The Experts below are selected from a list of 10395 Experts worldwide ranked by ideXlab platform
Hiroaki Sanjoh - One of the best experts on this subject based on the ideXlab platform.
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equalizer free transmission of 100 gb s 4 pam signal generated by flip chip interconnection eadfb Laser Module
Journal of Lightwave Technology, 2017Co-Authors: Shigeru Kanazawa, Yasuhiko Nakanishi, Hiroshi Yamazaki, Yuta Ueda, Wataru Kobayashi, Yoshifumi Muramoto, H Ishii, Satoshi Tsunashima, Hiroaki SanjohAbstract:We fabricated a flip-chip interconnection lumped-electrode EADFB Laser Module and an optical receiver that includes a broadband electrical amplifier. Both have a 3-dB bandwidth of more than 50 GHz. Under 53.2-Gbaud 4-PAM (107 Gb/s) operation, clear eye openings were obtained without an equalizer even after a 2-km SMF transmission, and we obtained a BER of less than 2 × 10−4 under error-free conditions using KP4 FEC without an equalizer also after a 2-km SMF transmission.
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214 gb s 4 pam operation of flip chip interconnection eadfb Laser Module
Journal of Lightwave Technology, 2017Co-Authors: Shigeru Kanazawa, Yasuhiko Nakanishi, Hiroshi Yamazaki, Yuta Ueda, Wataru Kobayashi, Yoshifumi Muramoto, H Ishii, Hiroaki SanjohAbstract:We fabricated a Hi-FIT LE-EADFB Laser Module. Hi-FIT, which is a wire-free interconnection technique, provides a higher modulation bandwidth and a flatter frequency response than a conventional wire interconnection technique. The fabricated Module has a 3-dB bandwidth of about 59 GHz and a sufficiently flat frequency response of less than 45 GHz. Using this Module, we demonstrated a single-wavelength single-polarization direct-detection 4-PAM transmission with a record net data rate of 200 Gb/s. And with 4-PAM operation at 214 Gb/s, we obtained a BER of less than 3.8 × 10–3, which is an error-free condition using a 7%-OH HD-FEC code, even after a 10-km SMF transmission.
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56 gbaud 4 pam 112 gbit s operation of flip chip interconnection lumped electrode eadfb Laser Module for equalizer free transmission
Optical Fiber Communication Conference, 2016Co-Authors: Shigeru Kanazawa, Takeshi Fujisawa, Kiyoto Takahata, Yasuhiko Nakanishi, Hiroshi Yamazaki, Yuta Ueda, Wataru Kobayashi, Yoshifumi Muramoto, H Ishii, Hiroaki SanjohAbstract:We fabricated a lumped-electrode type EADFB Laser Module using a flip-chip interconnection technique which provides a large modulation bandwidth. We obtained clear 56-Gbaud 4-PAM signal after 10-km SMF transmission with no equalizer using this Module.
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transmission of 214 gbit s 4 pam signal using an ultra broadband lumped electrode eadfb Laser Module
Optical Fiber Communication Conference, 2016Co-Authors: Shigeru Kanazawa, Takeshi Fujisawa, Kiyoto Takahata, Yasuhiko Nakanishi, Hiroshi Yamazaki, Yuta Ueda, Wataru Kobayashi, Yoshifumi Muramoto, H Ishii, Hiroaki SanjohAbstract:Using a lumped-electrode EADFB Laser with a modulation bandwidth of ∼59 GHz, we demonstrated single-wavelength single-polarization direct-detection 4-PAM transmission with the record net data rate of 200 Gbit/s.
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flip chip interconnection lumped electrode eadfb Laser for 100 gb s lambda transmitter
IEEE Photonics Technology Letters, 2015Co-Authors: Shigeru Kanazawa, Takeshi Fujisawa, Kiyoto Takahata, Yuta Ueda, Wataru Kobayashi, H Ishii, Toshio Ito, Hiroaki SanjohAbstract:We have achieved the 100-Gb/s/ $\lambda $ operation of a flip-chip interconnection 1.3- $\mu \text{m}$ lumped-electrode electroabsorption modulator integrated with a distributed feedback Laser Module for the first time. The flip-chip interconnection provides a flatter frequency response characteristic and a higher modulation bandwidth. Clear eye opening was achieved for 103-Gb/s nonreturn to zero and equalizer-free 56-GBd 4-pulse-amplitude modulation operation after a 10-km single-mode fiber transmission.
