The Experts below are selected from a list of 4569 Experts worldwide ranked by ideXlab platform
Hong-ying Yang - One of the best experts on this subject based on the ideXlab platform.
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Role of humic acid in bioleaching of copper from waste computer Motherboards
Hydrometallurgy, 2020Co-Authors: Qianfei Zhao, Lin-lin Tong, Ali Reza Kamali, Wolfgang Sand, Hong-ying YangAbstract:Abstract In recent years, an increasing attention has been paid to the bioleaching of copper from waste computer Motherboards. Here, we investigate the effect of humic acid on the bioleaching of waste computer Motherboards using the mixed culture HQ0211. For this, the response surface methodology (RSM) is employed to investigate the effect of pulp density, initial pH and humic acid content on copper recovery. Samples leached at optimized experimental conditions according to RSM were analyzed by Fourier transform infrared spectroscopy (FT-IR) and scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS). The results show that under optimum conditions; the initial pH = 1.53, pulp density = 1.35% (w/v) and humic acid addition = 0.31 g/L, a complete the copper leaching could be achieved. According to the results, the effectiveness of the bacterial and its capability to oxidize humic acid was proved. Overall, the biological leaching was found to be more effective than the chemical leaching. Humic acid can promote the bioleaching of waste computer Motherboards, reducing its environmental hazards.
C.a. Jones - One of the best experts on this subject based on the ideXlab platform.
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Hybrid integration onto silicon Motherboards with planar silica waveguides
IEE Proceedings - Optoelectronics, 1996Co-Authors: C.a. Jones, K. CooperAbstract:Silicon micromachining can be used in conjunction with silica on silicon waveguide technology to fabricate hybrid optical Motherboards. These Motherboards comprise optical and electrical interconnects, alignment features for integration of optoelectronic components and electronic circuitry. The development of the principal building blocks of an optical Motherboard, and the fabrication of a hybrid integrated optical transceiver, are described.
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2.4 Gbit/s transceiver using silica waveguides on a silicon optical Motherboard
Electronics Letters, 1995Co-Authors: C.a. Jones, K. Cooper, M.w. Nield, J.d. Rush, A.r. Thurlow, R.g. Waller, P.j. Ayliffe, P.m. HarrisonAbstract:A silicon Motherboard transceiver has been made which combines hybrid integration of optoelectronic and electronic components with single mode planar silica waveguide technology. Operation at 2.4 Gbit/s has been demonstrated.
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Hybrid integration of optical and electronic components on a silicon Motherboard
Proceedings of LEOS'94, 1994Co-Authors: C.a. Jones, K. Cooper, M.w. Nield, J.d. Rush, J.v. Collins, I.p. Hall, A.p. Mcdonna, S.j. BrownAbstract:We have demonstrated silicon Motherboard transmitter and receiver modules with planar silica waveguide optical interconnects. In both modules the active optoelectronic components were passively aligned to the silica waveguides, and electronic circuitry was also hybrid integrated. We are now- developing Motherboards which include an electrical interconnect layer formed directly on the silicon, in order to overcome the limitations encountered with bond-wires.
Gan Ezhong - One of the best experts on this subject based on the ideXlab platform.
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Structural Robustness Study of a Computer Motherboard
2006 IEEE International Conference on Industrial Technology, 2006Co-Authors: Yu Yating, Du Pingan, Gan EzhongAbstract:In this paper, two modal analysis methods are addressed to research the structural robustness of a computer Motherboard. One is experimental modal analysis, and the other is computational modal analysis. Experimental modal analysis is carried out by single input multiple output method and the modal parameters of computer Motherboard are extracted by multiple reference point modal parameter extraction method in frequency domain. Computational modal analysis is fulfilled by finite element method (FEM). In order to reduce the FE model scale, the locally stiffened regions, such as CPU, PCI sockets, ISA sockets, chipset, memory sockets, were simplified as blocks. The material properties parameters of these regions are measured by electric-test experiments on samples removed from the Motherboard. According to finite element (FE) modeling theory, the FE model of the Motherboard is constructed, as well as computational modal analysis is performed. By comparison, the result from experimental modal analysis agrees well with those from computational modal analysis. Finally, the underlying resonance regions under different natural frequency are discussed, which will provide some references to optimize and design the structure of the Motherboard, as well as to redistribute the components assembled on the Motherboard reasonably.
