The Experts below are selected from a list of 9 Experts worldwide ranked by ideXlab platform
K.v. Sai Srinadh - One of the best experts on this subject based on the ideXlab platform.
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Vacuum infusion processed Adhesive bonding of SS plates
Materials Today: Proceedings, 2020Co-Authors: Syam Kumar Chokka, B. Satish Ben, K.v. Sai SrinadhAbstract:Abstract Adhesive bonding has become a popular technic as it provides the design flexibility and uniform distribution of loads. The gases which produce during the Adhesive bonding process are very dangerous. These gas emissions can be controlled by introducing the vacuum infusion process (VIP) in the Adhesive bonding process. The present work deals with the experimental study on Adhesive bonding of SS plates using a vacuum infusion process. Single strap but joint configuration was selected, and the strap material was chosen as carbon fiber reinforced polymer. The vacuum infusion process requires less viscous resin. Generally, structural Adhesives (SA) are high viscous fluids. The viscosity of structural Adhesive has been reduced in two ways; Addition of low viscous Nonstructural Adhesive (NSA) and heating of structural Adhesive. The effect of vacuum infusion pressure on Adhesive strength was also studied at optimal Adhesive conditions. The tensile test was conducted, and the optimal parameters were derived.
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Parametric optimization for rehabilitation of pipes with Adhesive bonding
High Performance Polymers, 2019Co-Authors: Syam Kumar Chokka, B. Satish Ben, K.v. Sai SrinadhAbstract:This work deals with the optimization of process parameters for rehabilitation of the pipe through-wall hole defects using Adhesive bonding. Epoxy-based Nonstructural Adhesive (NSA) and structural ...
Syam Kumar Chokka - One of the best experts on this subject based on the ideXlab platform.
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Vacuum infusion processed Adhesive bonding of SS plates
Materials Today: Proceedings, 2020Co-Authors: Syam Kumar Chokka, B. Satish Ben, K.v. Sai SrinadhAbstract:Abstract Adhesive bonding has become a popular technic as it provides the design flexibility and uniform distribution of loads. The gases which produce during the Adhesive bonding process are very dangerous. These gas emissions can be controlled by introducing the vacuum infusion process (VIP) in the Adhesive bonding process. The present work deals with the experimental study on Adhesive bonding of SS plates using a vacuum infusion process. Single strap but joint configuration was selected, and the strap material was chosen as carbon fiber reinforced polymer. The vacuum infusion process requires less viscous resin. Generally, structural Adhesives (SA) are high viscous fluids. The viscosity of structural Adhesive has been reduced in two ways; Addition of low viscous Nonstructural Adhesive (NSA) and heating of structural Adhesive. The effect of vacuum infusion pressure on Adhesive strength was also studied at optimal Adhesive conditions. The tensile test was conducted, and the optimal parameters were derived.
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Parametric optimization for rehabilitation of pipes with Adhesive bonding
High Performance Polymers, 2019Co-Authors: Syam Kumar Chokka, B. Satish Ben, K.v. Sai SrinadhAbstract:This work deals with the optimization of process parameters for rehabilitation of the pipe through-wall hole defects using Adhesive bonding. Epoxy-based Nonstructural Adhesive (NSA) and structural ...
B. Satish Ben - One of the best experts on this subject based on the ideXlab platform.
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Vacuum infusion processed Adhesive bonding of SS plates
Materials Today: Proceedings, 2020Co-Authors: Syam Kumar Chokka, B. Satish Ben, K.v. Sai SrinadhAbstract:Abstract Adhesive bonding has become a popular technic as it provides the design flexibility and uniform distribution of loads. The gases which produce during the Adhesive bonding process are very dangerous. These gas emissions can be controlled by introducing the vacuum infusion process (VIP) in the Adhesive bonding process. The present work deals with the experimental study on Adhesive bonding of SS plates using a vacuum infusion process. Single strap but joint configuration was selected, and the strap material was chosen as carbon fiber reinforced polymer. The vacuum infusion process requires less viscous resin. Generally, structural Adhesives (SA) are high viscous fluids. The viscosity of structural Adhesive has been reduced in two ways; Addition of low viscous Nonstructural Adhesive (NSA) and heating of structural Adhesive. The effect of vacuum infusion pressure on Adhesive strength was also studied at optimal Adhesive conditions. The tensile test was conducted, and the optimal parameters were derived.
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Parametric optimization for rehabilitation of pipes with Adhesive bonding
High Performance Polymers, 2019Co-Authors: Syam Kumar Chokka, B. Satish Ben, K.v. Sai SrinadhAbstract:This work deals with the optimization of process parameters for rehabilitation of the pipe through-wall hole defects using Adhesive bonding. Epoxy-based Nonstructural Adhesive (NSA) and structural ...
Jukka Vanhala - One of the best experts on this subject based on the ideXlab platform.
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Bond Strength and Failure Mechanisms of Nonconductive Adhesives for Stretchable Electronics
IEEE Transactions on Components Packaging and Manufacturing Technology, 2020Co-Authors: Teemu Salo, Aki Halme, Mikko Kanerva, Jukka VanhalaAbstract:Over the past few years, there has been an increasing demand for techniques that allow the forming of stretchable electronics systems from the combination of rigid printed circuit board (PCB) modules and stretchable substrates. The durability issues between the module and interconnects have been solved by optimizing the module’s geometry. However, the limiting factor is a reliable attachment method of the module on the substrate. The use of nonconductive Adhesives (NCAs) for bonding is one of the most potential techniques due to their low costs and ability to form bonds fast and without a high-temperature cure. In this article, we focused on the testing of different stretchable electronics joints from readily available NCAs and different rigid module materials. The joint samples were tested by using a peel test setup. The fracture surface analysis was carried out by applying the Fourier transform infrared spectroscopy (FTIR). Three different classes of failure mechanisms were identified. The best results were achieved with a novel Nonstructural Adhesive joint. The Nonstructural Adhesive joints had a good (0, 28 N/mm) average maximum bond strength with the rigid and smooth FR4 substrate, which made the stretchable substrate elongate considerably (85%) during the peeling. The joint samples from structural Adhesives, traditionally used in the electronics industry, were suboptimal.
Teemu Salo - One of the best experts on this subject based on the ideXlab platform.
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Bond Strength and Failure Mechanisms of Nonconductive Adhesives for Stretchable Electronics
IEEE Transactions on Components Packaging and Manufacturing Technology, 2020Co-Authors: Teemu Salo, Aki Halme, Mikko Kanerva, Jukka VanhalaAbstract:Over the past few years, there has been an increasing demand for techniques that allow the forming of stretchable electronics systems from the combination of rigid printed circuit board (PCB) modules and stretchable substrates. The durability issues between the module and interconnects have been solved by optimizing the module’s geometry. However, the limiting factor is a reliable attachment method of the module on the substrate. The use of nonconductive Adhesives (NCAs) for bonding is one of the most potential techniques due to their low costs and ability to form bonds fast and without a high-temperature cure. In this article, we focused on the testing of different stretchable electronics joints from readily available NCAs and different rigid module materials. The joint samples were tested by using a peel test setup. The fracture surface analysis was carried out by applying the Fourier transform infrared spectroscopy (FTIR). Three different classes of failure mechanisms were identified. The best results were achieved with a novel Nonstructural Adhesive joint. The Nonstructural Adhesive joints had a good (0, 28 N/mm) average maximum bond strength with the rigid and smooth FR4 substrate, which made the stretchable substrate elongate considerably (85%) during the peeling. The joint samples from structural Adhesives, traditionally used in the electronics industry, were suboptimal.
