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Jian Yang - One of the best experts on this subject based on the ideXlab platform.
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investigation on wetting behavior and mechanism of agcu xwt ti Filler Metal aln ceramic reactive wetting system experiments and first principles calculations
Journal of Alloys and Compounds, 2021Co-Authors: Yue Zhao, Jian Yang, Jihua Huang, Shuhai ChenAbstract:Abstract The wetting behavior and mechanism of AgCu-Xwt.%Ti Filler Metal on AlN ceramic were investigated using experiments and first-principles calculations. The results indicate that the interfacial ideal adhesion work of wetting interface after interfacial chemical reaction is a crucial factor influencing the wettability of AgCu-Xwt.%Ti/AlN wetting system. This factor is controlled by the interfacial bonding characteristic. AgCu/AlN ceramic is a non-reactive wetting system, which has poor wettability with a contact angle of 22.9°. When 1.5 wt.% of active element [Ti] is added in AgCuTi Filler Metal, interfacial chemical reaction occurs, producing TiN. Therefore, the wetting interface is composed of AgCu-1.5wt.%Ti Filler Metal after chemical reaction and TiN (ACTi-1/TiN interface), which exhibits a large interfacial ideal adhesion work of 9.908 J/m2, leading to a small contact angle of 11.7°. When Ti content increases to 3.0 wt.%, the ionic bonding strength of wetting interface, composed by AgCu-3.0wt.%Ti Filler Metal after chemical reaction and TiN (ACTi-2/TiN interface), becomes stronger than that of ACTi-1/TiN interface owing to the increasing residual Ti content. Consequently, the interfacial ideal adhesion work further increases to 9.711 J/m2, and a decreasing contact angle of 8.2° is achieved. However, when Ti content reaches to 4.5 wt.%, although residual Ti content in AgCu-4.5wt.%Ti Filler Metal after chemical reaction (ACTi-3) is further increased, both covalent and ionic bonding strengths of ACTi-3/TiN interface are closer to those of ACTi-2/TiN interface. This leads to an almost unchanged interfacial ideal adhesion work and contact angle of 9.753 J/m2 and 8.1°, respectively.
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reactive wetting behavior and mechanism of aln ceramic by cuni xwt ti active Filler Metal
Ceramics International, 2020Co-Authors: Jian Yang, Jihua Huang, Shuhai Chen, Xuanwei Lei, Yue ZhaoAbstract:Abstract In order to propel the application of the developed CuNi-Xwt%Ti active Filler Metal in AlN brazing and get the universal reactive wetting mechanism between liquid Metal and solid ceramic, the reactive wetting behavior and mechanism of AlN ceramic by CuNi-Xwt%Ti active Filler Metal were investigated. The results indicate that, with the increasing Ti content, surface tension for liquid CuNi-Xwt%Ti Filler Metal increases at low-temperature interval, but very similar at high-temperature interval, which influence the wetting behavior on AlN ceramic obviously. CuNi/AlN is the typical non-reactive wetting system, the wetting process including rapid wetting stage and stable stage. The wettability is depended on surface tension of the liquid CuNi Filler Metal completely. However, the wetting process of CuNi-8wt.%Ti/AlN and CuNi-16 wt%Ti/AlN reactive wetting system is composed by three stages, which are rapid wetting stage decided by surface tension, slow wetting stage caused by interfacial reaction and stable stage. For CuNi-8wt.%Ti/AlN and CuNi-16 wt%Ti/AlN reactive wetting system, although the surface tension of liquid Filler Metal is the only factor to influence the instant wetting angle θ0 at rapid wetting stage, the reduced free energy caused by interfacial reaction at slow wetting stage plays the decisive role in influencing the final wettability.
