The Experts below are selected from a list of 1014 Experts worldwide ranked by ideXlab platform

Eun-chang Kang - One of the best experts on this subject based on the ideXlab platform.

  • Effect of Resin Content on the Physiochemical and Combustion Properties of Wood Fiber Insulation Board
    Bioresources, 2020
    Co-Authors: Se-hwi Park, Eun-chang Kang
    Abstract:

    As petrochemical products (including plastics) contribute to the destruction of the natural environment, the use of such products must be reduced. Plastics account for 90% of the Insulation materials used in Korea, including extruded polystyrene (EPS), expanded polystyrene (XPS), and urethane foam. Wood-fiber Insulation Board (WIB) is a promising natural alternative to petrochemical Insulation. This study aimed to determine the optimal amount of adhesive resin required for manufacturing WIB. Fire-resistant WIB was prepared with a melamine-urea-formaldehyde (MUF) resin (ranging from 20% to 35%), and the physicochemical and fire-resistant properties were determined. Higher resin content led to improved physical properties, while the thermal conductivity was unaffected. With the exception of 35% resin content in the WIB, the formaldehyde emissions of the WIB samples complied with the Korean Industrial Standards requirements for Super E0 grade (less than 0.3 mg per L). The physicochemical properties of the WIB samples were sufficient for use as an insulating material, even at 20% resin content. A perpendicular flame test revealed that all samples formed a carbonized layer to prevent flame penetration, except for the specimen with 20% of the resin content. The cone calorimeter testing indicated that the MUF adhesives acted as an effective fire retardant at resin contents above 25%.

  • Changes in Characteristics of Wood Fiber Insulation Board According to Density
    Bioresources, 2019
    Co-Authors: Eun-chang Kang
    Abstract:

    As the demand increases for low energy green buildings, such as passive housing, the development of new Insulation systems based on natural materials is underway. In this study, 20-mm-thick wood fiber Insulation Board (WIB) samples of different densities were prepared using melamine-formaldehyde-urea (MFU) resin adhesives. The resin contents were fixed at 35% and the target densities were 0.10 g/cm3, 0.15 g/cm3, 0.20 g/cm3, and 0.25 g/cm3. The thermal conductivities of the WIBs gradually increased as the density increased. The formaldehyde (HCHO) emissions of all the WIBs indicated that they were of “Super E0” (SE0) grade, but the quantity of the HCHO emissions slightly increased as the density increased. The thickness swelling of all the WIBs was stable at less than 3%, and the bending strength linearly increased as the WIB density increased. A notable decrease in the water absorption rate was observed between the lower and higher density WIB samples. Based on the results of the cone calorimeter tests, the carbonization depth ratio and the weight loss rate remarkably decreased as the density increased. Therefore, the optimum WIB density was in the range of 0.15 g/cm3 to 0.20 g/cm3 to provide adequate Insulation performance as well as human and structural safety.

Dean A. Rutila - One of the best experts on this subject based on the ideXlab platform.

  • Case Studies of Adhesive and Rigid Insulation Board Failures due to Moisture in Low Sloped Roofing Assemblies
    Journal of Astm International, 2012
    Co-Authors: David Straup Slick, Nicholas A. Piteo, Dean A. Rutila
    Abstract:

    Foamed adhesives are used to join roofing assembly components to the roof substrate and to each other. A variety of performance problems with foamed adhesives as installed in roofing assemblies have led to assembly failures. We previously reported, in detail, four specific failure mechanisms caused by poor adhesive installation that we have observed, and we briefly note these failure mechanisms in order to maintain continuity as we expand on our earlier work. The focus of this paper is to report on other factors that also lead to adhesive and rigid Insulation Board performance problems, specifically, moisture contained within the roofing assembly and substrate, which can result in the failure of the roofing assembly. Similar substrate moisture issues occur in flooring assemblies; however, whereas the flooring industry continues to address moisture-related issues that lead to adhesive performance problems, the roofing and roofing adhesive industries have been less proactive regarding use, installation, and testing for assemblies with potential moisture-related issues. We present several case studies that illustrate excessive moisture in roofing assemblies or substrates as an issue that contributed to the adhesive failure of the roofing assembly. We also discuss the lessons to be learned from not addressing these issues at the onset of a project.

  • Case Studies of Foamed Adhesive Failures of Low Sloped Roofing Rigid Insulation Board
    Journal of Astm International, 2011
    Co-Authors: David Straup Slick, Nicholas A. Piteo, Dean A. Rutila
    Abstract:

    In low sloped roofing systems, poorly adhered roofing assemblies are unable to resist significant wind loads and are likely to be further damaged or destroyed by wind events well below the design wind pressures for the assembly. The design and installation of rigid Insulation Boards are a critical parameter in the service life of this roofing assembly in that, if the Insulation Boards become detached, there is increased risk for complete roofing assembly failure. Foamed adhesive is a common alternative to traditional hot-mopped asphalt adhesive in contemporary roofing assemblies. The proper design and installation of Insulation Board roofing assemblies in foamed adhesive is paramount to the successful performance of these roofing assemblies. Some of the critical parameters that could influence foamed adhesive performance are: Insulation Board adhesive pattern defects; Insulation Board adhesive quantity; inadequate Insulation Board adhesive contact; and failure to maintain Insulation Board contact with the substrate until the Insulation adhesive is sufficiently set. The present paper discusses these critical parameters through case studies that clearly demonstrate how these parameters can lead to the failure of roofing assemblies, and discusses the lessons to be learned from these Insulation Board adhesion failures.

