The Experts below are selected from a list of 130434 Experts worldwide ranked by ideXlab platform
Bastian Habler - One of the best experts on this subject based on the ideXlab platform.
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Manufacturing of sandwich structures for the integration of electronics in in mold Labelling components
2016 12th International Congress Molded Interconnect Devices (MID), 2016Co-Authors: Annette Wimmer, Herbert Reichel, Bernhard Rauch, Rene Schramm, Johannes Hörber, Bastian HablerAbstract:For the manufacturing of decorative Molded Interconnect Devices, In-Mold Labelling is combined with foils functionalized by printing. This appears to enable a cost efficient process chain, e. g. for automotive interior applications. The presented work gives a brief overview of the full process chain that is investigated. Relevant material parameters of the foil systems and the conductor pastes for printing are discussed. Furthermore, process adaptations required for screen printing and for back-molding are addressed as well as effects of the deformation on the conductivity of the circuit tracks. In addition, the basic interconnection technology for SMD by conductive adhesives is investigated. The results are summarized in the form of a representative 3D demonstrator.
Richard Bloss - One of the best experts on this subject based on the ideXlab platform.
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Robots help label before molding
Industrial Robot: An International Journal, 2006Co-Authors: Richard BlossAbstract:Purpose – Seeks to review how a relatively new technology, in mold Labelling of injection moulded items, can be achieved in a cost‐effective way with robots.Design/methodology/approach – A custom‐designed robot combined with a custom‐designed end‐of‐arm unit, both applies labels in the mold before the injection process and removes finished items. A vision system checks for label placement and quality. A second robot packs finished items into shipping cartons.Findings – The automated system can produce tens of millions of items per year in a very cost‐effective manner.Practical implications – Users need to turn to robotic system designers who can combine several operations within one robotic cycle and apply emerging technologies. Custom designed end‐of‐arm units and reviewing even the shipping carton may provide critical answers.Originality/value – Combining new technologies with custom robotics can help users meet many production goals with one solution.
Annette Wimmer - One of the best experts on this subject based on the ideXlab platform.
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Manufacturing of sandwich structures for the integration of electronics in in mold Labelling components
2016 12th International Congress Molded Interconnect Devices (MID), 2016Co-Authors: Annette Wimmer, Herbert Reichel, Bernhard Rauch, Rene Schramm, Johannes Hörber, Bastian HablerAbstract:For the manufacturing of decorative Molded Interconnect Devices, In-Mold Labelling is combined with foils functionalized by printing. This appears to enable a cost efficient process chain, e. g. for automotive interior applications. The presented work gives a brief overview of the full process chain that is investigated. Relevant material parameters of the foil systems and the conductor pastes for printing are discussed. Furthermore, process adaptations required for screen printing and for back-molding are addressed as well as effects of the deformation on the conductivity of the circuit tracks. In addition, the basic interconnection technology for SMD by conductive adhesives is investigated. The results are summarized in the form of a representative 3D demonstrator.
Herbert Reichel - One of the best experts on this subject based on the ideXlab platform.
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Manufacturing of sandwich structures for the integration of electronics in in mold Labelling components
2016 12th International Congress Molded Interconnect Devices (MID), 2016Co-Authors: Annette Wimmer, Herbert Reichel, Bernhard Rauch, Rene Schramm, Johannes Hörber, Bastian HablerAbstract:For the manufacturing of decorative Molded Interconnect Devices, In-Mold Labelling is combined with foils functionalized by printing. This appears to enable a cost efficient process chain, e. g. for automotive interior applications. The presented work gives a brief overview of the full process chain that is investigated. Relevant material parameters of the foil systems and the conductor pastes for printing are discussed. Furthermore, process adaptations required for screen printing and for back-molding are addressed as well as effects of the deformation on the conductivity of the circuit tracks. In addition, the basic interconnection technology for SMD by conductive adhesives is investigated. The results are summarized in the form of a representative 3D demonstrator.
Bernhard Rauch - One of the best experts on this subject based on the ideXlab platform.
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Manufacturing of sandwich structures for the integration of electronics in in mold Labelling components
2016 12th International Congress Molded Interconnect Devices (MID), 2016Co-Authors: Annette Wimmer, Herbert Reichel, Bernhard Rauch, Rene Schramm, Johannes Hörber, Bastian HablerAbstract:For the manufacturing of decorative Molded Interconnect Devices, In-Mold Labelling is combined with foils functionalized by printing. This appears to enable a cost efficient process chain, e. g. for automotive interior applications. The presented work gives a brief overview of the full process chain that is investigated. Relevant material parameters of the foil systems and the conductor pastes for printing are discussed. Furthermore, process adaptations required for screen printing and for back-molding are addressed as well as effects of the deformation on the conductivity of the circuit tracks. In addition, the basic interconnection technology for SMD by conductive adhesives is investigated. The results are summarized in the form of a representative 3D demonstrator.