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Butt brazing of titanium alloys/stainless steel plates by MIG-TIG double-sided arc welding process with copper Filler Metal
Elsevier, 2019Co-Authors: Zhi Cheng, Jian Yang, Jihua Huang, Shuhai ChenAbstract:Butt brazing of titanium alloys with stainless steel by MIG-TIG double-sided arc welding (DSAW) process with copper Filler Metal has been performed. The microstructures and mechanical properties of the joint were investigated. The results show that a butt brazing joint with sound double-sided appearance was achieved. With low heat input of brazing mode and rapid cooling rate of arc welding process, the joint is free of brittle Ti-Fe interMetallic compounds (IMCs). The phase compositions in the joint are TC4/Ti2Cu + TiCu/TiCu + Ti5Si3/Cu + (Ti5Si3 + Cu + βTiCu4)/Fe5Si3 + (Cu) + FeSi/Fe(s,s)/304ss orderly from Ti6Al4V to 304ss. The average tensile strength of the butt joint reaches 278 MPa. Compared with the fusion welding joint, the tensile strength of the arc-brazing joint is significantly increased because of the elimination of Ti-Fe IMCs. Keywords: Microstructure, Metals and alloys, Welding, Brazing, Dissimilar Metal joining, MIG-TIG double-sided arc weldin
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first principles calculations on wetting interface between ag cu ti Filler Metal and sic ceramic ag 1 1 1 sic 1 1 1 interface and ag 1 1 1 tic 1 1 1 interface
Applied Surface Science, 2018Co-Authors: Jian Yang, Jihua Huang, Shuhai Chen, Yue ZhaoAbstract:Abstract Interfacial properties of Ag (1 1 1)/SiC (1 1 1) interface and Ag (1 1 1)/TiC (1 1 1) interface were researched by first-principles calculations to investigate the reason that Ag-Cu-Ti Filler Metal shows the superior reactive wettability on SiC ceramic. The calculated results show that, 7 atom-layers Ag (1 1 1) surface, 11 atom-layer SiC (1 1 1) surface and 9 atom-layer TiC (1 1 1) surface can represent the Ag bulk, SiC bulk and TiC bulk, effectively. Ag (1 1 1)/SiC (1 1 1) interface and Ag (1 1 1)/TiC (1 1 1) interface with C-terminated structure and TL stacking sequence show the highest interfacial stability. Chemical bonds at Ag (1 1 1)/SiC (1 1 1) interface and Ag (1 1 1)/TiC (1 1 1) interface are mainly formed by the interaction between 1st layer C atoms in SiC (or TiC) slab and 1st layer Ag atoms in Ag slab. Interfacial energy of Ag (1 1 1)/SiC (1 1 1) interface is much larger than that of Ag (1 1 1)/TiC (1 1 1) interface, which indicates that the formed TiC reaction layer between Ag-Cu-Ti Filler Metal and SiC ceramic indeed plays the positive role on improving the wettability of Ag-Cu-Ti Filler Metal on SiC ceramic.
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brazing joining of ti3alc2 ceramic and 40cr steel based on ag cu ti Filler Metal
Journal of Materials Processing Technology, 2018Co-Authors: Limei Pan, Wenjie Zou, Tai Qiu, Haibin Zhang, Jian YangAbstract:Abstract The following paper investigated the vacuum brazing joining of Ti3AlC2 ceramic and 40Cr steel with Ag-Cu-Ti Filler Metal at 850 °C. A characterization of the brazing joint revealed that it consisted of the Ti3AlC2 ceramic, the brazing seam, and the 40Cr steel. There were four phase types found in the brazing seam that included AlCu2Ti, Al4Cu9, Cu[s, s], and Ag[s, s]. These occurred as a result of the interface reactions, which precipitated from the liquid alloy during solidification. When the brazing time was increased from 10 min to 30–60 min, there was a formation of a continuous reaction layer and a strong combination at the Filler Metal/40Cr steel interface. This led to the transformation of the joint facture position from the Filler Metal/40Cr steel interface to the Ti3AlC2/Filler Metal interface, thus resulting a significant enhancement of the joint shear strength from 27.7 MPa (10 min) to 196.4 MPa (30 min), and again to 191.3 MPa (60 min). The results showed that the optimal brazing time was 30 min.
Yue Zhao - One of the best experts on this subject based on the ideXlab platform.