Shigeru Kanazawa - One of the best experts on this subject based on the ideXlab platform.
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equalizer free transmission of 100 gb s 4 pam signal generated by flip chip interconnection eadfb Laser Module
Journal of Lightwave Technology, 2017Co-Authors: Shigeru Kanazawa, Yasuhiko Nakanishi, Hiroshi Yamazaki, Yuta Ueda, Wataru Kobayashi, Yoshifumi Muramoto, H Ishii, Satoshi Tsunashima, Hiroaki SanjohAbstract:We fabricated a flip-chip interconnection lumped-electrode EADFB Laser Module and an optical receiver that includes a broadband electrical amplifier. Both have a 3-dB bandwidth of more than 50 GHz. Under 53.2-Gbaud 4-PAM (107 Gb/s) operation, clear eye openings were obtained without an equalizer even after a 2-km SMF transmission, and we obtained a BER of less than 2 × 10−4 under error-free conditions using KP4 FEC without an equalizer also after a 2-km SMF transmission.
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214 gb s 4 pam operation of flip chip interconnection eadfb Laser Module
Journal of Lightwave Technology, 2017Co-Authors: Shigeru Kanazawa, Yasuhiko Nakanishi, Hiroshi Yamazaki, Yuta Ueda, Wataru Kobayashi, Yoshifumi Muramoto, H Ishii, Hiroaki SanjohAbstract:We fabricated a Hi-FIT LE-EADFB Laser Module. Hi-FIT, which is a wire-free interconnection technique, provides a higher modulation bandwidth and a flatter frequency response than a conventional wire interconnection technique. The fabricated Module has a 3-dB bandwidth of about 59 GHz and a sufficiently flat frequency response of less than 45 GHz. Using this Module, we demonstrated a single-wavelength single-polarization direct-detection 4-PAM transmission with a record net data rate of 200 Gb/s. And with 4-PAM operation at 214 Gb/s, we obtained a BER of less than 3.8 × 10–3, which is an error-free condition using a 7%-OH HD-FEC code, even after a 10-km SMF transmission.
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56 gbaud 4 pam 112 gbit s operation of flip chip interconnection lumped electrode eadfb Laser Module for equalizer free transmission
Optical Fiber Communication Conference, 2016Co-Authors: Shigeru Kanazawa, Takeshi Fujisawa, Kiyoto Takahata, Yasuhiko Nakanishi, Hiroshi Yamazaki, Yuta Ueda, Wataru Kobayashi, Yoshifumi Muramoto, H Ishii, Hiroaki SanjohAbstract:We fabricated a lumped-electrode type EADFB Laser Module using a flip-chip interconnection technique which provides a large modulation bandwidth. We obtained clear 56-Gbaud 4-PAM signal after 10-km SMF transmission with no equalizer using this Module.
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transmission of 214 gbit s 4 pam signal using an ultra broadband lumped electrode eadfb Laser Module
Optical Fiber Communication Conference, 2016Co-Authors: Shigeru Kanazawa, Takeshi Fujisawa, Kiyoto Takahata, Yasuhiko Nakanishi, Hiroshi Yamazaki, Yuta Ueda, Wataru Kobayashi, Yoshifumi Muramoto, H Ishii, Hiroaki SanjohAbstract:Using a lumped-electrode EADFB Laser with a modulation bandwidth of ∼59 GHz, we demonstrated single-wavelength single-polarization direct-detection 4-PAM transmission with the record net data rate of 200 Gbit/s.
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flip chip interconnection lumped electrode eadfb Laser for 100 gb s lambda transmitter
IEEE Photonics Technology Letters, 2015Co-Authors: Shigeru Kanazawa, Takeshi Fujisawa, Kiyoto Takahata, Yuta Ueda, Wataru Kobayashi, H Ishii, Toshio Ito, Hiroaki SanjohAbstract:We have achieved the 100-Gb/s/ $\lambda $ operation of a flip-chip interconnection 1.3- $\mu \text{m}$ lumped-electrode electroabsorption modulator integrated with a distributed feedback Laser Module for the first time. The flip-chip interconnection provides a flatter frequency response characteristic and a higher modulation bandwidth. Clear eye opening was achieved for 103-Gb/s nonreturn to zero and equalizer-free 56-GBd 4-pulse-amplitude modulation operation after a 10-km single-mode fiber transmission.
