The Experts below are selected from a list of 360 Experts worldwide ranked by ideXlab platform
Herman Jacobus Cornelis Voorwald - One of the best experts on this subject based on the ideXlab platform.
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Evaluation on fatigue strength of AISI 4340 steel aluminum coated by Electroplating and IVD processes
Journal of Materials Science, 2010Co-Authors: Herman Jacobus Cornelis Voorwald, Mauro Pedro Peres, Midori Yoshikawa Pitanga Costa, Maria Odila Hilário CioffiAbstract:In spite of toxicity, hydrogen embrittlement susceptibility, and environmental issues, cadmium Electroplating is usually applied on high strength AISI 4340 aeronautical steel due to its efficient protection against electrochemical corrosion. Ion vapor deposition (IVD) process with pure aluminum also offers good protection against corrosion with the advantages of decreasing hydrogen embrittlement susceptibility and improving the fatigue strength of metallic components. In this research, the effects of aluminum Electroplating and IVD aluminum coating on the rotating bending fatigue strength of AISI 4340 steel were evaluated in comparison with cadmium electroplated specimens. Experimental fatigue results showed that both aluminum Electroplating and IVD aluminum coatings are possible alternatives to cadmium Electroplating.
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effects of surface treatments on the fatigue strength of aisi 4340 aeronautical steel
International Journal of Fatigue, 2001Co-Authors: Marcelino P Nascimento, R C Souza, W L Pigatin, Herman Jacobus Cornelis VoorwaldAbstract:Abstract Internal residual stresses significantly influence the fatigue strength of coated materials. It is well known that chromium plating is the most used electrodeposited coating for important industrial applications. However, pressure to identify alternatives or to improve the chromium Electroplating process have increased in recent years, related to the reduction in fatigue strength of the base material and to environmental requirements. The high efficiency and fluoride free hard chromium Electroplating (here called “accelerated”) is an improvement to the conventional process. One environmentally safer and cleaner alternative to hard chromium plating is tungsten carbide thermal spray coating applied by the High Velocity Oxy-Fuel (HVOF) process. To increase the fatigue strength of chromium plated materials, coating thickness and microcracks density are important parameters to be controlled. Techniques as compressive residual stresses induced by shot peening and multilayers, are also used. The aim of this study was to analyse the effects on AISI 4340 steel, in the rotating bending fatigue behaviour, of the: tungsten carbide thermal spray coating applied by HP/HVOF process; chemical nickel underplate, and shot peening process applied before coating deposition, in comparison to hard chromium Electroplatings. Rotating bending fatigue test results indicate better performance for the conventional hard chromium plating in relation to the accelerated hard chromium Electroplating. Tungsten carbide thermal spray coating and accelerated hard chromium plate over nickel resulted in higher fatigue strength when compared to samples conventional or accelerated hard chromium plated. Shot peening showed to be an excellent alternative to increase fatigue strength of AISI 4340 steel hard chromium electroplated.
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effects of tungsten carbide thermal spray coating by hp hvof and hard chromium Electroplating on aisi 4340 high strength steel
Surface & Coatings Technology, 2001Co-Authors: Marcelino P Nascimento, Ivancy M Miguel, R C Souza, W L Pigatin, Herman Jacobus Cornelis VoorwaldAbstract:Abstract In cases of decorative and functional applications, chromium results in protection against wear and corrosion combined with chemical resistance and good lubricity. However, pressure to identify alternatives or to improve conventional chromium Electroplating mechanical characteristics has increased in recent years, related to the reduction in the fatigue strength of the base material and to environmental requirements. The high efficiency and fluoride-free hard chromium Electroplating is an improvement to the conventional process, considering chemical and physical final properties. One of the most interesting, environmentally safer and cleaner alternatives for the replacement of hard chrome plating is tungsten carbide thermal spray coating, applied by the high velocity oxy-fuel (HVOF) process. The aim of this study was to analyse the effects of the tungsten carbide thermal spray coating applied by the HP/HVOF process and of the high efficiency and fluoride-free hard chromium Electroplating (in the present paper called ‘accelerated’), in comparison to the conventional hard chromium Electroplating on the AISI 4340 high strength steel behaviour in fatigue, corrosion, and abrasive wear tests. The results showed that the coatings were damaging to the AISI 4340 steel behaviour when submitted to fatigue testing, with the tungsten carbide thermal spray coatings showing the better performance. Experimental data from abrasive wear tests were conclusive, indicating better results from the WC coating. Regarding corrosion by salt spray test, both coatings were completely corroded after 72 h exposure. Scanning electron microscopy technique (SEM) and optical microscopy were used to observe crack origin sites, thickness and adhesion in all the coatings and microcrack density in hard chromium Electroplatings, to aid in the results analysis.