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investigation on wetting behavior and mechanism of agcu xwt ti Filler Metal aln ceramic reactive wetting system experiments and first principles calculations
Journal of Alloys and Compounds, 2021Co-Authors: Yue Zhao, Jian Yang, Jihua Huang, Shuhai ChenAbstract:Abstract The wetting behavior and mechanism of AgCu-Xwt.%Ti Filler Metal on AlN ceramic were investigated using experiments and first-principles calculations. The results indicate that the interfacial ideal adhesion work of wetting interface after interfacial chemical reaction is a crucial factor influencing the wettability of AgCu-Xwt.%Ti/AlN wetting system. This factor is controlled by the interfacial bonding characteristic. AgCu/AlN ceramic is a non-reactive wetting system, which has poor wettability with a contact angle of 22.9°. When 1.5 wt.% of active element [Ti] is added in AgCuTi Filler Metal, interfacial chemical reaction occurs, producing TiN. Therefore, the wetting interface is composed of AgCu-1.5wt.%Ti Filler Metal after chemical reaction and TiN (ACTi-1/TiN interface), which exhibits a large interfacial ideal adhesion work of 9.908 J/m2, leading to a small contact angle of 11.7°. When Ti content increases to 3.0 wt.%, the ionic bonding strength of wetting interface, composed by AgCu-3.0wt.%Ti Filler Metal after chemical reaction and TiN (ACTi-2/TiN interface), becomes stronger than that of ACTi-1/TiN interface owing to the increasing residual Ti content. Consequently, the interfacial ideal adhesion work further increases to 9.711 J/m2, and a decreasing contact angle of 8.2° is achieved. However, when Ti content reaches to 4.5 wt.%, although residual Ti content in AgCu-4.5wt.%Ti Filler Metal after chemical reaction (ACTi-3) is further increased, both covalent and ionic bonding strengths of ACTi-3/TiN interface are closer to those of ACTi-2/TiN interface. This leads to an almost unchanged interfacial ideal adhesion work and contact angle of 9.753 J/m2 and 8.1°, respectively.
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reactive wetting behavior and mechanism of aln ceramic by cuni xwt ti active Filler Metal
Ceramics International, 2020Co-Authors: Jian Yang, Jihua Huang, Shuhai Chen, Xuanwei Lei, Yue ZhaoAbstract:Abstract In order to propel the application of the developed CuNi-Xwt%Ti active Filler Metal in AlN brazing and get the universal reactive wetting mechanism between liquid Metal and solid ceramic, the reactive wetting behavior and mechanism of AlN ceramic by CuNi-Xwt%Ti active Filler Metal were investigated. The results indicate that, with the increasing Ti content, surface tension for liquid CuNi-Xwt%Ti Filler Metal increases at low-temperature interval, but very similar at high-temperature interval, which influence the wetting behavior on AlN ceramic obviously. CuNi/AlN is the typical non-reactive wetting system, the wetting process including rapid wetting stage and stable stage. The wettability is depended on surface tension of the liquid CuNi Filler Metal completely. However, the wetting process of CuNi-8wt.%Ti/AlN and CuNi-16 wt%Ti/AlN reactive wetting system is composed by three stages, which are rapid wetting stage decided by surface tension, slow wetting stage caused by interfacial reaction and stable stage. For CuNi-8wt.%Ti/AlN and CuNi-16 wt%Ti/AlN reactive wetting system, although the surface tension of liquid Filler Metal is the only factor to influence the instant wetting angle θ0 at rapid wetting stage, the reduced free energy caused by interfacial reaction at slow wetting stage plays the decisive role in influencing the final wettability.
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first principles calculations on wetting interface between ag cu ti Filler Metal and sic ceramic ag 1 1 1 sic 1 1 1 interface and ag 1 1 1 tic 1 1 1 interface
Applied Surface Science, 2018Co-Authors: Jian Yang, Jihua Huang, Shuhai Chen, Yue ZhaoAbstract:Abstract Interfacial properties of Ag (1 1 1)/SiC (1 1 1) interface and Ag (1 1 1)/TiC (1 1 1) interface were researched by first-principles calculations to investigate the reason that Ag-Cu-Ti Filler Metal shows the superior reactive wettability on SiC ceramic. The calculated results show that, 7 atom-layers Ag (1 1 1) surface, 11 atom-layer SiC (1 1 1) surface and 9 atom-layer TiC (1 1 1) surface can represent the Ag bulk, SiC bulk and TiC bulk, effectively. Ag (1 1 1)/SiC (1 1 1) interface and Ag (1 1 1)/TiC (1 1 1) interface with C-terminated structure and TL stacking sequence show the highest interfacial stability. Chemical bonds at Ag (1 1 1)/SiC (1 1 1) interface and Ag (1 1 1)/TiC (1 1 1) interface are mainly formed by the interaction between 1st layer C atoms in SiC (or TiC) slab and 1st layer Ag atoms in Ag slab. Interfacial energy of Ag (1 1 1)/SiC (1 1 1) interface is much larger than that of Ag (1 1 1)/TiC (1 1 1) interface, which indicates that the formed TiC reaction layer between Ag-Cu-Ti Filler Metal and SiC ceramic indeed plays the positive role on improving the wettability of Ag-Cu-Ti Filler Metal on SiC ceramic.
