Material Removal

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Steven Danyluk - One of the best experts on this subject based on the ideXlab platform.

  • influence of the electrochemical dissolution effect on the Material Removal rate utilizing electrokinetic phenomenon
    Advanced Materials Research, 2010
    Co-Authors: C. S. Leo, David Lee Butler, Steven Danyluk
    Abstract:

    Recently, Material Removal utilising electrokinetic phenomenon was proposed as an alternative to create Material Removal at the nanometric level [1]. The concept of the introduced Material Removal process is to impinge particles contained in the slurry, under the influence of hydrodynamic and electrokinetic effects, onto the workpiece with a predetermined velocity to create Material Removal on the surface. The Material Removal process proved to be feasible where the Material Removal rate was reported to be in the range of a few hundred nm/hr with a surface roughness of a few nm (RMS). This paper aims to look into the effect of the electrochemical dissolution on the Material Removal process since high voltages are involved during the Material Removal process. During the experimental study, electrochemical dissolution was observed and it contributed a certain proportion of the Material Removal process. However, the main Material Removal mechanism still relies on the mechanical action of the abrasive particles on the surface of the workpiece to create Material Removal during the process.

  • Influence of Particle Effects on the Material Removal Rate Utilizing Electrokinetic Phenomenon
    Advanced Materials Research, 2009
    Co-Authors: C. S. Leo, Travis Lee Blackburn, David Lee Butler, Chun Yang, Steven Danyluk
    Abstract:

    With the demand for precise nanometric Material Removal with minimal defects, several non-contact ultraprecision machining techniques were developed over recent decades. The electrokinetic Material Removal technique [1] is one such method that allows Material to be removed without any physical contact between the tool and the workpiece. In this work, the influence of the slurry mixture on the Material Removal rate for the electrokinetic Material Removal process is studied. During the process, it was observed experimentally that the mixture of the slurry affected the Material Removal rate. The parameters varied in the slurry mixture experiments were the size and concentration of the particles. Explanations for the behaviour of the Material Removal rate were also suggested during the study to further understand the electrokinetic Material Removal technique.

  • Environmentally benign Material Removal processes for the fabrication of microdevices
    Materials Science Forum, 2009
    Co-Authors: Steven Danyluk, Travis Lee Blackburn, David Lee Butler, Leo Cheng Seng
    Abstract:

    Non-contact Material Removal processes offer numerous advantages over traditional machining approaches and nowhere is this more apparent than in the fabrication of micro devices. Current micromachining techniques such as microgrinding and micromilling have limitations with respect to their positioning accuracy and tool deflections. Electro thermal processes such as microEDM and laser machining usually result in a heat affected zone being produced. Other approaches such as etching and non-contact ultraprecision polishing are either costly or are not suitable for high throughput. In order to address these limitations, alternative micromachining techniques are required. In this paper, a non-contact Material Removal technique based on the electrokinetic phenomenon is proposed for precise Material Removal at rates in the order of nanometers/min. The aim of this research is to have a better understanding on the electrokinetic Material Removal technique by studying the trajectory of the particles and the influence of the frequency of the electric field on the Material Removal rate.

  • Nanometric Material Removal using the electrokinetic phenomenon
    Device and Process Technologies for Microelectronics MEMS Photonics and Nanotechnology IV, 2007
    Co-Authors: Leo Cheng Seng, David Lee Butler, Travis Lee Blackburn, Yang Chun, Steven Danyluk
    Abstract:

    Material Removal at the sub-micron level has been a topic of interest in the past few years, particularly with respect to the fabrication of miniaturized devices. While numerous techniques have been developed and refined from their larger mesoscale counterparts (e.g. microEDM, micromilling), most have inherent limitations such as tool dimensions restricting the minimum feature which can be produced. In this work, we are proposing a novel technique of using the electrokinetic phenomenon for precise Material Removal at rates in the order of nanometers/min. An AC electric field with a DC offset is applied to a flowing fluid containing suspended particles which will then collide with the workpiece Material causing Material wear and tear and thus Material Removal. Results showed that the technique was feasible in achieving sub-micron Material Removal in micro-channels up to a depth of several hundred nanometers. With no chemicals involved in the process, the technique offers the further attraction of being a benign nano-manufacturing process with potential usage in the biochip and microfluidics areas.