Chengqiang Cui - One of the best experts on this subject based on the ideXlab platform.
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bis sodium sulfoethyl disulfide a promising accelerator for super conformal copper electrodeposition with wide operating concentration ranges
Journal of The Electrochemical Society, 2020Co-Authors: Baizhao Tan, Jiye Luo, Minghao Shi, Zhifeng Hao, Guannan Yang, Chengqiang CuiAbstract:Accelerators are indispensable additives for super-conformal copper electrodeposition, which has been widely applied in the fabrication of integrated circuits (ICs), printed circuit boards (PCBs), and advanced semiconductor packaging substrates. Currently, bis-(sodium sulfopropyl)-disulfide (SPS) and sodium 3-mercapto-1-propanesulfonate (MPS) are the most widely used accelerators for super-conformal Electroplating. However, owing to the limited operating concentration range, frequent measurements of the SPS (or MPS) concentration during the Electroplating process are needed to manage the accelerator concentration in a suitable range, which makes the application of SPS (or MPS) tedious and unreliable. In our previous study, bis-(sodium sulfoethyl)-disulfide (SES), which has a molecular structure that is similar to that of SPS but with shorter alkyl chains, was determined to be a weaker depolarizer than SPS. The weaker antagonistic effect against suppressor and leveler imply that the higher concentration of SES maybe applicable to achieve the super-conformal Electroplating. In this study, SES was investigated in detail, and it was found that in combination with Cl−, PEG, and JGB, the SES-containing electrolytes can provide the positive potential difference Δη, excellent microvia filling performance, and good copper deposition physical properties in a wide operating concentration range. SES is a promising accelerator for the super-conformal copper Electroplating.
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communication triphenylmethane based leveler for microvia filling in copper super conformal Electroplating
Journal of The Electrochemical Society, 2019Co-Authors: Jiye Luo, Baizhao Tan, Chengqiang Cui, Minghao Shi, Zhifeng HaoAbstract:Levelers exhibiting high microvia-filling power and wide operating-concentration ranges are required for the development of additives in copper super-conformal Electroplating. In this study, a novel structure based on triphenylmethane (TPM-1) was synthesized and investigated as a leveler for microvia-filling Electroplating. The galvanostatic measurements and cyclic voltammetry stripping experiments show that TPM-1 is a stronger inhibitor than Janus Green B for copper ion reduction and is essential in creating convection-dependent adsorption behavior. Copper Electroplating experiments were conducted, and TPM-1 showed superior microvia-filling performance at a relatively wide concentration range.
Zhifeng Hao - One of the best experts on this subject based on the ideXlab platform.
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bis sodium sulfoethyl disulfide a promising accelerator for super conformal copper electrodeposition with wide operating concentration ranges
Journal of The Electrochemical Society, 2020Co-Authors: Baizhao Tan, Jiye Luo, Minghao Shi, Zhifeng Hao, Guannan Yang, Chengqiang CuiAbstract:Accelerators are indispensable additives for super-conformal copper electrodeposition, which has been widely applied in the fabrication of integrated circuits (ICs), printed circuit boards (PCBs), and advanced semiconductor packaging substrates. Currently, bis-(sodium sulfopropyl)-disulfide (SPS) and sodium 3-mercapto-1-propanesulfonate (MPS) are the most widely used accelerators for super-conformal Electroplating. However, owing to the limited operating concentration range, frequent measurements of the SPS (or MPS) concentration during the Electroplating process are needed to manage the accelerator concentration in a suitable range, which makes the application of SPS (or MPS) tedious and unreliable. In our previous study, bis-(sodium sulfoethyl)-disulfide (SES), which has a molecular structure that is similar to that of SPS but with shorter alkyl chains, was determined to be a weaker depolarizer than SPS. The weaker antagonistic effect against suppressor and leveler imply that the higher concentration of SES maybe applicable to achieve the super-conformal Electroplating. In this study, SES was investigated in detail, and it was found that in combination with Cl−, PEG, and JGB, the SES-containing electrolytes can provide the positive potential difference Δη, excellent microvia filling performance, and good copper deposition physical properties in a wide operating concentration range. SES is a promising accelerator for the super-conformal copper Electroplating.