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Finite element modeling for computer Motherboard modal analysis
IEEE International Conference Mechatronics and Automation 2005, 1Co-Authors: Du Pingan, Yu Yating, Gan EzhongAbstract:Computer is one of the most widely used electronics systems. During manufacturing, shipping, handing, and operation, it will be subjected to mechanical shocks and vibrations that may result in various failures. As a major component of a computer, Motherboard has a considerable effect on the performance of a computer. Therefore, the prediction and improvement of the dynamic properties of the Motherboard is of great significance. In this paper, the finite element modeling issues regarding the modal analysis of Motherboard is addressed. The modeling approach is investigated extensively by means of computational and experimental modal analysis. A comparison of the modal parameters from both experiment and simulation shows the validity of the proposed approach. The effects of some model factors are also investigated.
K. Cooper - One of the best experts on this subject based on the ideXlab platform.
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Hybrid integration onto silicon Motherboards with planar silica waveguides
IEE Proceedings - Optoelectronics, 1996Co-Authors: C.a. Jones, K. CooperAbstract:Silicon micromachining can be used in conjunction with silica on silicon waveguide technology to fabricate hybrid optical Motherboards. These Motherboards comprise optical and electrical interconnects, alignment features for integration of optoelectronic components and electronic circuitry. The development of the principal building blocks of an optical Motherboard, and the fabrication of a hybrid integrated optical transceiver, are described.
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HYBRID INTEGRATION USING SILICA-ON-SILICON OPTICAL MotherboardS
Integrated Photonics Research, 1996Co-Authors: Carole Jones, M. Nield, K. Cooper, Robert Waller, Jim Rush, John Joseph Collins, Phil Fiddyment, Ian Francis LealmanAbstract:Silicon micromachining can be used to fabricate Motherboards onto which optical, optoelectronic and electronic components can be aligned using low-cost passive alignment techniques. Further functionality can be added by incorporating planar silica waveguides, which route the optical signal within the Motherboard and may also perform optical processing functions. This paper begins by describing some Motherboard elements developed at BT Laboratories, then discusses examples of two modules which have been fabricated, combining several of these elements to form optical sub-systems.
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Fully integrated silicon based optical Motherboards
Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92, 1992Co-Authors: D Godfrey, M. Nield, K. Cooper, J Hill, S Bailey, D. WelbournAbstract:Optical-fiber-based telecommunications networks require the use of complex optical systems involving semiconductor lasers, detectors, fiber amplifiers, waveguides, and control electronics. A silicon Motherboard process technology is described which enables the full range of components to be fabricated on the Motherboard (waveguides), mounted on the Motherboard (lasers and detectors), or connected to the Motherboard (optical fibers or further Motherboards). For each element of the overall silicon Motherboard process, the fabrication approach used and the optical performance are described. Finally, some potential applications of the technology are outlined.
Qianfei Zhao - One of the best experts on this subject based on the ideXlab platform.
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Role of humic acid in bioleaching of copper from waste computer Motherboards
Hydrometallurgy, 2020Co-Authors: Qianfei Zhao, Lin-lin Tong, Ali Reza Kamali, Wolfgang Sand, Hong-ying YangAbstract:Abstract In recent years, an increasing attention has been paid to the bioleaching of copper from waste computer Motherboards. Here, we investigate the effect of humic acid on the bioleaching of waste computer Motherboards using the mixed culture HQ0211. For this, the response surface methodology (RSM) is employed to investigate the effect of pulp density, initial pH and humic acid content on copper recovery. Samples leached at optimized experimental conditions according to RSM were analyzed by Fourier transform infrared spectroscopy (FT-IR) and scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS). The results show that under optimum conditions; the initial pH = 1.53, pulp density = 1.35% (w/v) and humic acid addition = 0.31 g/L, a complete the copper leaching could be achieved. According to the results, the effectiveness of the bacterial and its capability to oxidize humic acid was proved. Overall, the biological leaching was found to be more effective than the chemical leaching. Humic acid can promote the bioleaching of waste computer Motherboards, reducing its environmental hazards.