The Experts below are selected from a list of 131112 Experts worldwide ranked by ideXlab platform
Ching-ping Wong - One of the best experts on this subject based on the ideXlab platform.
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highly conductive flexible polyurethane based adhesives for flexible and printed electronics
2013Co-Authors: Zhuo Li, Kristen Hansen, Taoran Le, Rongwei Zhang, Kyoung-sik Moon, Ching-ping WongAbstract:Flexible interconnects are one of the key elements in realizing next-generation flexible electronics. While wire bonding Interconnection materials are being deployed and discussed widely, adhesives to support flip-chip and surface-mount Interconnections are less commonly used and reported. A polyurethane (PU)-based electrically conductive adhesive (ECA) is developed to meet all the requirements of flexible interconnects, including an ultralow bulk resistivity of ≈1.0 × 10−5 Ω cm that is maintained during bending, rolling, and compressing, good adhesion to various flexible substrates, and facile processing. The PU-ECA enables various Interconnection techniques in flexible and printed electronics: it can serve as a die-attach material for flip-chip, as vertical interconnect access (VIA)-filling and polymer bump materials for 3D integration, and as a conductive paste for wearable radio-frequency devices.
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highly conductive flexible polyurethane based adhesives for flexible and printed electronics
2013Co-Authors: Zhuo Li, Kristen Hansen, Taoran Le, Rongwei Zhang, Kyoung-sik Moon, Yan Liu, Ching-ping WongAbstract:Flexible interconnects are one of the key elements in realizing next-generation flexible electronics. While wire bonding Interconnection materials are being deployed and discussed widely, adhesives to support flip-chip and surface-mount Interconnections are less commonly used and reported. A polyurethane (PU)-based electrically conductive adhesive (ECA) is developed to meet all the requirements of flexible interconnects, including an ultralow bulk resistivity of ≈1.0 × 10−5 Ω cm that is maintained during bending, rolling, and compressing, good adhesion to various flexible substrates, and facile processing. The PU-ECA enables various Interconnection techniques in flexible and printed electronics: it can serve as a die-attach material for flip-chip, as vertical interconnect access (VIA)-filling and polymer bump materials for 3D integration, and as a conductive paste for wearable radio-frequency devices.
Zhuo Li - One of the best experts on this subject based on the ideXlab platform.
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highly conductive flexible polyurethane based adhesives for flexible and printed electronics
2013Co-Authors: Zhuo Li, Kristen Hansen, Taoran Le, Rongwei Zhang, Kyoung-sik Moon, Ching-ping WongAbstract:Flexible interconnects are one of the key elements in realizing next-generation flexible electronics. While wire bonding Interconnection materials are being deployed and discussed widely, adhesives to support flip-chip and surface-mount Interconnections are less commonly used and reported. A polyurethane (PU)-based electrically conductive adhesive (ECA) is developed to meet all the requirements of flexible interconnects, including an ultralow bulk resistivity of ≈1.0 × 10−5 Ω cm that is maintained during bending, rolling, and compressing, good adhesion to various flexible substrates, and facile processing. The PU-ECA enables various Interconnection techniques in flexible and printed electronics: it can serve as a die-attach material for flip-chip, as vertical interconnect access (VIA)-filling and polymer bump materials for 3D integration, and as a conductive paste for wearable radio-frequency devices.
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highly conductive flexible polyurethane based adhesives for flexible and printed electronics
2013Co-Authors: Zhuo Li, Kristen Hansen, Taoran Le, Rongwei Zhang, Kyoung-sik Moon, Yan Liu, Ching-ping WongAbstract:Flexible interconnects are one of the key elements in realizing next-generation flexible electronics. While wire bonding Interconnection materials are being deployed and discussed widely, adhesives to support flip-chip and surface-mount Interconnections are less commonly used and reported. A polyurethane (PU)-based electrically conductive adhesive (ECA) is developed to meet all the requirements of flexible interconnects, including an ultralow bulk resistivity of ≈1.0 × 10−5 Ω cm that is maintained during bending, rolling, and compressing, good adhesion to various flexible substrates, and facile processing. The PU-ECA enables various Interconnection techniques in flexible and printed electronics: it can serve as a die-attach material for flip-chip, as vertical interconnect access (VIA)-filling and polymer bump materials for 3D integration, and as a conductive paste for wearable radio-frequency devices.