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communication triphenylmethane based leveler for microvia filling in copper super conformal Electroplating
Journal of The Electrochemical Society, 2019Co-Authors: Jiye Luo, Baizhao Tan, Chengqiang Cui, Minghao Shi, Zhifeng HaoAbstract:Levelers exhibiting high microvia-filling power and wide operating-concentration ranges are required for the development of additives in copper super-conformal Electroplating. In this study, a novel structure based on triphenylmethane (TPM-1) was synthesized and investigated as a leveler for microvia-filling Electroplating. The galvanostatic measurements and cyclic voltammetry stripping experiments show that TPM-1 is a stronger inhibitor than Janus Green B for copper ion reduction and is essential in creating convection-dependent adsorption behavior. Copper Electroplating experiments were conducted, and TPM-1 showed superior microvia-filling performance at a relatively wide concentration range.
F I Danilov - One of the best experts on this subject based on the ideXlab platform.
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unusual chemical mechanism of carbon co deposition in cr c alloy electrodeposition process from trivalent chromium bath
Electrochemistry Communications, 2012Co-Authors: V S Protsenko, V O Gordiienko, F I DanilovAbstract:Kinetics and mechanism of chromium-carbon alloy deposition process were investigated using trivalent chromium Electroplating bath containing formic acid and carbamide (urea). The rate of carbon co-deposition process is determined by the rate of chromium Electroplating reaction (electrochemical process of Cr-deposition imposes its own kinetics regularities on carbon co-deposition). It was supposed that a part of active chromium ad-atoms generated as a result of Cr(II) ions discharge may interact with adsorbed organic bath constituents by "chemical" mechanism.
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Unusual 'chemical' mechanism of carbon co-deposition in Cr-C alloy electrodeposition process from trivalent chromium bath
Elsevier, 2012Co-Authors: V S Protsenko, V O Gordiienko, F I DanilovAbstract:Kinetics and mechanism of chromium-carbon alloy deposition process were investigated using trivalent chromium Electroplating bath containing formic acid and carbamide (urea). The rate of carbon co-deposition process is determined by the rate of chromium Electroplating reaction (electrochemical process of Cr-deposition imposes its own kinetics regularities on carbon co-deposition). It was supposed that a part of active chromium ad-atoms generated as a result of Cr(II) ions discharge may interact with adsorbed organic bath constituents by ''chemical'' mechanism. Keywords: Chromium-carbon electrodeposition, Kinetics and mechanism, Trivalent chromium bat
Baizhao Tan - One of the best experts on this subject based on the ideXlab platform.
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bis sodium sulfoethyl disulfide a promising accelerator for super conformal copper electrodeposition with wide operating concentration ranges
Journal of The Electrochemical Society, 2020Co-Authors: Baizhao Tan, Jiye Luo, Minghao Shi, Zhifeng Hao, Guannan Yang, Chengqiang CuiAbstract:Accelerators are indispensable additives for super-conformal copper electrodeposition, which has been widely applied in the fabrication of integrated circuits (ICs), printed circuit boards (PCBs), and advanced semiconductor packaging substrates. Currently, bis-(sodium sulfopropyl)-disulfide (SPS) and sodium 3-mercapto-1-propanesulfonate (MPS) are the most widely used accelerators for super-conformal Electroplating. However, owing to the limited operating concentration range, frequent measurements of the SPS (or MPS) concentration during the Electroplating process are needed to manage the accelerator concentration in a suitable range, which makes the application of SPS (or MPS) tedious and unreliable. In our previous study, bis-(sodium sulfoethyl)-disulfide (SES), which has a molecular structure that is similar to that of SPS but with shorter alkyl chains, was determined to be a weaker depolarizer than SPS. The weaker antagonistic effect against suppressor and leveler imply that the higher concentration of SES maybe applicable to achieve the super-conformal Electroplating. In this study, SES was investigated in detail, and it was found that in combination with Cl−, PEG, and JGB, the SES-containing electrolytes can provide the positive potential difference Δη, excellent microvia filling performance, and good copper deposition physical properties in a wide operating concentration range. SES is a promising accelerator for the super-conformal copper Electroplating.
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communication triphenylmethane based leveler for microvia filling in copper super conformal Electroplating
Journal of The Electrochemical Society, 2019Co-Authors: Jiye Luo, Baizhao Tan, Chengqiang Cui, Minghao Shi, Zhifeng HaoAbstract:Levelers exhibiting high microvia-filling power and wide operating-concentration ranges are required for the development of additives in copper super-conformal Electroplating. In this study, a novel structure based on triphenylmethane (TPM-1) was synthesized and investigated as a leveler for microvia-filling Electroplating. The galvanostatic measurements and cyclic voltammetry stripping experiments show that TPM-1 is a stronger inhibitor than Janus Green B for copper ion reduction and is essential in creating convection-dependent adsorption behavior. Copper Electroplating experiments were conducted, and TPM-1 showed superior microvia-filling performance at a relatively wide concentration range.