J C Feng - One of the best experts on this subject based on the ideXlab platform.
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surface modification on wetting and vacuum brazing behavior of graphite using agcu Filler Metal
Surface & Coatings Technology, 2018Co-Authors: Z Che, Xiaoguo Song, Chaona Niu, Xiaokang Dua, J Cao, J C FengAbstract:Abstract Joining of graphite materials is problematic primarily due to the poor wettability of non-active Filler Metal on these materials. In an attempt to overcome this problem, magnetron sputtering deposition of Cr film on graphite was performed to modify the surface of the graphite. The wetting and brazing of graphite are carried out using non-active AgCu eutectic Filler Metals after deposition. The results indicated that surface modification enables wetting and joining of graphite with non-active Filler. Cr film reacted with graphite forming Cr-C interfacial reaction layer, which resulted in the decrease of contact angle. Reliable graphite/graphite joints were obtained at temperature from 1113 K to 1233 K for 10 min. The typical interfacial microstructure of the brazed joint is graphite/Cr-C layer/Ag(s,s) + Cu(s,s) eutectic phase/Cr-C layer/graphite. The optimal shear strength of the joint was 13.6 MPa when the brazing parameters were 1173 K for 10 min.
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brazing continuous carbon fiber reinforced li2o al2o3 sio2 ceramic matrix composites to ti 6al 4v alloy using ag cu ti active Filler Metal
Materials & Design, 2015Co-Authors: Duo Liu, Xiaoguo Song, H W Niu, Yinghao Zhou, Dongyan Tang, J C FengAbstract:Abstract Cf/LAS composites and TC4 alloy were brazed successfully by vacuum brazing using Ag–Cu–Ti active Filler Metal. The interfacial microstructure was characterized by a scanning electron microscope, energy dispersive spectrometer and X-ray diffraction. The effects of brazing temperature on the interfacial microstructure and joint properties were investigated in details. Various phases including TiC, TiSi2, Ti3Cu4, Cu (s,s), Ag (s,s), TiCu and Ti2Cu were formed in the brazed joints. Interfacial microstructure varies greatly with the increase of brazing temperature, while the amount of Ti2Cu reduced, but no new phase is generated. The optimal shear strength of the joint is 26.4 MPa when brazed at 890 °C for 10 min. Shear test indicated that the fracture of the brazed joints went through the TiSi2 + TiC layer close to the Cf/LAS composites interface.
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effect of silver content on microstructure and properties of brass steel induction brazing joint using ag cu zn sn Filler Metal
Journal of Materials Science & Technology, 2011Co-Authors: Lixian Zhang, Huiguang Wang, Laijun Wu, J C FengAbstract:The induction brazing of brass to steel using Ag-Cu-Zn-Sn Filler Metal was investigated in this study. The influence of Ag content on the microstructure and properties were analyzed by means of optical microscopy, scanning electron microscopy and electron probe microanalysis. Defect free joint was achieved using Ag-Cu-Zn-Sn Filler Metal. The microstructure of the joint was mainly composed of Ag-based solid solution and Cu-based solid solution. The increase of Ag content and the cooling rate both led to the increase of the needle like eutectic structure. The tensile strength decreased with the increase of Ag content. The tensile strength at room temperature using Ag25CuZnSn Filler Metal reached 445 MPa. All fractures using Ag-Cu-Zn-Sn Filler Metal presented ductile characteristic.