Placid Mathew Ferreira - One of the best experts on this subject based on the ideXlab platform.

  • modeling of ductile mode Material Removal in rotary ultrasonic machining
    International Journal of Machine Tools & Manufacture, 1998
    Co-Authors: Z J Pei, Placid Mathew Ferreira
    Abstract:

    In rotary ultrasonic machining of ceramic Materials there exist two modes of Material Removal: brittle fracture mode and ductile mode. Two models were developed based on the assumption that the brittle fracture is the dominating mode of Material Removal, and were published previously. This paper presents the follow-up work on modeling of the ductile-mode Material Removal in rotary ultrasonic machining. After a brief review of the ductile phenomena in ceramic machining, an approach to modeling the ductile-mode Removal in rotary ultrasonic machining is proposed. Then, magnesia stabilized zirconia is used to demonstrate the model's capability of predicting the Material Removal rate from the process parameters and the Material property of the workpiece. Finally, the results of the pilot experiments to verify the model are discussed.

Sanjay Agarwal - One of the best experts on this subject based on the ideXlab platform.

  • on the mechanism and mechanics of Material Removal in ultrasonic machining
    International Journal of Machine Tools & Manufacture, 2015
    Co-Authors: Sanjay Agarwal
    Abstract:

    Abstract Precision abrasive machining processes such as ultrasonic machining are commonly employed to machine glasses, single crystals and ceramic Materials for various industrial applications. Until now, precision machining of hard and brittle Materials are poorly investigated from the fundamental and applied point of views. Taking into account the major technological importance of this subject to the production of functional and structural components used in high performance systems, it is often desired to estimate the machining rate for productivity while maintaining the desired surface integrity. The success of this approach, however, requires not only the fundamental understanding of the Material Removal on the microstructural scale but also the relationship between the machining characteristics and Material Removal rate in ultrasonic machining. In this study, the ultrasonic machining of glass was investigated with respect to mechanism of Material Removal and Material Removal rate (with basic machining parameters) with a mild steel tool using boron carbide abrasive in water as slurry. The analysis indicates that the Material Removal was primarily due to the micro-brittle fracture caused on the surface of the workpiece. For micro-brittle fracture mode, the relationship for the Material Removal rate, considering direct impact of abrasive grains on the workpiece, based on a simple fracture mechanics analysis has been established. The effect of machining conditions on Material Removal rate has been discussed. This research provides valuable insights into the Material Removal mechanism and the dependence of Material Removal rate on machining conditions and mechanical properties of workpiece Material in ultrasonic machining.

David Lee Butler - One of the best experts on this subject based on the ideXlab platform.

  • influence of the electrochemical dissolution effect on the Material Removal rate utilizing electrokinetic phenomenon
    Advanced Materials Research, 2010
    Co-Authors: C. S. Leo, David Lee Butler, Steven Danyluk
    Abstract:

    Recently, Material Removal utilising electrokinetic phenomenon was proposed as an alternative to create Material Removal at the nanometric level [1]. The concept of the introduced Material Removal process is to impinge particles contained in the slurry, under the influence of hydrodynamic and electrokinetic effects, onto the workpiece with a predetermined velocity to create Material Removal on the surface. The Material Removal process proved to be feasible where the Material Removal rate was reported to be in the range of a few hundred nm/hr with a surface roughness of a few nm (RMS). This paper aims to look into the effect of the electrochemical dissolution on the Material Removal process since high voltages are involved during the Material Removal process. During the experimental study, electrochemical dissolution was observed and it contributed a certain proportion of the Material Removal process. However, the main Material Removal mechanism still relies on the mechanical action of the abrasive particles on the surface of the workpiece to create Material Removal during the process.

