The Experts below are selected from a list of 19062 Experts worldwide ranked by ideXlab platform
Ray T. Chen - One of the best experts on this subject based on the ideXlab platform.
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fully Embedded Board level optical interconnects from waveguide fabrication to device integration
Journal of Lightwave Technology, 2008Co-Authors: Xiaolong Wang, Li Wang, Wei Jiang, Hai Bi, Ray T. ChenAbstract:This paper presents the latest progress toward fully Embedded Board-level optical interconnects in the aspect of waveguide fabrication and device integration. A one-step pattern transfer method is used to form a large cross-section multimode waveguide array with 45deg micromirrors by silicon hard molding method. Optimized by a novel spin-coating surface smoothing method for the master mold, the waveguide propagation loss is reduced to 0.09 dB/cm. The coupling efficiency of the metal-coated reflecting mirror, which is Embedded in the thin-film waveguide, is simulated by an M2 factor revised Gaussian beam method and is experimentally measured to be 85%. The active optoelectronic devices, vertical surface emitter lasers and p-i-n photodiodes, are integrated with the mirror-ended waveguide array and successfully demonstrate a 10 Gbps signal transmission over the embeddable optical layer.
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fully Embedded Board level optical interconnects from point to point interconnection to optical bus architecture
Proceedings of SPIE the International Society for Optical Engineering, 2008Co-Authors: Xiaolong Wang, Ray T. ChenAbstract:This paper presents the latest progress toward fully Embedded Board level optical interconnects in the aspect of optical bus architecture design, waveguide fabrication and device integration. A bidirectional optical bus architecture is designed and can be fabricated by a one-step pattern transfer method, which can form a large cross section multimode waveguide array with 45° micro-mirrors by silicon hard molding method. The waveguide propagation loss is reduced to 0.09dB/cm and the coupling efficiency of the metal-coated reflecting mirror is experimentally measured to be 85%. The active optoelectronic devices, vertical surface emitter lasers and p-i-n photodiodes, are integrated with the mirror-ended waveguide array, and successfully demonstrate a 10 Gbps signal transmission over the embeddable optical layer.
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Flexible optical waveguide film fabrications and optoelectronic devices integration for fully Embedded Board-level optical interconnects
Journal of Lightwave Technology, 2004Co-Authors: Chulchae Choi, Jerry Magera, David De Haas, Yujie Liu, Jinho Choi, Li Wang, Ray T. ChenAbstract:This paper demonstrates a flexible optical waveguide film with integrated optoelectronic devices (vertical-cavity surface-emitting laser (VCSEL) and p-i-n photodiode arrays) for fully Embedded Board-level optical interconnects. The optical waveguide circuit with 45° micromirror couplers was fabricated on a thin flexible polymeric substrate by soft molding. The 45° couplers were fabricated by cutting the waveguide with a microtome blade. The waveguide core material was SU-8 photoresist, and the cladding was cycloolefin copolymer. A thin VCSEL and p-i-n photodiode array were directly integrated on the waveguide film. Measured propagation loss of a waveguide was 0.6 dB/cm at 850 nm.
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fully Embedded Board level guided wave optoelectronic interconnects
Proceedings of the IEEE, 2000Co-Authors: Ray T. Chen, Chulchae Choi, Bipin Bihari, Linghui Wu, Suning Tang, Randy W Wickman, B Picor, M K Hibbbrenner, J BristowAbstract:A fully Embedded Board-level guided-wave optical interconnection is presented to solve the packaging compatibility problem. All elements involved in providing high-speed optical communications within one Board are demonstrated. Experimental results on a 12-channel linear array of thin-film polyimide waveguides, vertical-cavity surface-emitting lasers (VCSELs) (42 /spl mu/m), and silicon MSM photodetectors (10 /spl mu/m) suitable for a fully Embedded implementation are provided. Two types of waveguide couplers, titled gratings and 45/spl deg/ total internal reflection mirrors, are fabricated within the polyimide waveguides. Thirty-five to near 100% coupling efficiencies are experimentally confirmed. By doing so, all the real estate of the PC Board surface are occupied by electronics, and therefore one only observes the performance enhancement due to the employment of optical interconnection but does not worry about the interface problem between electronic and optoelectronic components unlike conventional approaches. A high speed 1-48 optical clock signal distribution network for Cray T-90 super computer is demonstrated. A waveguide propagation loss of 0.21 dB/cm at 850 nm was experimentally confirmed for the 1-48 clock signal distribution and for point-to-point interconnects. The feasibility of using polyimide as the interlayer dielectric material to form hybrid three-dimensional interconnects is also demonstrated. Finally, a waveguide bus architecture is presented, which provides a realistic bidirectional broadcasting transmission of optical signals. Such a structure is equivalent to such IEEE standard bus protocols as VME bus and FutureBus.