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microstructure and strength of brazed joints of ti3al base alloy with agcuzn Filler Metal
Materials Science and Technology, 2005Co-Authors: J C Feng, H ZhouAbstract:Abstract Brazing Ti3Al alloys with Filler Metal Ag–Cu34–Zn16 was carried out at 1073–1173 K for 60–1200 s. The relationship between brazing parameters and shear strength of the joints was investigated, and optimum brazing parameters obtained as follows: brazing temperature 1073–1083 K, brazing time 250–300 s. The maximum shear strength obtained for joints was 160–170 MPa. The reaction products and the interface structure of the joints were investigated by SEM, EPMA, and XRD. Three kinds of reaction product were observed to have formed during the brazing of Ti3Al alloys with Ag–Cu34–Zn16 Filler Metal: namely Ti(Cu, Al)2+TiCu interMetallic compounds formed close to the Ti3Al alloy, and Ag solid solution formed in the middle of the joint. The interfacial structure of brazed Ti3Al alloy joints with Ag–Cu34–Zn16 Filler Metal was Ti3Al/Ti(Cu, Al)2+TiCu/Ag solid solution/Ti(Cu, Al)2+TiCu /Ti3Al, and this structure does not change with brazing time once it forms. The formation of interMetallic compounds Ti(Cu, Al...
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microstructure and strength of brazed joints of ti3al base alloy with tizrnicu Filler Metal
Materials Science and Engineering A-structural Materials Properties Microstructure and Processing, 2005Co-Authors: J C Feng, H ZhouAbstract:Abstract Brazing of Ti 3 Al alloys with the Filler Metal TiZrNiCu was carried out at 1173–1373 K for 60–1200 s. The relationship of brazing parameters and shear strength of the joints was discussed and the optimum brazing parameters were obtained. When products are brazed, the optimum brazing parameters are as follows: brazing temperature is 1273–1323 K, brazing time is 250–300 s. The maximum shear strength of the joint is 250–260 MPa. Four kinds of reaction products were observed to have formed during the brazing of Ti 3 Al alloys with the Filler Metal TiZrNiCu, namely Ti 2 Ni + TiCu interMetallic compounds formed close to the Ti 3 Al alloy. TiNi 2 Cu interMetallic compounds layer formed between Ti 2 Ni + TiCu interMetallic compounds and the Filler Metal and a Ti[s,s] (here s,s means super saturation) solid solution formed with the dispersed TiNi 2 Cu in the middle of the joint. The interfacial structure of brazed Ti 3 Al alloys joints with the Filler Metal TiZrNiCu is Ti 3 Al/Ti 2 Ni + TiCu/TiNi 2 Cu/Ti[s,s] solid solution + TiNi 2 Cu/TiNi 2 Cu/TiCu + Ti 2 Ni/Ti 3 Al and this structure will not change with brazing time once it forms. The formation of over many interMetallic compounds Ti 2 Ni + TiCu + TiNi 2 Cu results in embrittlement of the joint and poor joint properties. The thickness of Ti 2 Ni + TiCu + TiNi 2 Cu interMetallic compounds increases with brazing time according to a parabolic law. The activation energy Q and the growth velocity K 0 of the reaction layer Ti 2 Ni + TiCu + TiNi 2 Cu in the brazed joints of Ti 3 Al alloys with the Filler Metal TiZrNiCu are 261 kJ/mol and 0.0434 mm 2 /s, respectively and the growth formula was y 2 = 0.0434 exp(−31392.83/ T ) t . Careful control of the growth of the reaction layer Ti 2 Ni + TiCu + TiNi 2 Cu can influence the final joint strength.
Jihua Huang - One of the best experts on this subject based on the ideXlab platform.