Rongwei Zhang - One of the best experts on this subject based on the ideXlab platform.
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highly conductive flexible polyurethane based adhesives for flexible and printed electronics
2013Co-Authors: Zhuo Li, Kristen Hansen, Taoran Le, Rongwei Zhang, Kyoung-sik Moon, Ching-ping WongAbstract:Flexible interconnects are one of the key elements in realizing next-generation flexible electronics. While wire bonding Interconnection materials are being deployed and discussed widely, adhesives to support flip-chip and surface-mount Interconnections are less commonly used and reported. A polyurethane (PU)-based electrically conductive adhesive (ECA) is developed to meet all the requirements of flexible interconnects, including an ultralow bulk resistivity of ≈1.0 × 10−5 Ω cm that is maintained during bending, rolling, and compressing, good adhesion to various flexible substrates, and facile processing. The PU-ECA enables various Interconnection techniques in flexible and printed electronics: it can serve as a die-attach material for flip-chip, as vertical interconnect access (VIA)-filling and polymer bump materials for 3D integration, and as a conductive paste for wearable radio-frequency devices.
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highly conductive flexible polyurethane based adhesives for flexible and printed electronics
2013Co-Authors: Zhuo Li, Kristen Hansen, Taoran Le, Rongwei Zhang, Kyoung-sik Moon, Yan Liu, Ching-ping WongAbstract:Flexible interconnects are one of the key elements in realizing next-generation flexible electronics. While wire bonding Interconnection materials are being deployed and discussed widely, adhesives to support flip-chip and surface-mount Interconnections are less commonly used and reported. A polyurethane (PU)-based electrically conductive adhesive (ECA) is developed to meet all the requirements of flexible interconnects, including an ultralow bulk resistivity of ≈1.0 × 10−5 Ω cm that is maintained during bending, rolling, and compressing, good adhesion to various flexible substrates, and facile processing. The PU-ECA enables various Interconnection techniques in flexible and printed electronics: it can serve as a die-attach material for flip-chip, as vertical interconnect access (VIA)-filling and polymer bump materials for 3D integration, and as a conductive paste for wearable radio-frequency devices.
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low temperature low profile ultra fine pitch copper to copper chip last embedded active Interconnection technology
2010Co-Authors: Abhishek Choudhury, Rongwei Zhang, Nitesh Kumbhat, Markondeya P Raj, Venky Sundaram, Rajiv Dunne, Mario Bolanosavila, C P Wong, Rao TummalaAbstract:In a continuous drive to achieve low form-factor packages, chip-to-package Interconnections have evolved from the conventional solders to a more hybrid technology consisting of copper and solder. However, scaling down the bump pitch to increase the interconnect density poses serious reliability and yield issues. In the previous, a low-profile interconnect architecture, ~20µm total height, was demonstrated comprising of copper-to-copper Interconnection and novel adhesive materials. This paper focuses on: (1) design and fabrication of test vehicles to assess the robustness of the interconnect architecture, (2) assembly process development for copper-to-copper Interconnections, and (3) reliability and failure analysis of the Interconnection. Excellent reliability results are demonstrated under thermal cycling test (TCT) using non-conductive films (NCF) as adhesive. This interconnect scheme is also shown to perform well with different die sizes, die thicknesses and with embedded dies thus offering a great potential for integration with flip chip packages as well as with chip-last embedded active chips in organic substrates. A simple and reliable low-cost and low-temperature direct Cu-Cu bonding is thus demonstrated for the first time.
Taoran Le - One of the best experts on this subject based on the ideXlab platform.