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fully Embedded Board level guided wave optoelectronic interconnects
Proceedings of the IEEE, 2000Co-Authors: Ray T. Chen, Chulchae Choi, Bipin Bihari, Suning Tang, Randy W Wickman, B Picor, M K Hibbbrenner, Lei Lin, Ying Liu, J BristowAbstract:A fully Embedded Board-level guided-wave optical interconnection is presented to solve the packaging compatibility problem. All elements involved in providing high-speed optical communications within one Board are demonstrated. Experimental results on a 12-channel linear array of thin-film polyimide waveguides, vertical-cavity surface-emitting lasers (VCSELs) (42 /spl mu/m), and silicon MSM photodetectors (10 /spl mu/m) suitable for a fully Embedded implementation are provided. Two types of waveguide couplers, titled gratings and 45/spl deg/ total internal reflection mirrors, are fabricated within the polyimide waveguides. Thirty-five to near 100% coupling efficiencies are experimentally confirmed. By doing so, all the real estate of the PC Board surface are occupied by electronics, and therefore one only observes the performance enhancement due to the employment of optical interconnection but does not worry about the interface problem between electronic and optoelectronic components unlike conventional approaches. A high speed 1-48 optical clock signal distribution network for Cray T-90 super computer is demonstrated. A waveguide propagation loss of 0.21 dB/cm at 850 nm was experimentally confirmed for the 1-48 clock signal distribution and for point-to-point interconnects. The feasibility of using polyimide as the interlayer dielectric material to form hybrid three-dimensional interconnects is also demonstrated. Finally, a waveguide bus architecture is presented, which provides a realistic bidirectional broadcasting transmission of optical signals. Such a structure is equivalent to such IEEE standard bus protocols as VME bus and FutureBus.
Chulchae Choi - One of the best experts on this subject based on the ideXlab platform.
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Flexible optical waveguide film fabrications and optoelectronic devices integration for fully Embedded Board-level optical interconnects
Journal of Lightwave Technology, 2004Co-Authors: Chulchae Choi, Jerry Magera, David De Haas, Yujie Liu, Jinho Choi, Li Wang, Ray T. ChenAbstract:This paper demonstrates a flexible optical waveguide film with integrated optoelectronic devices (vertical-cavity surface-emitting laser (VCSEL) and p-i-n photodiode arrays) for fully Embedded Board-level optical interconnects. The optical waveguide circuit with 45° micromirror couplers was fabricated on a thin flexible polymeric substrate by soft molding. The 45° couplers were fabricated by cutting the waveguide with a microtome blade. The waveguide core material was SU-8 photoresist, and the cladding was cycloolefin copolymer. A thin VCSEL and p-i-n photodiode array were directly integrated on the waveguide film. Measured propagation loss of a waveguide was 0.6 dB/cm at 850 nm.
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fully Embedded Board level guided wave optoelectronic interconnects
Proceedings of the IEEE, 2000Co-Authors: Ray T. Chen, Chulchae Choi, Bipin Bihari, Linghui Wu, Suning Tang, Randy W Wickman, B Picor, M K Hibbbrenner, J BristowAbstract:A fully Embedded Board-level guided-wave optical interconnection is presented to solve the packaging compatibility problem. All elements involved in providing high-speed optical communications within one Board are demonstrated. Experimental results on a 12-channel linear array of thin-film polyimide waveguides, vertical-cavity surface-emitting lasers (VCSELs) (42 /spl mu/m), and silicon MSM photodetectors (10 /spl mu/m) suitable for a fully Embedded implementation are provided. Two types of waveguide couplers, titled gratings and 45/spl deg/ total internal reflection mirrors, are fabricated within the polyimide waveguides. Thirty-five to near 100% coupling efficiencies are experimentally confirmed. By doing so, all the real estate of the PC Board surface are occupied by electronics, and therefore one only observes the performance enhancement due to the employment of optical interconnection but does not worry about the interface problem between electronic and optoelectronic components unlike conventional approaches. A high speed 1-48 optical clock signal distribution network for Cray T-90 super computer is demonstrated. A waveguide propagation loss of 0.21 dB/cm at 850 nm was experimentally confirmed for the 1-48 clock signal distribution and for point-to-point interconnects. The feasibility of using polyimide as the interlayer dielectric material to form hybrid three-dimensional interconnects is also demonstrated. Finally, a waveguide bus architecture is presented, which provides a realistic bidirectional broadcasting transmission of optical signals. Such a structure is equivalent to such IEEE standard bus protocols as VME bus and FutureBus.
