The Experts below are selected from a list of 582687 Experts worldwide ranked by ideXlab platform
C.l. Henderson - One of the best experts on this subject based on the ideXlab platform.
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IC Failure Analysis: magic, mystery, and science
IEEE Design & Test of Computers, 1997Co-Authors: Jerry M. Soden, R.e. Anderson, C.l. HendersonAbstract:Advancing IC and packaging technologies motivate and direct the future of Failure Analysis. The authors review current tools and techniques and discuss challenges and opportunities created by the industry's critical need for new diagnosis and Failure Analysis paradigms.
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Future technology challenges for Failure Analysis
1995Co-Authors: R.e. Anderson, Jerry M. Soden, C.l. HendersonAbstract:Failure Analysis is a critical element in the integrated circuit manufacturing industry. This paper explores the challenges for IC Failure Analysis in the environment of present and future silicon IC technology trends, using the 1994 National Technology Roadmap for Semiconductors as a technology guide. Advanced Failure Analysis techniques that meet the challenges of state-of-the-art IC technology are described and their applications are discussed. New paradigms will be required for Failure Analysis to keep pace with future advancements in IC technology.
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Failure Analysis: Status and future trends
1995Co-Authors: R.e. Anderson, Jerry M. Soden, C.l. HendersonAbstract:Failure Analysis is a critical element in the integrated circuit manufacturing industry. This paper reviews the changing role of Failure Analysis and describes major techniques employed in the industry today. Several advanced Failure Analysis techniques that meet the challenges imposed by advancements in integrated circuit technology are described and their applications are discussed. Future trends in Failure Analysis needed to keep pace with the continuing advancements in integrated circuit technology are anticipated.
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Challenges for IC Failure Analysis-present and future
Proceedings of 5th International Symposium on the Physical and Failure Analysis of Integrated Circuits, 1Co-Authors: R.e. Anderson, Jerry M. Soden, C.l. Henderson, Edward I. ColeAbstract:Failure Analysis is a critical element in integrated circuit manufacturing. This paper explores the challenges for IC Failure Analysis in the environment of present and future silicon IC technology trends, using the 1994 National Technology Roadmap for Semiconductors as a technology guide. Advanced techniques that meet the challenges of state-of-the-art IC technology are described and their applications are discussed. New approaches shall be required for Failure Analysis to keep pace with future advancements in IC technology.
R.e. Anderson - One of the best experts on this subject based on the ideXlab platform.
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IC Failure Analysis: magic, mystery, and science
IEEE Design & Test of Computers, 1997Co-Authors: Jerry M. Soden, R.e. Anderson, C.l. HendersonAbstract:Advancing IC and packaging technologies motivate and direct the future of Failure Analysis. The authors review current tools and techniques and discuss challenges and opportunities created by the industry's critical need for new diagnosis and Failure Analysis paradigms.
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Future technology challenges for Failure Analysis
1995Co-Authors: R.e. Anderson, Jerry M. Soden, C.l. HendersonAbstract:Failure Analysis is a critical element in the integrated circuit manufacturing industry. This paper explores the challenges for IC Failure Analysis in the environment of present and future silicon IC technology trends, using the 1994 National Technology Roadmap for Semiconductors as a technology guide. Advanced Failure Analysis techniques that meet the challenges of state-of-the-art IC technology are described and their applications are discussed. New paradigms will be required for Failure Analysis to keep pace with future advancements in IC technology.
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Failure Analysis: Status and future trends
1995Co-Authors: R.e. Anderson, Jerry M. Soden, C.l. HendersonAbstract:Failure Analysis is a critical element in the integrated circuit manufacturing industry. This paper reviews the changing role of Failure Analysis and describes major techniques employed in the industry today. Several advanced Failure Analysis techniques that meet the challenges imposed by advancements in integrated circuit technology are described and their applications are discussed. Future trends in Failure Analysis needed to keep pace with the continuing advancements in integrated circuit technology are anticipated.
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Challenges for IC Failure Analysis-present and future
Proceedings of 5th International Symposium on the Physical and Failure Analysis of Integrated Circuits, 1Co-Authors: R.e. Anderson, Jerry M. Soden, C.l. Henderson, Edward I. ColeAbstract:Failure Analysis is a critical element in integrated circuit manufacturing. This paper explores the challenges for IC Failure Analysis in the environment of present and future silicon IC technology trends, using the 1994 National Technology Roadmap for Semiconductors as a technology guide. Advanced techniques that meet the challenges of state-of-the-art IC technology are described and their applications are discussed. New approaches shall be required for Failure Analysis to keep pace with future advancements in IC technology.