H Ishii - One of the best experts on this subject based on the ideXlab platform.
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equalizer free transmission of 100 gb s 4 pam signal generated by flip chip interconnection eadfb Laser Module
Journal of Lightwave Technology, 2017Co-Authors: Shigeru Kanazawa, Yasuhiko Nakanishi, Hiroshi Yamazaki, Yuta Ueda, Wataru Kobayashi, Yoshifumi Muramoto, H Ishii, Satoshi Tsunashima, Hiroaki SanjohAbstract:We fabricated a flip-chip interconnection lumped-electrode EADFB Laser Module and an optical receiver that includes a broadband electrical amplifier. Both have a 3-dB bandwidth of more than 50 GHz. Under 53.2-Gbaud 4-PAM (107 Gb/s) operation, clear eye openings were obtained without an equalizer even after a 2-km SMF transmission, and we obtained a BER of less than 2 × 10−4 under error-free conditions using KP4 FEC without an equalizer also after a 2-km SMF transmission.
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214 gb s 4 pam operation of flip chip interconnection eadfb Laser Module
Journal of Lightwave Technology, 2017Co-Authors: Shigeru Kanazawa, Yasuhiko Nakanishi, Hiroshi Yamazaki, Yuta Ueda, Wataru Kobayashi, Yoshifumi Muramoto, H Ishii, Hiroaki SanjohAbstract:We fabricated a Hi-FIT LE-EADFB Laser Module. Hi-FIT, which is a wire-free interconnection technique, provides a higher modulation bandwidth and a flatter frequency response than a conventional wire interconnection technique. The fabricated Module has a 3-dB bandwidth of about 59 GHz and a sufficiently flat frequency response of less than 45 GHz. Using this Module, we demonstrated a single-wavelength single-polarization direct-detection 4-PAM transmission with a record net data rate of 200 Gb/s. And with 4-PAM operation at 214 Gb/s, we obtained a BER of less than 3.8 × 10–3, which is an error-free condition using a 7%-OH HD-FEC code, even after a 10-km SMF transmission.
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56 gbaud 4 pam 112 gbit s operation of flip chip interconnection lumped electrode eadfb Laser Module for equalizer free transmission
Optical Fiber Communication Conference, 2016Co-Authors: Shigeru Kanazawa, Takeshi Fujisawa, Kiyoto Takahata, Yasuhiko Nakanishi, Hiroshi Yamazaki, Yuta Ueda, Wataru Kobayashi, Yoshifumi Muramoto, H Ishii, Hiroaki SanjohAbstract:We fabricated a lumped-electrode type EADFB Laser Module using a flip-chip interconnection technique which provides a large modulation bandwidth. We obtained clear 56-Gbaud 4-PAM signal after 10-km SMF transmission with no equalizer using this Module.
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transmission of 214 gbit s 4 pam signal using an ultra broadband lumped electrode eadfb Laser Module
Optical Fiber Communication Conference, 2016Co-Authors: Shigeru Kanazawa, Takeshi Fujisawa, Kiyoto Takahata, Yasuhiko Nakanishi, Hiroshi Yamazaki, Yuta Ueda, Wataru Kobayashi, Yoshifumi Muramoto, H Ishii, Hiroaki SanjohAbstract:Using a lumped-electrode EADFB Laser with a modulation bandwidth of ∼59 GHz, we demonstrated single-wavelength single-polarization direct-detection 4-PAM transmission with the record net data rate of 200 Gbit/s.
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flip chip interconnection lumped electrode eadfb Laser for 100 gb s lambda transmitter
IEEE Photonics Technology Letters, 2015Co-Authors: Shigeru Kanazawa, Takeshi Fujisawa, Kiyoto Takahata, Yuta Ueda, Wataru Kobayashi, H Ishii, Toshio Ito, Hiroaki SanjohAbstract:We have achieved the 100-Gb/s/ $\lambda $ operation of a flip-chip interconnection 1.3- $\mu \text{m}$ lumped-electrode electroabsorption modulator integrated with a distributed feedback Laser Module for the first time. The flip-chip interconnection provides a flatter frequency response characteristic and a higher modulation bandwidth. Clear eye opening was achieved for 103-Gb/s nonreturn to zero and equalizer-free 56-GBd 4-pulse-amplitude modulation operation after a 10-km single-mode fiber transmission.
