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Su D. - One of the best experts on this subject based on the ideXlab platform.

  • An integrated approach for eco-design and Its application in LED Lighting Product development
    'MDPI AG', 2021
    Co-Authors: Su D., Casamayor Alarco J., Xu X.
    Abstract:

    Lighting Products are essential for our modern life nowadays, but they also produce high negative impacts on the environment. Although there are tools and methods available for reducing the environmental impact of Lighting Products, it is a challenging task to integrate them throughout the Product development process. To overcome the challenge, this research developed an approach to integrate tools/methods relevant for the eco-design through Product development process to reduce the environmental impact of Lighting Products. Six types of methods, such module design, and 30 tools, such as lifecycle assessment software packages, are considered in the integrated approach. The Product specification with eco-constrains is established for implementation at each design stage to ensure the Product eco-features. The approach was applied in the development of an LED table lamp which was then assessed in comparison with a benchmark LED lamp regarding environmental lifecycle impact and Lighting performance. The comparative assessment results indicate that the LED lamp developed with this approach is much better than the benchmark lamp

  • Investigation of a process to eco-design LED Lighting Products to enhance the adoption of eco-design methods and tools by industry
    'MDPI AG', 2021
    Co-Authors: Jl Casamayor, Su D.
    Abstract:

    To date, many studies have been carried out to develop new approaches and methods to eco-design Products. However, these have not been implemented and adopted by industry as much as they should. A better understanding of real-world industrial eco-design and development processes, and the eco-design tools applied during these, could inform the development of more effective and applicable eco-design methods and tools, for generic as well as for specific Product categories (e.g., LED Lighting Products). This paper addresses this issue by describing and examining a real-world process followed to design and develop a LED Lighting Product by a Lighting manufacturer, via case study research. The case study involved direct participatory observation to gather the data and provided new insights about the stages of the design and development process, as well as the tools applied, which were examined and discussed to inform the improvement of existing methods and tools, or the development of better new methods and tools

  • Investigation of a process to eco-design LED Lighting Products
    'MDPI AG', 2021
    Co-Authors: Casamayor Alarco J.l., Su D.
    Abstract:

    To date, many studies have been carried out to develop new approaches and methods to eco-design Products. However, these have not been implemented and adopted by industry as much as they should. A better understanding of real-world industrial eco-design and development processes, and the eco-design tools applied during these, could inform the development of more effective and applicable eco-design methods and tools, for generic as well as for specific Product categories (e.g., LED Lighting Products). This paper addresses this issue by describing and examining a real-world process followed to design and develop a LED Lighting Product by a Lighting manufacturer, via case study research. The case study involved direct participatory observation to gather the data and provided new insights about the stages of the design and development process, as well as the tools applied, which were examined and discussed to inform the improvement of existing methods and tools, or the development of better new methods and tools

  • Sustainable Product development and service approach for application in industrial Lighting Products
    'Elsevier BV', 2021
    Co-Authors: Wang S, Su D., Ma M, Kuang W
    Abstract:

    Achieving triple bottom lines (TBL) throughout a Product's life cycle is important in sustainable Products and services. However, existing studies address the aspects of TBL partially, considering only a few stages of the Product life cycle. Therefore, we propose a sustainable Product development and service (SPDS) approach to address the entire Product life cycle in two phases, namely Product development and service phases. The former comprises Product design and manufacturing stages, whereas the latter involves multiple stages, such as Product distribution, retail, use, maintenance, and end-of-life. The two phases connect and interact logically to attain the TBL. The proposed SPDS approach was used to develop a sustainable industrial LED Lighting Product and service that exhibited prominent environmental, social, and economic performances. The environmental impact of the new Product was 46% lower than that of the existing Product with the same light output. Additionally, cost savings increased up to 14% per year with the leasing service, which promotes workers’ welfare, reduces cost for the manufacturers, and generates a healthy recurring profit stream. Thus, the application of the novel SPDS is innovative and highly beneficial

Zhang J. - One of the best experts on this subject based on the ideXlab platform.

