The Experts below are selected from a list of 19602 Experts worldwide ranked by ideXlab platform
Shakeel Safdar - One of the best experts on this subject based on the ideXlab platform.
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the effect of material thickness Laser power and cutting speed on cut path deviation in high power diode Laser Chip free cutting of glass
Optics and Laser Technology, 2010Co-Authors: Salman Nisar, Mohammad Sheikh, Shakeel SafdarAbstract:In the Laser cleaving of brittle materials, using controlled fracture technique, thermal stresses are used to induce the crack and the material is separated along the cutting path by extending the crack. One of the problems in Laser cutting of glass with this technique is the cut path deviation at the leading and the trailing edges of the glass sheet. Previous work has shown this deviation to be partly due to the high magnitudes of thermal stresses generated near the edges of the sheet. This paper reports on the experimental results of the effects of glass thickness, Laser power and the cutting speed on cut path deviation in diode Laser cutting of glass. Finite element modelling of the cutting process has also been used to simulate the transient effects of the moving beam and predict thermal fields and stress distributions. These predictions are validated against the experimental data and are used to explain the process mechanisms. It is shown that an increase in the thickness of the glass sheet for the same power and cutting speed or an increase in the cutting speed with constant power and a given sheet thickness results in smaller cut path deviations at the leading and trailing edges of the glass sheet.
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The Effect of Laser Beam Geometry on Cut Path Deviation in Diode Laser Chip-Free Cutting of Glass
Journal of Manufacturing Science and Engineering, 2010Co-Authors: Salman Nisar, Mohammad A. Sheikh, Andrew J. Pinkerton, Lin Li, Shakeel SafdarAbstract:In Laser cleaving of brittle materials using the controlled fracture technique, thermal stresses are used to induce a single crack and the material is separated along the cutting path by extending the crack. One of the problems in Laser cutting of glass with the controlled fracture technique is the cut deviation at the leading and the trailing edges of the glass sheet. This work is about minimizing this deviation through an optimization process, which includes Laser beam geometry. It has been established that the thermal stresses generated during Laser scanning are strongly dependent upon Laser beam geometry. Experimental techniques are used to quantify cut deviation for soda-lime glass sheets under a set of conditions while finite element modeling is used to optimize the process and reduce (or eliminate) cut deviation. The experimental results of the effect of different Laser beam geometries on cut path deviation have been presented in this study, along with the finite element modeling of the cutting process to simulate the transient effects of the moving beam and predict thermal fields and stress distribution. These predictions are compared with the experimental data. In comparison to other beam geometries, the triangular-forward beam at the leading edge and triangular-reverse and circular beam geometry at the trailing edge produces lower tensile stresses (sigma(xx)) and hence minimizes the cut path deviation. The work also shows that beam divergence inside the glass plays a significant role in changing the cut path deviation at the bottom leading and trailing edges of the glass.
Salman Nisar - One of the best experts on this subject based on the ideXlab platform.
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the effect of material thickness Laser power and cutting speed on cut path deviation in high power diode Laser Chip free cutting of glass
Optics and Laser Technology, 2010Co-Authors: Salman Nisar, Mohammad Sheikh, Shakeel SafdarAbstract:In the Laser cleaving of brittle materials, using controlled fracture technique, thermal stresses are used to induce the crack and the material is separated along the cutting path by extending the crack. One of the problems in Laser cutting of glass with this technique is the cut path deviation at the leading and the trailing edges of the glass sheet. Previous work has shown this deviation to be partly due to the high magnitudes of thermal stresses generated near the edges of the sheet. This paper reports on the experimental results of the effects of glass thickness, Laser power and the cutting speed on cut path deviation in diode Laser cutting of glass. Finite element modelling of the cutting process has also been used to simulate the transient effects of the moving beam and predict thermal fields and stress distributions. These predictions are validated against the experimental data and are used to explain the process mechanisms. It is shown that an increase in the thickness of the glass sheet for the same power and cutting speed or an increase in the cutting speed with constant power and a given sheet thickness results in smaller cut path deviations at the leading and trailing edges of the glass sheet.