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investigation on wetting behavior and mechanism of agcu xwt ti Filler Metal aln ceramic reactive wetting system experiments and first principles calculations
Journal of Alloys and Compounds, 2021Co-Authors: Yue Zhao, Jian Yang, Jihua Huang, Shuhai ChenAbstract:Abstract The wetting behavior and mechanism of AgCu-Xwt.%Ti Filler Metal on AlN ceramic were investigated using experiments and first-principles calculations. The results indicate that the interfacial ideal adhesion work of wetting interface after interfacial chemical reaction is a crucial factor influencing the wettability of AgCu-Xwt.%Ti/AlN wetting system. This factor is controlled by the interfacial bonding characteristic. AgCu/AlN ceramic is a non-reactive wetting system, which has poor wettability with a contact angle of 22.9°. When 1.5 wt.% of active element [Ti] is added in AgCuTi Filler Metal, interfacial chemical reaction occurs, producing TiN. Therefore, the wetting interface is composed of AgCu-1.5wt.%Ti Filler Metal after chemical reaction and TiN (ACTi-1/TiN interface), which exhibits a large interfacial ideal adhesion work of 9.908 J/m2, leading to a small contact angle of 11.7°. When Ti content increases to 3.0 wt.%, the ionic bonding strength of wetting interface, composed by AgCu-3.0wt.%Ti Filler Metal after chemical reaction and TiN (ACTi-2/TiN interface), becomes stronger than that of ACTi-1/TiN interface owing to the increasing residual Ti content. Consequently, the interfacial ideal adhesion work further increases to 9.711 J/m2, and a decreasing contact angle of 8.2° is achieved. However, when Ti content reaches to 4.5 wt.%, although residual Ti content in AgCu-4.5wt.%Ti Filler Metal after chemical reaction (ACTi-3) is further increased, both covalent and ionic bonding strengths of ACTi-3/TiN interface are closer to those of ACTi-2/TiN interface. This leads to an almost unchanged interfacial ideal adhesion work and contact angle of 9.753 J/m2 and 8.1°, respectively.
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reactive wetting behavior and mechanism of aln ceramic by cuni xwt ti active Filler Metal
Ceramics International, 2020Co-Authors: Jian Yang, Jihua Huang, Shuhai Chen, Xuanwei Lei, Yue ZhaoAbstract:Abstract In order to propel the application of the developed CuNi-Xwt%Ti active Filler Metal in AlN brazing and get the universal reactive wetting mechanism between liquid Metal and solid ceramic, the reactive wetting behavior and mechanism of AlN ceramic by CuNi-Xwt%Ti active Filler Metal were investigated. The results indicate that, with the increasing Ti content, surface tension for liquid CuNi-Xwt%Ti Filler Metal increases at low-temperature interval, but very similar at high-temperature interval, which influence the wetting behavior on AlN ceramic obviously. CuNi/AlN is the typical non-reactive wetting system, the wetting process including rapid wetting stage and stable stage. The wettability is depended on surface tension of the liquid CuNi Filler Metal completely. However, the wetting process of CuNi-8wt.%Ti/AlN and CuNi-16 wt%Ti/AlN reactive wetting system is composed by three stages, which are rapid wetting stage decided by surface tension, slow wetting stage caused by interfacial reaction and stable stage. For CuNi-8wt.%Ti/AlN and CuNi-16 wt%Ti/AlN reactive wetting system, although the surface tension of liquid Filler Metal is the only factor to influence the instant wetting angle θ0 at rapid wetting stage, the reduced free energy caused by interfacial reaction at slow wetting stage plays the decisive role in influencing the final wettability.