Gu Jin-tong - One of the best experts on this subject based on the ideXlab platform.

  • Numerical Calculation for Soil Temperature Field of Underground Oil Pipeline With Heating Tracer
    Journal of Liaoning University of Petroleum & Chemical Technology, 2020
    Co-Authors: Gu Jin-tong
    Abstract:

    The geometrical properties of the pipeline with heating tracer were analyzed,the mathematics model was set up and the two-dimensional,an unstable temperature field of soil around the pipelines was numerically calculated by using the finite element method.The temperature fields were calculated when an Insulation Board was not set on the pipeline and heating tracer.The results show that the Insulation Board is benefit to maintain the temperature of pipelines.The temperature fields of the soil were obtained when the spacing of the pipeline and heating tracer,the depth of the pipeline and heating tracer were modified.Increasing the spacing can enhance the heat transfer efficiency of heating tracer. With the given operational parameter,1.5 m underground the soil is the proper depth of the pipeline.

  • In-situ Monolithically External Concrete Wall and External Insulation Board
    Construction Technology, 2020
    Co-Authors: Gu Jin-tong
    Abstract:

    A kind of external Insulation technology used in\|situ external concrete shear wall is introduced. Put polystyrene plastics heat\|insulating Board on inner of outer formwork before casting concrete, heat\|insulating Board and wall become monolithic after casting concrete. Authors study thermal properties, structure safety, surface crack resistant, construction technique, support materials and economics analysis of this system. This external Insulation system is time\|saving, safety and money\|saving.

Xiang Zenghui - One of the best experts on this subject based on the ideXlab platform.

  • thermal Insulation Board
    2013
    Co-Authors: Zuo Baichuan, Xiang Zenghui
    Abstract:

    The utility model relates to a thermal-Insulation Board which comprises a thermal-Insulation layer. Thermal-protective coatings are both composited above and under the thermal-Insulation layer, the thermal-Insulation layer is a flame-retardant polyester fiber Board, and the thermal-protective coatings are gypsum Boards. The thermal-Insulation Board has the advantages of being fireproof, capable of insulating heat and sound, light, good in stability, low in cost, convenient to construct, simple, practical and applied to thermal Insulation of an inner wall and thermal Insulation of an outer wall.

David Straup Slick - One of the best experts on this subject based on the ideXlab platform.

  • Case Studies of Adhesive and Rigid Insulation Board Failures due to Moisture in Low Sloped Roofing Assemblies
    Journal of Astm International, 2012
    Co-Authors: David Straup Slick, Nicholas A. Piteo, Dean A. Rutila
    Abstract:

    Foamed adhesives are used to join roofing assembly components to the roof substrate and to each other. A variety of performance problems with foamed adhesives as installed in roofing assemblies have led to assembly failures. We previously reported, in detail, four specific failure mechanisms caused by poor adhesive installation that we have observed, and we briefly note these failure mechanisms in order to maintain continuity as we expand on our earlier work. The focus of this paper is to report on other factors that also lead to adhesive and rigid Insulation Board performance problems, specifically, moisture contained within the roofing assembly and substrate, which can result in the failure of the roofing assembly. Similar substrate moisture issues occur in flooring assemblies; however, whereas the flooring industry continues to address moisture-related issues that lead to adhesive performance problems, the roofing and roofing adhesive industries have been less proactive regarding use, installation, and testing for assemblies with potential moisture-related issues. We present several case studies that illustrate excessive moisture in roofing assemblies or substrates as an issue that contributed to the adhesive failure of the roofing assembly. We also discuss the lessons to be learned from not addressing these issues at the onset of a project.

  • Case Studies of Foamed Adhesive Failures of Low Sloped Roofing Rigid Insulation Board
    Journal of Astm International, 2011
    Co-Authors: David Straup Slick, Nicholas A. Piteo, Dean A. Rutila
    Abstract:

    In low sloped roofing systems, poorly adhered roofing assemblies are unable to resist significant wind loads and are likely to be further damaged or destroyed by wind events well below the design wind pressures for the assembly. The design and installation of rigid Insulation Boards are a critical parameter in the service life of this roofing assembly in that, if the Insulation Boards become detached, there is increased risk for complete roofing assembly failure. Foamed adhesive is a common alternative to traditional hot-mopped asphalt adhesive in contemporary roofing assemblies. The proper design and installation of Insulation Board roofing assemblies in foamed adhesive is paramount to the successful performance of these roofing assemblies. Some of the critical parameters that could influence foamed adhesive performance are: Insulation Board adhesive pattern defects; Insulation Board adhesive quantity; inadequate Insulation Board adhesive contact; and failure to maintain Insulation Board contact with the substrate until the Insulation adhesive is sufficiently set. The present paper discusses these critical parameters through case studies that clearly demonstrate how these parameters can lead to the failure of roofing assemblies, and discusses the lessons to be learned from these Insulation Board adhesion failures.