  • Fast Qualification of Solder Reliability in Solid-state Lighting System
    2015
    Co-Authors: Zhang J.
    Abstract:

    Solid-state Lighting (SSL), which is based 0n semiconductor Lighting Emitting Diode (LED), is the most promising and reliable energy saving solution for future Lighting applications. Since a bare LED die can hardly survive without a package, one of the most import function of the LED package is to facilitate the electrical connection and heat dissipation of the light engine mounted on a printed circuit board (PCB) by Land Grid Array (LGA) solder joints. These joints have been proven to be one of the most vulnerable link in the system. Therefore, evaluating the reliability of solder joints becomes vital to ensure the long term reliability of this new Lighting Product. A combined theoretical and experimental approach based on Finite Element (FE) calculations is a fast and commonly adopted way of estimating the solder reliability in microelectronics industry. However, there is no fatigue model that is particularly suitable for Land Grid Array (LGA) solder joints, which are mostly employed in board level LED packages. . Additionally, it would be desirable to have cruder engineering guidelines to quickly estimate the effect of the various geometries and dimensions for new trial LGA configurations. On the other hand, relatively accurate lifetime predictions still required Accelerated Life Tests (ALT). However, current reliability testing methods based on the detection of final catastrophic failure generally require very long test time (up to 9000 hours or 55 weeks), which does not meet the industrial target to limit the testing time to 6-12 weeks. A test method that is capable of carefully separating and in-situ monitoring the fatigue damages may be able to resolve the issue by offering the possibility of early termination of the test once enough information is collected to predict final and catastrophic failure. In addition, this capability can be attractive to make more accurate Remaining Useful Lifetime prognostic of solder joint in many critical electronics in other systems. In Chapter 2, it was demonstrated that the widely accepted fatigue model for predicting the lifetime of BGA solder joint no longer valid for assessing reliability of solder joint in a LGA assembly due to its inappropriate critical elements selection method. Therefore, a more suitable critical element selection method for LGA assemblies is proposed based on statistical analysis of creep energy density distribution for elements in the vicinity of the likely crack initiation point. By adopting this new critical element selection method, a new energy based fatigue model for predicting LGA solder life times has been established by combining lifetime measurements with corresponding Finite Element Method (FEM) simulations for different material combinations and different LED package configurations. The model has a much better predictive power than the model based on the BGA approach. In chapter 3, a phenomenological response surface model is derived for a fast qualification of the reliability of LED packages with different designs by conducting a series of FEM simulations. It seems that a smaller carrier size and larger solder standoff height in general will result in better solder reliability. This trend is more pronounced in solder with smaller carrier size and larger stand-off height. Additionally, solder reliability decreases rapidly with solder coverage decreasing. The ratio between thermal solder area and electrical solder area AR has a significant influence on solder joint reliability in a SSL system. The optimal AR value is also observed to relate to carrier size and solder coverage. In general, the optimal AR value increases with increasing carrier size, and this phenomenon is more pronounced in packages with smaller solder coverage. When the chip carrier size is relative small, it is advisable to make the thermal pad and electrical pad comparable. The proposed methodology in this work, a combination of energy based fatigue modeling and FEM modeling proves to be very valuable for solder reliability optimization for LED packages. This methodology can also be applied to optimize the package configuration in terms of thermal performance, electrical performance, cost and combinations thereof. The predictive power and the limitations of the approach are also discussed in Chapter 3. The advantages of in-situ high precision damage monitor during ALT are demonstrated, which offers great potential to save testing time. In Chapter 4, precise fatigue damage monitoring is proven to be achievable by conducting in-situ high precision (apx. ±80 n?) electrical resistance measurement of each individual solder joint during testing. The method was shown to be capable of capturing viscoplastic deformation accumulation, resulted crack initiation and sequenced crack propagation in an isothermal fatigue test. Moreover, in Chapter 5, it is demonstrated that using dedicated electrode configurations, different types of fatigue damages can be separated from each other or highlighted depending on the testing purpose. The effect of viscoplastic deformation can best be separated from those due to crack formation in one electrode configuration whereby progressive viscoplastic deformation induces resistance decay, whereas crack initiation and propagation provokes resistance increasing. It allows a rather precise yet conservative estimation of the crack initiation point. The other two configurations studied demonstrated superior sensitivity to crack opening and closure during fatigue cycling, which gives saw-teeth shaped signal patterns, in which case the measured resistance increases with both progressive viscoplastic deformation and propagating crack. The experimental findings agree with results from FEA simulation and periodic tomographic analyses. However, even for very high resolution of the electrical resistance measurements as in the present work, identification of the very early stages of crack initiation (less than 5% of the joint contact zone) remains not really feasible. In Chapter 6, the knowledge gained for monitoring failure under isothermal conditions is transferred to the testing of solder joints subjected to thermo-mechanical loading, employing a different crack initiation identification method. Accelerated temperature cycling test was done to four LED like board level ceramic packages with in-situ periodic high precision electrical resistance monitoring for each solder joint inside. Not the actual electrical resistance values but the change in Temperature Coefficient of Resistance (TCRc) of the solder joint was correlated to fatigue damage evolution in the joint. Both viscoplastic deformation accumulation and crack propagation increase the TCR. A method to identify the crack initiation point based on the noise analysis of in-situ TCRc monitoring signal of individual solder joint is presented. It is observed that once a major crack is present in the joint the noise level increases significantly, and the rate of TCR increase increases with further crack growth. The crack initiation point as determined from the electrical resistance data using a built-in variance analysis tool in Matlab, was verified by micro-tomographic results and FEM simulation predictions. The new method as developed can be a very attractive technique for both solder accelerated test and RUL prognostics