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fully Embedded Board level guided wave optoelectronic interconnects
Proceedings of the IEEE, 2000Co-Authors: Ray T. Chen, Chulchae Choi, Bipin Bihari, Suning Tang, Randy W Wickman, B Picor, M K Hibbbrenner, Lei Lin, Ying Liu, J BristowAbstract:A fully Embedded Board-level guided-wave optical interconnection is presented to solve the packaging compatibility problem. All elements involved in providing high-speed optical communications within one Board are demonstrated. Experimental results on a 12-channel linear array of thin-film polyimide waveguides, vertical-cavity surface-emitting lasers (VCSELs) (42 /spl mu/m), and silicon MSM photodetectors (10 /spl mu/m) suitable for a fully Embedded implementation are provided. Two types of waveguide couplers, titled gratings and 45/spl deg/ total internal reflection mirrors, are fabricated within the polyimide waveguides. Thirty-five to near 100% coupling efficiencies are experimentally confirmed. By doing so, all the real estate of the PC Board surface are occupied by electronics, and therefore one only observes the performance enhancement due to the employment of optical interconnection but does not worry about the interface problem between electronic and optoelectronic components unlike conventional approaches. A high speed 1-48 optical clock signal distribution network for Cray T-90 super computer is demonstrated. A waveguide propagation loss of 0.21 dB/cm at 850 nm was experimentally confirmed for the 1-48 clock signal distribution and for point-to-point interconnects. The feasibility of using polyimide as the interlayer dielectric material to form hybrid three-dimensional interconnects is also demonstrated. Finally, a waveguide bus architecture is presented, which provides a realistic bidirectional broadcasting transmission of optical signals. Such a structure is equivalent to such IEEE standard bus protocols as VME bus and FutureBus.
J Bristow - One of the best experts on this subject based on the ideXlab platform.
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fully Embedded Board level guided wave optoelectronic interconnects
Proceedings of the IEEE, 2000Co-Authors: Ray T. Chen, Chulchae Choi, Bipin Bihari, Linghui Wu, Suning Tang, Randy W Wickman, B Picor, M K Hibbbrenner, J BristowAbstract:A fully Embedded Board-level guided-wave optical interconnection is presented to solve the packaging compatibility problem. All elements involved in providing high-speed optical communications within one Board are demonstrated. Experimental results on a 12-channel linear array of thin-film polyimide waveguides, vertical-cavity surface-emitting lasers (VCSELs) (42 /spl mu/m), and silicon MSM photodetectors (10 /spl mu/m) suitable for a fully Embedded implementation are provided. Two types of waveguide couplers, titled gratings and 45/spl deg/ total internal reflection mirrors, are fabricated within the polyimide waveguides. Thirty-five to near 100% coupling efficiencies are experimentally confirmed. By doing so, all the real estate of the PC Board surface are occupied by electronics, and therefore one only observes the performance enhancement due to the employment of optical interconnection but does not worry about the interface problem between electronic and optoelectronic components unlike conventional approaches. A high speed 1-48 optical clock signal distribution network for Cray T-90 super computer is demonstrated. A waveguide propagation loss of 0.21 dB/cm at 850 nm was experimentally confirmed for the 1-48 clock signal distribution and for point-to-point interconnects. The feasibility of using polyimide as the interlayer dielectric material to form hybrid three-dimensional interconnects is also demonstrated. Finally, a waveguide bus architecture is presented, which provides a realistic bidirectional broadcasting transmission of optical signals. Such a structure is equivalent to such IEEE standard bus protocols as VME bus and FutureBus.
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fully Embedded Board level guided wave optoelectronic interconnects
Proceedings of the IEEE, 2000Co-Authors: Ray T. Chen, Chulchae Choi, Bipin Bihari, Suning Tang, Randy W Wickman, B Picor, M K Hibbbrenner, Lei Lin, Ying Liu, J BristowAbstract:A fully Embedded Board-level guided-wave optical interconnection is presented to solve the packaging compatibility problem. All elements involved in providing high-speed optical communications within one Board are demonstrated. Experimental results on a 12-channel linear array of thin-film polyimide waveguides, vertical-cavity surface-emitting lasers (VCSELs) (42 /spl mu/m), and silicon MSM photodetectors (10 /spl mu/m) suitable for a fully Embedded implementation are provided. Two types of waveguide couplers, titled gratings and 45/spl deg/ total internal reflection mirrors, are fabricated within the polyimide waveguides. Thirty-five to near 100% coupling efficiencies are experimentally confirmed. By doing so, all the real estate of the PC Board surface are occupied by electronics, and therefore one only observes the performance enhancement due to the employment of optical interconnection but does not worry about the interface problem between electronic and optoelectronic components unlike conventional approaches. A high speed 1-48 optical clock signal distribution network for Cray T-90 super computer is demonstrated. A waveguide propagation loss of 0.21 dB/cm at 850 nm was experimentally confirmed for the 1-48 clock signal distribution and for point-to-point interconnects. The feasibility of using polyimide as the interlayer dielectric material to form hybrid three-dimensional interconnects is also demonstrated. Finally, a waveguide bus architecture is presented, which provides a realistic bidirectional broadcasting transmission of optical signals. Such a structure is equivalent to such IEEE standard bus protocols as VME bus and FutureBus.