  • Influence of Particle Effects on the Material Removal Rate Utilizing Electrokinetic Phenomenon
    Advanced Materials Research, 2009
    Co-Authors: C. S. Leo, Travis Lee Blackburn, David Lee Butler, Chun Yang, Steven Danyluk
    Abstract:

    With the demand for precise nanometric Material Removal with minimal defects, several non-contact ultraprecision machining techniques were developed over recent decades. The electrokinetic Material Removal technique [1] is one such method that allows Material to be removed without any physical contact between the tool and the workpiece. In this work, the influence of the slurry mixture on the Material Removal rate for the electrokinetic Material Removal process is studied. During the process, it was observed experimentally that the mixture of the slurry affected the Material Removal rate. The parameters varied in the slurry mixture experiments were the size and concentration of the particles. Explanations for the behaviour of the Material Removal rate were also suggested during the study to further understand the electrokinetic Material Removal technique.

  • Environmentally benign Material Removal processes for the fabrication of microdevices
    Materials Science Forum, 2009
    Co-Authors: Steven Danyluk, Travis Lee Blackburn, David Lee Butler, Leo Cheng Seng
    Abstract:

    Non-contact Material Removal processes offer numerous advantages over traditional machining approaches and nowhere is this more apparent than in the fabrication of micro devices. Current micromachining techniques such as microgrinding and micromilling have limitations with respect to their positioning accuracy and tool deflections. Electro thermal processes such as microEDM and laser machining usually result in a heat affected zone being produced. Other approaches such as etching and non-contact ultraprecision polishing are either costly or are not suitable for high throughput. In order to address these limitations, alternative micromachining techniques are required. In this paper, a non-contact Material Removal technique based on the electrokinetic phenomenon is proposed for precise Material Removal at rates in the order of nanometers/min. The aim of this research is to have a better understanding on the electrokinetic Material Removal technique by studying the trajectory of the particles and the influence of the frequency of the electric field on the Material Removal rate.

  • Nanometric Material Removal using the electrokinetic phenomenon
    Device and Process Technologies for Microelectronics MEMS Photonics and Nanotechnology IV, 2007
    Co-Authors: Leo Cheng Seng, David Lee Butler, Travis Lee Blackburn, Yang Chun, Steven Danyluk
    Abstract:

    Material Removal at the sub-micron level has been a topic of interest in the past few years, particularly with respect to the fabrication of miniaturized devices. While numerous techniques have been developed and refined from their larger mesoscale counterparts (e.g. microEDM, micromilling), most have inherent limitations such as tool dimensions restricting the minimum feature which can be produced. In this work, we are proposing a novel technique of using the electrokinetic phenomenon for precise Material Removal at rates in the order of nanometers/min. An AC electric field with a DC offset is applied to a flowing fluid containing suspended particles which will then collide with the workpiece Material causing Material wear and tear and thus Material Removal. Results showed that the technique was feasible in achieving sub-micron Material Removal in micro-channels up to a depth of several hundred nanometers. With no chemicals involved in the process, the technique offers the further attraction of being a benign nano-manufacturing process with potential usage in the biochip and microfluidics areas.

Z J Pei - One of the best experts on this subject based on the ideXlab platform.

  • modeling of ductile mode Material Removal in rotary ultrasonic machining
    International Journal of Machine Tools & Manufacture, 1998
    Co-Authors: Z J Pei, Placid Mathew Ferreira
    Abstract:

    In rotary ultrasonic machining of ceramic Materials there exist two modes of Material Removal: brittle fracture mode and ductile mode. Two models were developed based on the assumption that the brittle fracture is the dominating mode of Material Removal, and were published previously. This paper presents the follow-up work on modeling of the ductile-mode Material Removal in rotary ultrasonic machining. After a brief review of the ductile phenomena in ceramic machining, an approach to modeling the ductile-mode Removal in rotary ultrasonic machining is proposed. Then, magnesia stabilized zirconia is used to demonstrate the model's capability of predicting the Material Removal rate from the process parameters and the Material property of the workpiece. Finally, the results of the pilot experiments to verify the model are discussed.