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highly conductive flexible polyurethane based adhesives for flexible and printed electronics
2013Co-Authors: Zhuo Li, Kristen Hansen, Taoran Le, Rongwei Zhang, Kyoung-sik Moon, Ching-ping WongAbstract:Flexible interconnects are one of the key elements in realizing next-generation flexible electronics. While wire bonding Interconnection materials are being deployed and discussed widely, adhesives to support flip-chip and surface-mount Interconnections are less commonly used and reported. A polyurethane (PU)-based electrically conductive adhesive (ECA) is developed to meet all the requirements of flexible interconnects, including an ultralow bulk resistivity of ≈1.0 × 10−5 Ω cm that is maintained during bending, rolling, and compressing, good adhesion to various flexible substrates, and facile processing. The PU-ECA enables various Interconnection techniques in flexible and printed electronics: it can serve as a die-attach material for flip-chip, as vertical interconnect access (VIA)-filling and polymer bump materials for 3D integration, and as a conductive paste for wearable radio-frequency devices.
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highly conductive flexible polyurethane based adhesives for flexible and printed electronics
2013Co-Authors: Zhuo Li, Kristen Hansen, Taoran Le, Rongwei Zhang, Kyoung-sik Moon, Yan Liu, Ching-ping WongAbstract:Flexible interconnects are one of the key elements in realizing next-generation flexible electronics. While wire bonding Interconnection materials are being deployed and discussed widely, adhesives to support flip-chip and surface-mount Interconnections are less commonly used and reported. A polyurethane (PU)-based electrically conductive adhesive (ECA) is developed to meet all the requirements of flexible interconnects, including an ultralow bulk resistivity of ≈1.0 × 10−5 Ω cm that is maintained during bending, rolling, and compressing, good adhesion to various flexible substrates, and facile processing. The PU-ECA enables various Interconnection techniques in flexible and printed electronics: it can serve as a die-attach material for flip-chip, as vertical interconnect access (VIA)-filling and polymer bump materials for 3D integration, and as a conductive paste for wearable radio-frequency devices.
Kyoung-sik Moon - One of the best experts on this subject based on the ideXlab platform.
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highly conductive flexible polyurethane based adhesives for flexible and printed electronics
2013Co-Authors: Zhuo Li, Kristen Hansen, Taoran Le, Rongwei Zhang, Kyoung-sik Moon, Ching-ping WongAbstract:Flexible interconnects are one of the key elements in realizing next-generation flexible electronics. While wire bonding Interconnection materials are being deployed and discussed widely, adhesives to support flip-chip and surface-mount Interconnections are less commonly used and reported. A polyurethane (PU)-based electrically conductive adhesive (ECA) is developed to meet all the requirements of flexible interconnects, including an ultralow bulk resistivity of ≈1.0 × 10−5 Ω cm that is maintained during bending, rolling, and compressing, good adhesion to various flexible substrates, and facile processing. The PU-ECA enables various Interconnection techniques in flexible and printed electronics: it can serve as a die-attach material for flip-chip, as vertical interconnect access (VIA)-filling and polymer bump materials for 3D integration, and as a conductive paste for wearable radio-frequency devices.
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highly conductive flexible polyurethane based adhesives for flexible and printed electronics
2013Co-Authors: Zhuo Li, Kristen Hansen, Taoran Le, Rongwei Zhang, Kyoung-sik Moon, Yan Liu, Ching-ping WongAbstract:Flexible interconnects are one of the key elements in realizing next-generation flexible electronics. While wire bonding Interconnection materials are being deployed and discussed widely, adhesives to support flip-chip and surface-mount Interconnections are less commonly used and reported. A polyurethane (PU)-based electrically conductive adhesive (ECA) is developed to meet all the requirements of flexible interconnects, including an ultralow bulk resistivity of ≈1.0 × 10−5 Ω cm that is maintained during bending, rolling, and compressing, good adhesion to various flexible substrates, and facile processing. The PU-ECA enables various Interconnection techniques in flexible and printed electronics: it can serve as a die-attach material for flip-chip, as vertical interconnect access (VIA)-filling and polymer bump materials for 3D integration, and as a conductive paste for wearable radio-frequency devices.