Li Wang - One of the best experts on this subject based on the ideXlab platform.
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fully Embedded Board level optical interconnects from waveguide fabrication to device integration
Journal of Lightwave Technology, 2008Co-Authors: Xiaolong Wang, Li Wang, Wei Jiang, Hai Bi, Ray T. ChenAbstract:This paper presents the latest progress toward fully Embedded Board-level optical interconnects in the aspect of waveguide fabrication and device integration. A one-step pattern transfer method is used to form a large cross-section multimode waveguide array with 45deg micromirrors by silicon hard molding method. Optimized by a novel spin-coating surface smoothing method for the master mold, the waveguide propagation loss is reduced to 0.09 dB/cm. The coupling efficiency of the metal-coated reflecting mirror, which is Embedded in the thin-film waveguide, is simulated by an M2 factor revised Gaussian beam method and is experimentally measured to be 85%. The active optoelectronic devices, vertical surface emitter lasers and p-i-n photodiodes, are integrated with the mirror-ended waveguide array and successfully demonstrate a 10 Gbps signal transmission over the embeddable optical layer.
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Flexible optical waveguide film fabrications and optoelectronic devices integration for fully Embedded Board-level optical interconnects
Journal of Lightwave Technology, 2004Co-Authors: Chulchae Choi, Jerry Magera, David De Haas, Yujie Liu, Jinho Choi, Li Wang, Ray T. ChenAbstract:This paper demonstrates a flexible optical waveguide film with integrated optoelectronic devices (vertical-cavity surface-emitting laser (VCSEL) and p-i-n photodiode arrays) for fully Embedded Board-level optical interconnects. The optical waveguide circuit with 45° micromirror couplers was fabricated on a thin flexible polymeric substrate by soft molding. The 45° couplers were fabricated by cutting the waveguide with a microtome blade. The waveguide core material was SU-8 photoresist, and the cladding was cycloolefin copolymer. A thin VCSEL and p-i-n photodiode array were directly integrated on the waveguide film. Measured propagation loss of a waveguide was 0.6 dB/cm at 850 nm.
Xiaolong Wang - One of the best experts on this subject based on the ideXlab platform.
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fully Embedded Board level optical interconnects from waveguide fabrication to device integration
Journal of Lightwave Technology, 2008Co-Authors: Xiaolong Wang, Li Wang, Wei Jiang, Hai Bi, Ray T. ChenAbstract:This paper presents the latest progress toward fully Embedded Board-level optical interconnects in the aspect of waveguide fabrication and device integration. A one-step pattern transfer method is used to form a large cross-section multimode waveguide array with 45deg micromirrors by silicon hard molding method. Optimized by a novel spin-coating surface smoothing method for the master mold, the waveguide propagation loss is reduced to 0.09 dB/cm. The coupling efficiency of the metal-coated reflecting mirror, which is Embedded in the thin-film waveguide, is simulated by an M2 factor revised Gaussian beam method and is experimentally measured to be 85%. The active optoelectronic devices, vertical surface emitter lasers and p-i-n photodiodes, are integrated with the mirror-ended waveguide array and successfully demonstrate a 10 Gbps signal transmission over the embeddable optical layer.
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fully Embedded Board level optical interconnects from point to point interconnection to optical bus architecture
Proceedings of SPIE the International Society for Optical Engineering, 2008Co-Authors: Xiaolong Wang, Ray T. ChenAbstract:This paper presents the latest progress toward fully Embedded Board level optical interconnects in the aspect of optical bus architecture design, waveguide fabrication and device integration. A bidirectional optical bus architecture is designed and can be fabricated by a one-step pattern transfer method, which can form a large cross section multimode waveguide array with 45° micro-mirrors by silicon hard molding method. The waveguide propagation loss is reduced to 0.09dB/cm and the coupling efficiency of the metal-coated reflecting mirror is experimentally measured to be 85%. The active optoelectronic devices, vertical surface emitter lasers and p-i-n photodiodes, are integrated with the mirror-ended waveguide array, and successfully demonstrate a 10 Gbps signal transmission over the embeddable optical layer.