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The Effect of Laser Beam Geometry on Cut Path Deviation in Diode Laser Chip-Free Cutting of Glass
Journal of Manufacturing Science and Engineering, 2010Co-Authors: Salman Nisar, Mohammad A. Sheikh, Andrew J. Pinkerton, Lin Li, Shakeel SafdarAbstract:In Laser cleaving of brittle materials using the controlled fracture technique, thermal stresses are used to induce a single crack and the material is separated along the cutting path by extending the crack. One of the problems in Laser cutting of glass with the controlled fracture technique is the cut deviation at the leading and the trailing edges of the glass sheet. This work is about minimizing this deviation through an optimization process, which includes Laser beam geometry. It has been established that the thermal stresses generated during Laser scanning are strongly dependent upon Laser beam geometry. Experimental techniques are used to quantify cut deviation for soda-lime glass sheets under a set of conditions while finite element modeling is used to optimize the process and reduce (or eliminate) cut deviation. The experimental results of the effect of different Laser beam geometries on cut path deviation have been presented in this study, along with the finite element modeling of the cutting process to simulate the transient effects of the moving beam and predict thermal fields and stress distribution. These predictions are compared with the experimental data. In comparison to other beam geometries, the triangular-forward beam at the leading edge and triangular-reverse and circular beam geometry at the trailing edge produces lower tensile stresses (sigma(xx)) and hence minimizes the cut path deviation. The work also shows that beam divergence inside the glass plays a significant role in changing the cut path deviation at the bottom leading and trailing edges of the glass.
Yunchih Lee - One of the best experts on this subject based on the ideXlab platform.
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Chip level 1 times 2 optical interconnects using polymer vertical splitter on silicon substrate
IEEE Photonics Journal, 2014Co-Authors: Chinta Chen, Pokuan Shen, Tengzhang Zhu, Chiachi Chang, Shushuan Lin, Maoyuan Zeng, Chienyu Chiu, Hsuliang Hsiao, Hsiaochin Lan, Yunchih LeeAbstract:The Chip-level 1 × 2 optical interconnects using the polymer vertical splitter developed on a silicon substrate are demonstrated. The 1 × 2 vertical-splitting configuration is realized using a polymer waveguide terminated at three silicon 45 ° reflectors. The high-frequency transmission lines combined with the indium solder bumps are developed to flip-Chip assemble a vertical-cavity surface-emitting Laser Chip at the input port and two photodetector Chips at two output ports. Total transmission loss of -3.26 dB with a splitting ratio of 1 : 1 for the proposed splitter is experimentally obtained. A 10-Gbit/s data transmission with bit error rates better than 10-12 for two output ports is achieved. It reveals that such Chip-level 1 × 2 optical interconnects using the polymer vertical splitter are suitable for high-speed data transmission with multiple output ports.
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polymer waveguide based optical circuit with two vertical transition output ports realized on silicon substrate for optical interconnects
IEEE Photonics Journal, 2013Co-Authors: Chinta Chen, Pokuan Shen, Tengzhang Zhu, Chiachi Chang, Hsuliang Hsiao, Hsiaochin Lan, Yunchih Lee, Tienyu Huang, Yoshen LinAbstract:A polymer-waveguide-based optical circuit with two vertical-transition output ports for the optical interconnects is demonstrated on a silicon substrate. Such a 1 × 2 vertical splitter is realized using a polymer waveguide monolithically integrated with three silicon 45° microreflectors. The vertical-cavity surface-emitting Laser Chip assembled at the input port and two multimode fibers located at two output ports are arranged to demonstrate a two-port optical proximity coupling of the off-Chip optical interconnects based on the proposed splitter. The optical insertion loss of -6.6 dB is experimentally obtained for the proposed 1 × 2 vertical splitter with a splitting ratio of 1.3 : 1. The clearly 10-Gb/s optical eye patterns at both output ports verify that the 1 × 2 vertical splitter is suitable for the optical interconnects with multiple output ports.