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Butt brazing of titanium alloys/stainless steel plates by MIG-TIG double-sided arc welding process with copper Filler Metal
Elsevier, 2019Co-Authors: Zhi Cheng, Jian Yang, Jihua Huang, Shuhai ChenAbstract:Butt brazing of titanium alloys with stainless steel by MIG-TIG double-sided arc welding (DSAW) process with copper Filler Metal has been performed. The microstructures and mechanical properties of the joint were investigated. The results show that a butt brazing joint with sound double-sided appearance was achieved. With low heat input of brazing mode and rapid cooling rate of arc welding process, the joint is free of brittle Ti-Fe interMetallic compounds (IMCs). The phase compositions in the joint are TC4/Ti2Cu + TiCu/TiCu + Ti5Si3/Cu + (Ti5Si3 + Cu + βTiCu4)/Fe5Si3 + (Cu) + FeSi/Fe(s,s)/304ss orderly from Ti6Al4V to 304ss. The average tensile strength of the butt joint reaches 278 MPa. Compared with the fusion welding joint, the tensile strength of the arc-brazing joint is significantly increased because of the elimination of Ti-Fe IMCs. Keywords: Microstructure, Metals and alloys, Welding, Brazing, Dissimilar Metal joining, MIG-TIG double-sided arc weldin
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first principles calculations on wetting interface between ag cu ti Filler Metal and sic ceramic ag 1 1 1 sic 1 1 1 interface and ag 1 1 1 tic 1 1 1 interface
Applied Surface Science, 2018Co-Authors: Jian Yang, Jihua Huang, Shuhai Chen, Yue ZhaoAbstract:Abstract Interfacial properties of Ag (1 1 1)/SiC (1 1 1) interface and Ag (1 1 1)/TiC (1 1 1) interface were researched by first-principles calculations to investigate the reason that Ag-Cu-Ti Filler Metal shows the superior reactive wettability on SiC ceramic. The calculated results show that, 7 atom-layers Ag (1 1 1) surface, 11 atom-layer SiC (1 1 1) surface and 9 atom-layer TiC (1 1 1) surface can represent the Ag bulk, SiC bulk and TiC bulk, effectively. Ag (1 1 1)/SiC (1 1 1) interface and Ag (1 1 1)/TiC (1 1 1) interface with C-terminated structure and TL stacking sequence show the highest interfacial stability. Chemical bonds at Ag (1 1 1)/SiC (1 1 1) interface and Ag (1 1 1)/TiC (1 1 1) interface are mainly formed by the interaction between 1st layer C atoms in SiC (or TiC) slab and 1st layer Ag atoms in Ag slab. Interfacial energy of Ag (1 1 1)/SiC (1 1 1) interface is much larger than that of Ag (1 1 1)/TiC (1 1 1) interface, which indicates that the formed TiC reaction layer between Ag-Cu-Ti Filler Metal and SiC ceramic indeed plays the positive role on improving the wettability of Ag-Cu-Ti Filler Metal on SiC ceramic.
Shuhai Chen - One of the best experts on this subject based on the ideXlab platform.
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investigation on wetting behavior and mechanism of agcu xwt ti Filler Metal aln ceramic reactive wetting system experiments and first principles calculations
Journal of Alloys and Compounds, 2021Co-Authors: Yue Zhao, Jian Yang, Jihua Huang, Shuhai ChenAbstract:Abstract The wetting behavior and mechanism of AgCu-Xwt.%Ti Filler Metal on AlN ceramic were investigated using experiments and first-principles calculations. The results indicate that the interfacial ideal adhesion work of wetting interface after interfacial chemical reaction is a crucial factor influencing the wettability of AgCu-Xwt.%Ti/AlN wetting system. This factor is controlled by the interfacial bonding characteristic. AgCu/AlN ceramic is a non-reactive wetting system, which has poor wettability with a contact angle of 22.9°. When 1.5 wt.% of active element [Ti] is added in AgCuTi Filler Metal, interfacial chemical reaction occurs, producing TiN. Therefore, the wetting interface is composed of AgCu-1.5wt.%Ti Filler Metal after chemical reaction and TiN (ACTi-1/TiN interface), which exhibits a large interfacial ideal adhesion work of 9.908 J/m2, leading to a small contact angle of 11.7°. When Ti content increases to 3.0 wt.%, the ionic bonding strength of wetting interface, composed by AgCu-3.0wt.%Ti Filler Metal after chemical reaction and TiN (ACTi-2/TiN interface), becomes stronger than that of ACTi-1/TiN interface owing to the increasing residual Ti content. Consequently, the interfacial ideal adhesion work further increases to 9.711 J/m2, and a decreasing contact angle of 8.2° is achieved. However, when Ti content reaches to 4.5 wt.%, although residual Ti content in AgCu-4.5wt.%Ti Filler Metal after chemical reaction (ACTi-3) is further increased, both covalent and ionic bonding strengths of ACTi-3/TiN interface are closer to those of ACTi-2/TiN interface. This leads to an almost unchanged interfacial ideal adhesion work and contact angle of 9.753 J/m2 and 8.1°, respectively.
