The Experts below are selected from a list of 16041 Experts worldwide ranked by ideXlab platform

T. Ohsaki - One of the best experts on this subject based on the ideXlab platform.

  • 3-D electromagnetic field analysis of interconnections in copper-polyimide Multichip Modules
    1991 Proceedings 41st Electronic Components & Technology Conference, 1991
    Co-Authors: S. Sasaki, R. Konno, H. Tomimuro, T. Ohsaki
    Abstract:

    The authors describe three-dimensional electromagnetic field analysis of interconnections in copper-polyimide Multichip Modules. This analysis is based on the spatial network method, a lattice network model of Maxwell's equation formulated in the time domain by Bergeron's method. Results of simulating reflection and transmission waves at interconnections are presented. Frequency characteristics of the scattering parameter S/sub 21/ are calculated using the fast Fourier transform. The 3-dB down cutoff frequencies of wire-bonded, TAB (tape automated bonding), and FCB (flip-chip bonding) interconnections are respectively 6, 14, and 40 GHz. Those of the interconnection vias are over 200 GHz.

  • 3-D electromagnetic field analysis of interconnections in copper-polyimide Multichip Modules
    IEEE Transactions on Components Hybrids and Manufacturing Technology, 1991
    Co-Authors: S. Sasaki, R. Konno, H. Tomimuro, T. Ohsaki
    Abstract:

    A three-dimensional electromagnetic field analysis of interconnections in copper-polyimide Multichip Modules is described. This analysis is based on the spatial network method: a lattice network model of Maxwell's equation formulated in the time domain by Bergeron's method. Results of simulating reflection and transmission waves at interconnections are presented. Frequency characteristics of the scattering parameter S/sub 21/ are calculated using the fast Fourier transform (FFT). The 3-dB down cutoff frequencies of wire bonded, tape automated bonding (TAB), and flip-chip bonding (FCB) interconnections are, respectively, 6, 14, and 40 GHz; those of interconnection vias are over 200 GHz. Copper-polyimide Multichip Modules can, therefore, be applied to ultra-high-speed systems.

L. W. Schaper - One of the best experts on this subject based on the ideXlab platform.

  • y ba cu o multilayer structures with amorphous dielectric layers for Multichip Modules using ion assisted pulsed laser deposition
    Applied Physics Letters, 1995
    Co-Authors: Ronald P Reade, Paul Berdahl, Richard E Russo, L. W. Schaper
    Abstract:

    Existing technology to construct high‐temperature superconductor (HTSC) Multichip Modules (MCM’s) incorporating several YBa2Cu3O7−δ (YBCO) thin films and thick dielectric layers are based on epitaxial growth of all layers from the template of a single‐crystal substrate. This work demonstrates an alternate method to fabricate these structures: the use of a biaxially aligned yttria‐stabilized zirconia (YSZ) intermediate layer deposited by ion‐assisted pulsed‐laser deposition. Using this technique, a YBCO thin film with Tc∼87 K and Jc∼3×105 A/cm2 was grown on a 5 μm amorphous SiO2 layer. In addition, YBCO/YSZ/SiO2/YSZ/YBCO/CeO2/YSZ and YBCO/YSZ/amorphous‐YSZ/YBCO/CeO2/YBCO multilayer structures were constructed.

  • Design of Multichip Modules : Multichip module technology
    1992
    Co-Authors: L. W. Schaper
    Abstract:

    The design of Multichip Modules (MCM's) is a difficult multidisciplinary task involving materials; electrical, thermal, and mechanical performance; system architecture and requirements; and economics. The art of MCM design lies in the global optimization of these often conflicting constraints. This paper discusses the wide range of considerations essential in the design process, and presents several figures of merit to help designers in making the rights choices

J.s.-h. Wang - One of the best experts on this subject based on the ideXlab platform.

  • ICCD - Optimal design of self-damped lossy transmission lines for Multichip Modules
    Proceedings 1994 IEEE International Conference on Computer Design: VLSI in Computers and Processors, 1994
    Co-Authors: J.s.-h. Wang
    Abstract:

    This paper presents a simple and robust method of designing the lossy-transmission-line interconnects for Multichip Modules (MCM). This method uses wire-sizing to meet the electrical damping criteria to propagate high-speed signals through unterminated lossy transmission lines on the substrates of Multichip Modules. Based on an improved scattering-parameters (S-parameters) macro-model of transmission lines, wire-sizing optimal design method relates the layout parameter (line width) and the transfer function (damping ratio, and natural undamped frequency) to the signal propagation delay. The optimal design method results in fast and stable signal propagation for single-source multi-receiver networks on Multichip Modules without using termination resistors. >

  • Optimal design of self-damped lossy transmission lines for Multichip Modules
    Proceedings 1994 IEEE International Conference on Computer Design: VLSI in Computers and Processors, 1994
    Co-Authors: J.s.-h. Wang
    Abstract:

    This paper presents a simple and robust method of designing the lossy-transmission-line interconnects for Multichip Modules (MCM). This method uses wire-sizing to meet the electrical damping criteria to propagate high-speed signals through unterminated lossy transmission lines on the substrates of Multichip Modules. Based on an improved scattering-parameters (S-parameters) macro-model of transmission lines, wire-sizing optimal design method relates the layout parameter (line width) and the transfer function (damping ratio, and natural undamped frequency) to the signal propagation delay. The optimal design method results in fast and stable signal propagation for single-source multi-receiver networks on Multichip Modules without using termination resistors.

