The Experts below are selected from a list of 165 Experts worldwide ranked by ideXlab platform
Tao Hang - One of the best experts on this subject based on the ideXlab platform.
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The influence of non-uniform copper oxide layer on tin whisker growth and tin whisker growth behavior in SnAg microbumps with small diameter
Materials Letters, 2019Co-Authors: Menglong Sun, Huiqin Ling, Siru Ren, Tao HangAbstract:Abstract A non-uniform copper oxide layer with several hundred nanometers thick was observed covering the surface of 10 μm-diameter Cu/SnAg microbump. Tin whiskers were also found to form on the weak spots of this copper oxide layer, where were localized stress relief centers. The HRTEM results reveal the existence of twin Grain boundary between tin whisker and Neighboring Grain. Numerous dislocations at the twin boundary provide paths for the tin atoms to slip into tin whisker. It is the first time that the existence of copper oxide layer and the relationship between copper oxide layer and tin whiskers growth was studied and revealed in micron-level bumps. This present study has significant meaning for 3D electronic packaging as small size microbumps become increasingly prevalent and in which, surface diffusion becomes more important.
Menglong Sun - One of the best experts on this subject based on the ideXlab platform.
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The influence of non-uniform copper oxide layer on tin whisker growth and tin whisker growth behavior in SnAg microbumps with small diameter
Materials Letters, 2019Co-Authors: Menglong Sun, Huiqin Ling, Siru Ren, Tao HangAbstract:Abstract A non-uniform copper oxide layer with several hundred nanometers thick was observed covering the surface of 10 μm-diameter Cu/SnAg microbump. Tin whiskers were also found to form on the weak spots of this copper oxide layer, where were localized stress relief centers. The HRTEM results reveal the existence of twin Grain boundary between tin whisker and Neighboring Grain. Numerous dislocations at the twin boundary provide paths for the tin atoms to slip into tin whisker. It is the first time that the existence of copper oxide layer and the relationship between copper oxide layer and tin whiskers growth was studied and revealed in micron-level bumps. This present study has significant meaning for 3D electronic packaging as small size microbumps become increasingly prevalent and in which, surface diffusion becomes more important.
Gary H. Bray - One of the best experts on this subject based on the ideXlab platform.
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The Grain boundary geometry for optimum resistance to growth of short fatigue cracks in high strength Al-alloys
International Journal of Fatigue, 2005Co-Authors: Tongguang Zhai, M. D. Garratt, J X Li, X P Jiang, Gary H. BrayAbstract:Abstract In this paper, recent work on the effects of micro-texture on the growth behavior of short fatigue cracks in high strength aluminum alloys (such as Al-Li 8090 alloys and AA 2026 Al alloys) was first reviewed. The twist and tilt angles of crack plane deflection at a Grain boundary were identified as the key factors that controlled the growth of a short fatigue crack across the Grain boundary in these alloys. A large twist angle of the crack plane deflection at the Grain boundary gave rise to a higher resistance to crack growth across the Grain boundary, while a small twist angle represented a smaller resistance. The possible smallest twist angle of crack deflection at a boundary between a Grain with a typical orientation (such as brass and goss orientations) and a randomly orientated Grain was calculated and mapped in Euler space. The orientation of the Neighboring Grain that showed high resistance to crack growth was identified as a peak in these twist angle plots. The theoretical results were consistent with the results obtained from studies of short crack growth in AA 8090 and AA 2026 Al alloys. The results from this work paved the way to quantification of the texture effects on early growth of fatigue cracks in planar slip alloys.
Siru Ren - One of the best experts on this subject based on the ideXlab platform.
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The influence of non-uniform copper oxide layer on tin whisker growth and tin whisker growth behavior in SnAg microbumps with small diameter
Materials Letters, 2019Co-Authors: Menglong Sun, Huiqin Ling, Siru Ren, Tao HangAbstract:Abstract A non-uniform copper oxide layer with several hundred nanometers thick was observed covering the surface of 10 μm-diameter Cu/SnAg microbump. Tin whiskers were also found to form on the weak spots of this copper oxide layer, where were localized stress relief centers. The HRTEM results reveal the existence of twin Grain boundary between tin whisker and Neighboring Grain. Numerous dislocations at the twin boundary provide paths for the tin atoms to slip into tin whisker. It is the first time that the existence of copper oxide layer and the relationship between copper oxide layer and tin whiskers growth was studied and revealed in micron-level bumps. This present study has significant meaning for 3D electronic packaging as small size microbumps become increasingly prevalent and in which, surface diffusion becomes more important.
Huiqin Ling - One of the best experts on this subject based on the ideXlab platform.
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The influence of non-uniform copper oxide layer on tin whisker growth and tin whisker growth behavior in SnAg microbumps with small diameter
Materials Letters, 2019Co-Authors: Menglong Sun, Huiqin Ling, Siru Ren, Tao HangAbstract:Abstract A non-uniform copper oxide layer with several hundred nanometers thick was observed covering the surface of 10 μm-diameter Cu/SnAg microbump. Tin whiskers were also found to form on the weak spots of this copper oxide layer, where were localized stress relief centers. The HRTEM results reveal the existence of twin Grain boundary between tin whisker and Neighboring Grain. Numerous dislocations at the twin boundary provide paths for the tin atoms to slip into tin whisker. It is the first time that the existence of copper oxide layer and the relationship between copper oxide layer and tin whiskers growth was studied and revealed in micron-level bumps. This present study has significant meaning for 3D electronic packaging as small size microbumps become increasingly prevalent and in which, surface diffusion becomes more important.