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reactive wetting behavior and mechanism of aln ceramic by cuni xwt ti active Filler Metal
Ceramics International, 2020Co-Authors: Jian Yang, Jihua Huang, Shuhai Chen, Xuanwei Lei, Yue ZhaoAbstract:Abstract In order to propel the application of the developed CuNi-Xwt%Ti active Filler Metal in AlN brazing and get the universal reactive wetting mechanism between liquid Metal and solid ceramic, the reactive wetting behavior and mechanism of AlN ceramic by CuNi-Xwt%Ti active Filler Metal were investigated. The results indicate that, with the increasing Ti content, surface tension for liquid CuNi-Xwt%Ti Filler Metal increases at low-temperature interval, but very similar at high-temperature interval, which influence the wetting behavior on AlN ceramic obviously. CuNi/AlN is the typical non-reactive wetting system, the wetting process including rapid wetting stage and stable stage. The wettability is depended on surface tension of the liquid CuNi Filler Metal completely. However, the wetting process of CuNi-8wt.%Ti/AlN and CuNi-16 wt%Ti/AlN reactive wetting system is composed by three stages, which are rapid wetting stage decided by surface tension, slow wetting stage caused by interfacial reaction and stable stage. For CuNi-8wt.%Ti/AlN and CuNi-16 wt%Ti/AlN reactive wetting system, although the surface tension of liquid Filler Metal is the only factor to influence the instant wetting angle θ0 at rapid wetting stage, the reduced free energy caused by interfacial reaction at slow wetting stage plays the decisive role in influencing the final wettability.
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Butt brazing of titanium alloys/stainless steel plates by MIG-TIG double-sided arc welding process with copper Filler Metal
Elsevier, 2019Co-Authors: Zhi Cheng, Jian Yang, Jihua Huang, Shuhai ChenAbstract:Butt brazing of titanium alloys with stainless steel by MIG-TIG double-sided arc welding (DSAW) process with copper Filler Metal has been performed. The microstructures and mechanical properties of the joint were investigated. The results show that a butt brazing joint with sound double-sided appearance was achieved. With low heat input of brazing mode and rapid cooling rate of arc welding process, the joint is free of brittle Ti-Fe interMetallic compounds (IMCs). The phase compositions in the joint are TC4/Ti2Cu + TiCu/TiCu + Ti5Si3/Cu + (Ti5Si3 + Cu + βTiCu4)/Fe5Si3 + (Cu) + FeSi/Fe(s,s)/304ss orderly from Ti6Al4V to 304ss. The average tensile strength of the butt joint reaches 278 MPa. Compared with the fusion welding joint, the tensile strength of the arc-brazing joint is significantly increased because of the elimination of Ti-Fe IMCs. Keywords: Microstructure, Metals and alloys, Welding, Brazing, Dissimilar Metal joining, MIG-TIG double-sided arc weldin
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first principles calculations on wetting interface between ag cu ti Filler Metal and sic ceramic ag 1 1 1 sic 1 1 1 interface and ag 1 1 1 tic 1 1 1 interface
Applied Surface Science, 2018Co-Authors: Jian Yang, Jihua Huang, Shuhai Chen, Yue ZhaoAbstract:Abstract Interfacial properties of Ag (1 1 1)/SiC (1 1 1) interface and Ag (1 1 1)/TiC (1 1 1) interface were researched by first-principles calculations to investigate the reason that Ag-Cu-Ti Filler Metal shows the superior reactive wettability on SiC ceramic. The calculated results show that, 7 atom-layers Ag (1 1 1) surface, 11 atom-layer SiC (1 1 1) surface and 9 atom-layer TiC (1 1 1) surface can represent the Ag bulk, SiC bulk and TiC bulk, effectively. Ag (1 1 1)/SiC (1 1 1) interface and Ag (1 1 1)/TiC (1 1 1) interface with C-terminated structure and TL stacking sequence show the highest interfacial stability. Chemical bonds at Ag (1 1 1)/SiC (1 1 1) interface and Ag (1 1 1)/TiC (1 1 1) interface are mainly formed by the interaction between 1st layer C atoms in SiC (or TiC) slab and 1st layer Ag atoms in Ag slab. Interfacial energy of Ag (1 1 1)/SiC (1 1 1) interface is much larger than that of Ag (1 1 1)/TiC (1 1 1) interface, which indicates that the formed TiC reaction layer between Ag-Cu-Ti Filler Metal and SiC ceramic indeed plays the positive role on improving the wettability of Ag-Cu-Ti Filler Metal on SiC ceramic.