S. Sasaki - One of the best experts on this subject based on the ideXlab platform.

  • 3-D electromagnetic field analysis of interconnections in copper-polyimide Multichip Modules
    1991 Proceedings 41st Electronic Components & Technology Conference, 1991
    Co-Authors: S. Sasaki, R. Konno, H. Tomimuro, T. Ohsaki
    Abstract:

    The authors describe three-dimensional electromagnetic field analysis of interconnections in copper-polyimide Multichip Modules. This analysis is based on the spatial network method, a lattice network model of Maxwell's equation formulated in the time domain by Bergeron's method. Results of simulating reflection and transmission waves at interconnections are presented. Frequency characteristics of the scattering parameter S/sub 21/ are calculated using the fast Fourier transform. The 3-dB down cutoff frequencies of wire-bonded, TAB (tape automated bonding), and FCB (flip-chip bonding) interconnections are respectively 6, 14, and 40 GHz. Those of the interconnection vias are over 200 GHz.

  • 3-D electromagnetic field analysis of interconnections in copper-polyimide Multichip Modules
    IEEE Transactions on Components Hybrids and Manufacturing Technology, 1991
    Co-Authors: S. Sasaki, R. Konno, H. Tomimuro, T. Ohsaki
    Abstract:

    A three-dimensional electromagnetic field analysis of interconnections in copper-polyimide Multichip Modules is described. This analysis is based on the spatial network method: a lattice network model of Maxwell's equation formulated in the time domain by Bergeron's method. Results of simulating reflection and transmission waves at interconnections are presented. Frequency characteristics of the scattering parameter S/sub 21/ are calculated using the fast Fourier transform (FFT). The 3-dB down cutoff frequencies of wire bonded, tape automated bonding (TAB), and flip-chip bonding (FCB) interconnections are, respectively, 6, 14, and 40 GHz; those of interconnection vias are over 200 GHz. Copper-polyimide Multichip Modules can, therefore, be applied to ultra-high-speed systems.

M. Ishizuka - One of the best experts on this subject based on the ideXlab platform.

  • Application of the thermal network method to the transient thermal analysis of Multichip Modules
    2nd 1998 IEMT IMC Symposium (IEEE Cat. No.98EX225), 1998
    Co-Authors: M. Ishizuka, Y. Fukuoka
    Abstract:

    In recent years, there has been a growing demand to have smaller and lighter electronic circuits which have greater complexity, multifunctionality and reliability. High-density Multichip packaging technology has been used in order to meet these requirements. The higher the density scale, the larger the power dissipation per unit area becomes. In the design process, it has therefore become very important to carry out thermal analysis. However, the heat transport model in Multichip Modules is very complex and its treatment is tedious and time consuming. This paper describes an application of the thermal network method to the transient thermal analysis of Multichip Modules and proposes a simple model for the thermal analysis of Multichip Modules as a preliminary thermal design tool. Based on the results of transient thermal analysis, the validity of the thermal network method and the simple thermal analysis model are confirmed.

  • Application of the thermal network method to the transient thermal analysis of Multichip Modules
    Heat Transfer - Japanese Research, 1997
    Co-Authors: M. Ishizuka
    Abstract:

    In recent years there has been a growing demand for smaller and lighter electronic circuits which have greater complexity, multifunctionality, and reliability. High-density Multichip packaging technology has been used in order to meet these requirements. The higher the density scale is, the larger the power dissipation per unit area becomes. Therefore, in the design process it has become very important to carry out a thermal analysis. However, the heat transport model in Multichip Modules is very complex and its treatment is tedious and time consuming. This paper describes an application of the thermal network method to the transient thermal analysis of Multichip Modules and proposes a simple model for Multichip Modules as a preliminary thermal design tool. Based on the results of a transient thermal analysis, the validity of the thermal network method and the simple thermal analysis model are confirmed.

  • Application of the thermal network method to the transient thermal analysis of Multichip Modules
    Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium, 1995
    Co-Authors: M. Ishizuka, K. Hisano, T. Sasaki, Y. Fukuoka
    Abstract:

    In recent years, there has been a growing demand to have smaller and lighter electronic circuits with greater complexity, multifunctionality and reliability. High-density Multichip packaging technology has been used to meet these requirements. The higher the density scale is, the larger the power dissipation per unit area becomes. Therefore, in thermal design process it has become very important to carry out the thermal analysis. However, the heat transport model in Multichip Modules is complex and its treatment is tedious and time consuming. This paper describes an application of the thermal network method to the transient thermal analysis of Multichip Modules and proposes a simple model for the thermal analysis of Multichip Modules as a preliminary thermal design tool.