Yuta Ueda - One of the best experts on this subject based on the ideXlab platform.
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equalizer free transmission of 100 gb s 4 pam signal generated by flip chip interconnection eadfb Laser Module
Journal of Lightwave Technology, 2017Co-Authors: Shigeru Kanazawa, Yasuhiko Nakanishi, Hiroshi Yamazaki, Yuta Ueda, Wataru Kobayashi, Yoshifumi Muramoto, H Ishii, Satoshi Tsunashima, Hiroaki SanjohAbstract:We fabricated a flip-chip interconnection lumped-electrode EADFB Laser Module and an optical receiver that includes a broadband electrical amplifier. Both have a 3-dB bandwidth of more than 50 GHz. Under 53.2-Gbaud 4-PAM (107 Gb/s) operation, clear eye openings were obtained without an equalizer even after a 2-km SMF transmission, and we obtained a BER of less than 2 × 10−4 under error-free conditions using KP4 FEC without an equalizer also after a 2-km SMF transmission.
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214 gb s 4 pam operation of flip chip interconnection eadfb Laser Module
Journal of Lightwave Technology, 2017Co-Authors: Shigeru Kanazawa, Yasuhiko Nakanishi, Hiroshi Yamazaki, Yuta Ueda, Wataru Kobayashi, Yoshifumi Muramoto, H Ishii, Hiroaki SanjohAbstract:We fabricated a Hi-FIT LE-EADFB Laser Module. Hi-FIT, which is a wire-free interconnection technique, provides a higher modulation bandwidth and a flatter frequency response than a conventional wire interconnection technique. The fabricated Module has a 3-dB bandwidth of about 59 GHz and a sufficiently flat frequency response of less than 45 GHz. Using this Module, we demonstrated a single-wavelength single-polarization direct-detection 4-PAM transmission with a record net data rate of 200 Gb/s. And with 4-PAM operation at 214 Gb/s, we obtained a BER of less than 3.8 × 10–3, which is an error-free condition using a 7%-OH HD-FEC code, even after a 10-km SMF transmission.
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56 gbaud 4 pam 112 gbit s operation of flip chip interconnection lumped electrode eadfb Laser Module for equalizer free transmission
Optical Fiber Communication Conference, 2016Co-Authors: Shigeru Kanazawa, Takeshi Fujisawa, Kiyoto Takahata, Yasuhiko Nakanishi, Hiroshi Yamazaki, Yuta Ueda, Wataru Kobayashi, Yoshifumi Muramoto, H Ishii, Hiroaki SanjohAbstract:We fabricated a lumped-electrode type EADFB Laser Module using a flip-chip interconnection technique which provides a large modulation bandwidth. We obtained clear 56-Gbaud 4-PAM signal after 10-km SMF transmission with no equalizer using this Module.
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transmission of 214 gbit s 4 pam signal using an ultra broadband lumped electrode eadfb Laser Module
Optical Fiber Communication Conference, 2016Co-Authors: Shigeru Kanazawa, Takeshi Fujisawa, Kiyoto Takahata, Yasuhiko Nakanishi, Hiroshi Yamazaki, Yuta Ueda, Wataru Kobayashi, Yoshifumi Muramoto, H Ishii, Hiroaki SanjohAbstract:Using a lumped-electrode EADFB Laser with a modulation bandwidth of ∼59 GHz, we demonstrated single-wavelength single-polarization direct-detection 4-PAM transmission with the record net data rate of 200 Gbit/s.
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flip chip interconnection lumped electrode eadfb Laser for 100 gb s lambda transmitter
IEEE Photonics Technology Letters, 2015Co-Authors: Shigeru Kanazawa, Takeshi Fujisawa, Kiyoto Takahata, Yuta Ueda, Wataru Kobayashi, H Ishii, Toshio Ito, Hiroaki SanjohAbstract:We have achieved the 100-Gb/s/ $\lambda $ operation of a flip-chip interconnection 1.3- $\mu \text{m}$ lumped-electrode electroabsorption modulator integrated with a distributed feedback Laser Module for the first time. The flip-chip interconnection provides a flatter frequency response characteristic and a higher modulation bandwidth. Clear eye opening was achieved for 103-Gb/s nonreturn to zero and equalizer-free 56-GBd 4-pulse-amplitude modulation operation after a 10-km single-mode fiber transmission.