  • Fast Qualification of Solder Reliability in Solid-state Lighting System
    2015
    Co-Authors: Zhang J.
    Abstract:

    Solid-state Lighting (SSL), which is based 0n semiconductor Lighting Emitting Diode (LED), is the most promising and reliable energy saving solution for future Lighting applications. Since a bare LED die can hardly survive without a package, one of the most import function of the LED package is to facilitate the electrical connection and heat dissipation of the light engine mounted on a printed circuit board (PCB) by Land Grid Array (LGA) solder joints. These joints have been proven to be one of the most vulnerable link in the system. Therefore, evaluating the reliability of solder joints becomes vital to ensure the long term reliability of this new Lighting Product. A combined theoretical and experimental approach based on Finite Element (FE) calculations is a fast and commonly adopted way of estimating the solder reliability in microelectronics industry. However, there is no fatigue model that is particularly suitable for Land Grid Array (LGA) solder joints, which are mostly employed in board level LED packages. . Additionally, it would be desirable to have cruder engineering guidelines to quickly estimate the effect of the various geometries and dimensions for new trial LGA configurations. On the other hand, relatively accurate lifetime predictions still required Accelerated Life Tests (ALT). However, current reliability testing methods based on the detection of final catastrophic failure generally require very long test time (up to 9000 hours or 55 weeks), which does not meet the industrial target to limit the testing time to 6-12 weeks. A test method that is capable of carefully separating and in-situ monitoring the fatigue damages may be able to resolve the issue by offering the possibility of early termination of the test once enough information is collected to predict final and catastrophic failure. In addition, this capability can be attractive to make more accurate Remaining Useful Lifetime prognostic of solder joint in many critical electronics in other systems. In Chapter 2, it was demonstrated that the widely accepted fatigue model for predicting the lifetime of BGA solder joint no longer valid for assessing reliability of solder joint in a LGA assembly due to its inappropriate critical elements selection method. Therefore, a more suitable critical element selection method for LGA assemblies is proposed based on statistical analysis of creep energy density distribution for elements in the vicinity of the likely crack initiation point. By adopting this new critical element selection method, a new energy based fatigue model for predicting LGA solder life times has been established by combining lifetime measurements with corresponding Finite Element Method (FEM) simulations for different material combinations and different LED package configurations. The model has a much better predictive power than the model based on the BGA approach. In chapter 3, a phenomenological response surface model is derived for a fast qualification of the reliability of LED packages with different designs by conducting a series of FEM simulations. It seems that a smaller carrier size and larger solder standoff height in general will result in better solder reliability. This trend is more pronounced in solder with smaller carrier size and larger stand-off height. Additionally, solder reliability decreases rapidly with solder coverage decreasing. The ratio between thermal solder area and electrical solder area AR has a significant influence on solder joint reliability in a SSL system. The optimal AR value is also observed to relate to carrier size and solder coverage. In general, the optimal AR value increases with increasing carrier size, and this phenomenon is more pronounced in packages with smaller solder coverage. When the chip carrier size is relative small, it is advisable to make the thermal pad and electrical pad comparable. The proposed methodology in this work, a combination of energy based fatigue modeling and FEM modeling proves to be very valuable for solder reliability optimization for LED packages. This methodology can also be applied to optimize the package configuration in terms of thermal performance, electrical performance, cost and combinations thereof. The predictive power and the limitations of the approach are also discussed in Chapter 3. The advantages of in-situ high precision damage monitor during ALT are demonstrated, which offers great potential to save testing time. In Chapter 4, precise fatigue damage monitoring is proven to be achievable by conducting in-situ high precision (apx. ±80 n?) electrical resistance measurement of each individual solder joint during testing. The method was shown to be capable of capturing viscoplastic deformation accumulation, resulted crack initiation and sequenced crack propagation in an isothermal fatigue test. Moreover, in Chapter 5, it is demonstrated that using dedicated electrode configurations, different types of fatigue damages can be separated from each other or highlighted depending on the testing purpose. The effect of viscoplastic deformation can best be separated from those due to crack formation in one electrode configuration whereby progressive viscoplastic deformation induces resistance decay, whereas crack initiation and propagation provokes resistance increasing. It allows a rather precise yet conservative estimation of the crack initiation point. The other two configurations studied demonstrated superior sensitivity to crack opening and closure during fatigue cycling, which gives saw-teeth shaped signal patterns, in which case the measured resistance increases with both progressive viscoplastic deformation and propagating crack. The experimental findings agree with results from FEA simulation and periodic tomographic analyses. However, even for very high resolution of the electrical resistance measurements as in the present work, identification of the very early stages of crack initiation (less than 5% of the joint contact zone) remains not really feasible. In Chapter 6, the knowledge gained for monitoring failure under isothermal conditions is transferred to the testing of solder joints subjected to thermo-mechanical loading, employing a different crack initiation identification method. Accelerated temperature cycling test was done to four LED like board level ceramic packages with in-situ periodic high precision electrical resistance monitoring for each solder joint inside. Not the actual electrical resistance values but the change in Temperature Coefficient of Resistance (TCRc) of the solder joint was correlated to fatigue damage evolution in the joint. Both viscoplastic deformation accumulation and crack propagation increase the TCR. A method to identify the crack initiation point based on the noise analysis of in-situ TCRc monitoring signal of individual solder joint is presented. It is observed that once a major crack is present in the joint the noise level increases significantly, and the rate of TCR increase increases with further crack growth. The crack initiation point as determined from the electrical resistance data using a built-in variance analysis tool in Matlab, was verified by micro-tomographic results and FEM simulation predictions. The new method as developed can be a very attractive technique for both solder accelerated test and RUL prognostics.Microelectronics & Computer EngineeringElectrical Engineering, Mathematics and Computer Scienc