Chinta Chen - One of the best experts on this subject based on the ideXlab platform.
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Chip level 1 times 2 optical interconnects using polymer vertical splitter on silicon substrate
IEEE Photonics Journal, 2014Co-Authors: Chinta Chen, Pokuan Shen, Tengzhang Zhu, Chiachi Chang, Shushuan Lin, Maoyuan Zeng, Chienyu Chiu, Hsuliang Hsiao, Hsiaochin Lan, Yunchih LeeAbstract:The Chip-level 1 × 2 optical interconnects using the polymer vertical splitter developed on a silicon substrate are demonstrated. The 1 × 2 vertical-splitting configuration is realized using a polymer waveguide terminated at three silicon 45 ° reflectors. The high-frequency transmission lines combined with the indium solder bumps are developed to flip-Chip assemble a vertical-cavity surface-emitting Laser Chip at the input port and two photodetector Chips at two output ports. Total transmission loss of -3.26 dB with a splitting ratio of 1 : 1 for the proposed splitter is experimentally obtained. A 10-Gbit/s data transmission with bit error rates better than 10-12 for two output ports is achieved. It reveals that such Chip-level 1 × 2 optical interconnects using the polymer vertical splitter are suitable for high-speed data transmission with multiple output ports.
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polymer waveguide based optical circuit with two vertical transition output ports realized on silicon substrate for optical interconnects
IEEE Photonics Journal, 2013Co-Authors: Chinta Chen, Pokuan Shen, Tengzhang Zhu, Chiachi Chang, Hsuliang Hsiao, Hsiaochin Lan, Yunchih Lee, Tienyu Huang, Yoshen LinAbstract:A polymer-waveguide-based optical circuit with two vertical-transition output ports for the optical interconnects is demonstrated on a silicon substrate. Such a 1 × 2 vertical splitter is realized using a polymer waveguide monolithically integrated with three silicon 45° microreflectors. The vertical-cavity surface-emitting Laser Chip assembled at the input port and two multimode fibers located at two output ports are arranged to demonstrate a two-port optical proximity coupling of the off-Chip optical interconnects based on the proposed splitter. The optical insertion loss of -6.6 dB is experimentally obtained for the proposed 1 × 2 vertical splitter with a splitting ratio of 1.3 : 1. The clearly 10-Gb/s optical eye patterns at both output ports verify that the 1 × 2 vertical splitter is suitable for the optical interconnects with multiple output ports.
Mohammad A. Sheikh - One of the best experts on this subject based on the ideXlab platform.
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The Effect of Laser Beam Geometry on Cut Path Deviation in Diode Laser Chip-Free Cutting of Glass
Journal of Manufacturing Science and Engineering, 2010Co-Authors: Salman Nisar, Mohammad A. Sheikh, Andrew J. Pinkerton, Lin Li, Shakeel SafdarAbstract:In Laser cleaving of brittle materials using the controlled fracture technique, thermal stresses are used to induce a single crack and the material is separated along the cutting path by extending the crack. One of the problems in Laser cutting of glass with the controlled fracture technique is the cut deviation at the leading and the trailing edges of the glass sheet. This work is about minimizing this deviation through an optimization process, which includes Laser beam geometry. It has been established that the thermal stresses generated during Laser scanning are strongly dependent upon Laser beam geometry. Experimental techniques are used to quantify cut deviation for soda-lime glass sheets under a set of conditions while finite element modeling is used to optimize the process and reduce (or eliminate) cut deviation. The experimental results of the effect of different Laser beam geometries on cut path deviation have been presented in this study, along with the finite element modeling of the cutting process to simulate the transient effects of the moving beam and predict thermal fields and stress distribution. These predictions are compared with the experimental data. In comparison to other beam geometries, the triangular-forward beam at the leading edge and triangular-reverse and circular beam geometry at the trailing edge produces lower tensile stresses (sigma(xx)) and hence minimizes the cut path deviation. The work also shows that beam divergence inside the glass plays a significant role in changing the cut path deviation at the bottom leading and trailing edges of the glass.