Wataru Kobayashi - One of the best experts on this subject based on the ideXlab platform.
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equalizer free transmission of 100 gb s 4 pam signal generated by flip chip interconnection eadfb Laser Module
Journal of Lightwave Technology, 2017Co-Authors: Shigeru Kanazawa, Yasuhiko Nakanishi, Hiroshi Yamazaki, Yuta Ueda, Wataru Kobayashi, Yoshifumi Muramoto, H Ishii, Satoshi Tsunashima, Hiroaki SanjohAbstract:We fabricated a flip-chip interconnection lumped-electrode EADFB Laser Module and an optical receiver that includes a broadband electrical amplifier. Both have a 3-dB bandwidth of more than 50 GHz. Under 53.2-Gbaud 4-PAM (107 Gb/s) operation, clear eye openings were obtained without an equalizer even after a 2-km SMF transmission, and we obtained a BER of less than 2 × 10−4 under error-free conditions using KP4 FEC without an equalizer also after a 2-km SMF transmission.
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214 gb s 4 pam operation of flip chip interconnection eadfb Laser Module
Journal of Lightwave Technology, 2017Co-Authors: Shigeru Kanazawa, Yasuhiko Nakanishi, Hiroshi Yamazaki, Yuta Ueda, Wataru Kobayashi, Yoshifumi Muramoto, H Ishii, Hiroaki SanjohAbstract:We fabricated a Hi-FIT LE-EADFB Laser Module. Hi-FIT, which is a wire-free interconnection technique, provides a higher modulation bandwidth and a flatter frequency response than a conventional wire interconnection technique. The fabricated Module has a 3-dB bandwidth of about 59 GHz and a sufficiently flat frequency response of less than 45 GHz. Using this Module, we demonstrated a single-wavelength single-polarization direct-detection 4-PAM transmission with a record net data rate of 200 Gb/s. And with 4-PAM operation at 214 Gb/s, we obtained a BER of less than 3.8 × 10–3, which is an error-free condition using a 7%-OH HD-FEC code, even after a 10-km SMF transmission.
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56 gbaud 4 pam 112 gbit s operation of flip chip interconnection lumped electrode eadfb Laser Module for equalizer free transmission
Optical Fiber Communication Conference, 2016Co-Authors: Shigeru Kanazawa, Takeshi Fujisawa, Kiyoto Takahata, Yasuhiko Nakanishi, Hiroshi Yamazaki, Yuta Ueda, Wataru Kobayashi, Yoshifumi Muramoto, H Ishii, Hiroaki SanjohAbstract:We fabricated a lumped-electrode type EADFB Laser Module using a flip-chip interconnection technique which provides a large modulation bandwidth. We obtained clear 56-Gbaud 4-PAM signal after 10-km SMF transmission with no equalizer using this Module.
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transmission of 214 gbit s 4 pam signal using an ultra broadband lumped electrode eadfb Laser Module
Optical Fiber Communication Conference, 2016Co-Authors: Shigeru Kanazawa, Takeshi Fujisawa, Kiyoto Takahata, Yasuhiko Nakanishi, Hiroshi Yamazaki, Yuta Ueda, Wataru Kobayashi, Yoshifumi Muramoto, H Ishii, Hiroaki SanjohAbstract:Using a lumped-electrode EADFB Laser with a modulation bandwidth of ∼59 GHz, we demonstrated single-wavelength single-polarization direct-detection 4-PAM transmission with the record net data rate of 200 Gbit/s.
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flip chip interconnection lumped electrode eadfb Laser for 100 gb s lambda transmitter
IEEE Photonics Technology Letters, 2015Co-Authors: Shigeru Kanazawa, Takeshi Fujisawa, Kiyoto Takahata, Yuta Ueda, Wataru Kobayashi, H Ishii, Toshio Ito, Hiroaki SanjohAbstract:We have achieved the 100-Gb/s/ $\lambda $ operation of a flip-chip interconnection 1.3- $\mu \text{m}$ lumped-electrode electroabsorption modulator integrated with a distributed feedback Laser Module for the first time. The flip-chip interconnection provides a flatter frequency response characteristic and a higher modulation bandwidth. Clear eye opening was achieved for 103-Gb/s nonreturn to zero and equalizer-free 56-GBd 4-pulse-amplitude modulation operation after a 10-km single-mode fiber transmission.