Turhan Burcu - One of the best experts on this subject based on the ideXlab platform.

  • Comparison of traditional plastic parts welding methods with laser welding methods in automotive Lighting Products.
    'Uludag Universitesi Fen Edebiyat Fakultesi Sosyal Bilimler Dergisi', 2018
    Co-Authors: Turhan Burcu
    Abstract:

    Otomotiv sektörünün önde gelen firmalarında, dış aydınlatma üniteleri (far, stop, sis lambası vb. ) taşıtların vazgeçilmez unsurlarından biri olmuştur ve aydınlatma sistemlerinde estetik görünüm öncelikli öneme sahiptir ; bu yüzden aydınlatma sistemlerinde tasarım süreci her geçen gün daha kompleks bir hal almıştır. Bu parçaların yüksek kalitede estetik tasarıma sahip olması beklenirken aynı zamanda sürüş esnasında görüş açısı, aydınlatma konfor ve güvenliği açısından kusursuz bir optik özelliğe sahip olmaları da beklenmektedir. Bu beklentileri karşılayabilecek tasarımların gerçekleştirilmesi ise yine ileri teknoloji cihazlar ile sağlanabilmektedir. Aydınlatma ürünlerinin tasarımından son kullanıcıya kadar olan sürecinde, estetik ve kalite anlamında yeterli ürünü üretmiş olabilmenin en önemli aşamalarından biri, aydınlatma ürününün plastik parçaları için kullanılan birleştirme yöntemidir. Plastik parçalar birçok farklı şekillerde kaynak metodları ile birleştirilebilirler. Titreşim, ultrasonik, döndürme, sıcak plaka kaynaklamaları bunlardan bazılarıdır. Ancak bu geleneksel yöntemlerin bazı şartlarda yeterli olmaması günümüz koşullarında yeni projelerin dış pazarlara kaymasına yol açmaktadır. Bu durum göz önünde bulundurulduğunda, gelişen teknoloji ile birlikte yeni nesil bir birleştirme yöntemi olan lazer kaynak yönteminin kullanımının yaygınlaşması da büyük önem arz etmektedir. Bu proje ile amaçlanan, plastik parça birleştirme yöntemlerinden titreşim kaynak yöntemi, sıcak lama kaynak yöntemi ve lazer kaynak yöntemi için gereken tüm tasarım kurallarının oluşturulması, tasarım kuralları dahilinde ürünün tasarlanması, tasarım sonrası tüm üretim prosesi sisteminin verilerinin oluşturulması ardından ortaya çıkarılan ürünlerin kaynak prosesleri sonrasında gereken tüm kalite kontrollerinin yapılması ve elde edilen veriler doğrultusunda bu kaynak yöntemlerinin karşılaştırılmasıyla müşteri kalite beklentilerini en uygun şartlarda karşılayacak üretim yönteminin belirlenmesidir. Bu amaç doğrultusunda, firma kapsamında bulunan plastik parça birleştirme yöntemlerinden titreşim kaynak yöntemi, sıcak lama kaynak yöntemi ve lazer kaynak yöntemi ile üretimi yapılan üç farklı proje belirlenmiştir ve yukarıda bahsi geçen tüm kriterler bu üç farklı kaynak yöntemi ile üretilen projeler üzerinden gidilerek ortaya koyulmuştur.In the leading companies of the automotive industry, outdoor Lighting units (headlight, stop, fog lamp, etc.) have become one of the essential elements of vehicles and the aesthetic appearance in Lighting systems has priority. So the design process of Lighting systems, became more complex the other day. While it is expected that these parts will have a high quality aesthetic design, it is also expected that they will have a perfect optical feature in terms of visibility, Lighting comfort and safety while driving. Designs that can meet these expectations can also be achieved with advanced technology devices. One of the most important stages of producing sufficient Products in terms of aesthetics and quality in the process from the design of the Lighting Products to the end user is the joining method used for the plastic parts of the Lighting Product. Plastic parts can be welded with many different welding methods. Vibration, ultrasonic, hot plate welding are some of these. However, the fact that these traditional methods are not sufficient under certain conditions leads to the shift of new projects to foreign markets in