 20 dB is sufficient for most GSM applications.
A. De Graauw - One of the best experts on this subject based on the ideXlab platform.
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A new thin film passive integration technology for miniaturisation of mobile phone front end modules: integration of a dual-band power amplifier, switch and Diplexer for GSM
2000 IEEE MTT-S International Microwave Symposium Digest (Cat. No.00CH37017), 2000Co-Authors: A. De Graauw, C. Copetti, W. WeekampAbstract:The use of a new thin film substrate technology for integrating the critical passive parts of RF-circuits of mobile communication equipment is demonstrated. A very compact module that contains two power-amplifiers, two receive/transmit-switches and a Diplex-Filter for dual-band GSM mobile phone applications was designed, manufactured and tested in order to demonstrate the miniaturisation possibilities with this technology. With a size of 160 sq. mm, the module meets the GSM output power specifications (2 W at 900 MHz and 1 W at 1800 MHz) and the harmonic attenuation requirements. The realised insertion loss of less then 1.5 dB in the receive- and transmit chain together with a receive-transmit-isolation of over 20 dB is sufficient for most GSM applications.