Jerry M. Soden - One of the best experts on this subject based on the ideXlab platform.
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IC Failure Analysis: magic, mystery, and science
IEEE Design & Test of Computers, 1997Co-Authors: Jerry M. Soden, R.e. Anderson, C.l. HendersonAbstract:Advancing IC and packaging technologies motivate and direct the future of Failure Analysis. The authors review current tools and techniques and discuss challenges and opportunities created by the industry's critical need for new diagnosis and Failure Analysis paradigms.
-
Future technology challenges for Failure Analysis
1995Co-Authors: R.e. Anderson, Jerry M. Soden, C.l. HendersonAbstract:Failure Analysis is a critical element in the integrated circuit manufacturing industry. This paper explores the challenges for IC Failure Analysis in the environment of present and future silicon IC technology trends, using the 1994 National Technology Roadmap for Semiconductors as a technology guide. Advanced Failure Analysis techniques that meet the challenges of state-of-the-art IC technology are described and their applications are discussed. New paradigms will be required for Failure Analysis to keep pace with future advancements in IC technology.
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Failure Analysis: Status and future trends
1995Co-Authors: R.e. Anderson, Jerry M. Soden, C.l. HendersonAbstract:Failure Analysis is a critical element in the integrated circuit manufacturing industry. This paper reviews the changing role of Failure Analysis and describes major techniques employed in the industry today. Several advanced Failure Analysis techniques that meet the challenges imposed by advancements in integrated circuit technology are described and their applications are discussed. Future trends in Failure Analysis needed to keep pace with the continuing advancements in integrated circuit technology are anticipated.
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Challenges for IC Failure Analysis-present and future
Proceedings of 5th International Symposium on the Physical and Failure Analysis of Integrated Circuits, 1Co-Authors: R.e. Anderson, Jerry M. Soden, C.l. Henderson, Edward I. ColeAbstract:Failure Analysis is a critical element in integrated circuit manufacturing. This paper explores the challenges for IC Failure Analysis in the environment of present and future silicon IC technology trends, using the 1994 National Technology Roadmap for Semiconductors as a technology guide. Advanced techniques that meet the challenges of state-of-the-art IC technology are described and their applications are discussed. New approaches shall be required for Failure Analysis to keep pace with future advancements in IC technology.
Sreehari P. Nair - One of the best experts on this subject based on the ideXlab platform.
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Role of Fracture Mechanics in Failure Analysis
Materials Today: Proceedings, 2018Co-Authors: G. Manoj Reddy, S. Arunkumar, R. Harikrishnan, Sreehari P. NairAbstract:Abstract Failure Analysis is a serious procedure in determining the source of the problem. An important aspect in Failure Analysis is that, one must have an unbiased and open mind while assessing the evidence with a view to isolate the primary reason for Failure. To accomplish this, Failure Analysis invokes many fields of engineering. Of all fracture mechanics is one of the best technology used for predicting and preventing the Failure. In this article, the role of fracture mechanics in Failure Analysis is discussed. In this connection, the questions that fracture mechanics can answer in finding the root cause of the Failure is substantiated with 13 case studies. After briefly introducing the subject, fracture mechanics, its approaches and associated fracture parameters are discussed. This would provide necessary background for the reader in appreciating the role of fracture mechanics in examining the Failure
Uwe Zerbst - One of the best experts on this subject based on the ideXlab platform.
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Fracture mechanics in Failure Analysis
2016Co-Authors: Uwe ZerbstAbstract:Starting from an introduction into important Basic questions of Failure Analysis and fracture mechanics, the author specifies what kind of questions in Failure Analysis can be effectively solved by fracture mechanics (and which can't). He illustrates his discussion with a number of case studies. Much more pronounced than in the design stage the benefit of fracture mechanics in Failure Analysis depends on ist accuracy. This is limited by both, intrinsic factors of the method and the availability and quality of the input information. The author discusses the various aspects and provides the participants with background information helpful for better understanding the prospects and limitations of fracture mechanics in Failure Analysis and the conditions of its application.