today's conditions. Considering this situation, it is very important that the use of laser welding method, which is a new generation joining method together with developing technology, is widespread. The aim of this project is to create all design rules for vibration welding, hot plate welding and laser welding methods of plastic parts joining methods, design of the Product within the design rules, creation of the data of the entire Production process system after the design. Followed by, the aim of this project is all necessary quality controls after the welding processes of the Products revealed and the comparison of these welding methods in the direction of the obtained data and the determination of the Production method which will meet the customer quality expectations in the most favorable conditions. In line with this objective, three different projects have been identified that are produced by the vibration welding method, the hot welding method and the laser welding method among the plastic parts joining methods within the scope of the company and all of the criteria mentioned above have been put forward through these projects which produced by three different welding method.MAGNETI MARELLI MAK

Casamayor Alarco J.l. - One of the best experts on this subject based on the ideXlab platform.

  • Investigation of a process to eco-design LED Lighting Products
    'MDPI AG', 2021
    Co-Authors: Casamayor Alarco J.l., Su D.
    Abstract:

    To date, many studies have been carried out to develop new approaches and methods to eco-design Products. However, these have not been implemented and adopted by industry as much as they should. A better understanding of real-world industrial eco-design and development processes, and the eco-design tools applied during these, could inform the development of more effective and applicable eco-design methods and tools, for generic as well as for specific Product categories (e.g., LED Lighting Products). This paper addresses this issue by describing and examining a real-world process followed to design and develop a LED Lighting Product by a Lighting manufacturer, via case study research. The case study involved direct participatory observation to gather the data and provided new insights about the stages of the design and development process, as well as the tools applied, which were examined and discussed to inform the improvement of existing methods and tools, or the development of better new methods and tools

Jl Casamayor - One of the best experts on this subject based on the ideXlab platform.

  • Investigation of a process to eco-design LED Lighting Products to enhance the adoption of eco-design methods and tools by industry
    'MDPI AG', 2021
    Co-Authors: Jl Casamayor, Su D.
    Abstract:

    To date, many studies have been carried out to develop new approaches and methods to eco-design Products. However, these have not been implemented and adopted by industry as much as they should. A better understanding of real-world industrial eco-design and development processes, and the eco-design tools applied during these, could inform the development of more effective and applicable eco-design methods and tools, for generic as well as for specific Product categories (e.g., LED Lighting Products). This paper addresses this issue by describing and examining a real-world process followed to design and develop a LED Lighting Product by a Lighting manufacturer, via case study research. The case study involved direct participatory observation to gather the data and provided new insights about the stages of the design and development process, as well as the tools applied, which were examined and discussed to inform the improvement of existing methods and tools, or the development of better new methods and tools