The Experts below are selected from a list of 9 Experts worldwide ranked by ideXlab platform
Michael Braun - One of the best experts on this subject based on the ideXlab platform.
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sparseHessianFD: An R Package for Estimating Sparse Hessian Matrices
Journal of Statistical Software, 2017Co-Authors: Michael BraunAbstract:Sparse Hessian matrices occur often in statistics, and their fast and accurate estimation can improve efficiency of numerical optimization and sampling algorithms. By exploiting the known sparsity pattern of a Hessian, methods in the sparseHessianFD Package Require many fewer function or gradient evaluations than would be Required if the Hessian were treated as dense. The Package implements established graph coloring and linear substitution algorithms that were previously unavailable to R users, and is most useful when other numerical, symbolic or algorithmic methods are impractical, inefficient or unavailable
Chih Chung Hsu - One of the best experts on this subject based on the ideXlab platform.
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impact of low temperature solder on electronic Package dynamic warpage behavior and Requirement
Electronic Components and Technology Conference, 2019Co-Authors: Wei Keat Loh, Ron W Kulterman, Chih Chung HsuAbstract:Low temperature solder (LTS) adoption has increased over the years with the primary focus on reducing energy consumption. The fundamentals of dynamic warpage are well established in SMT industry, but there is minimal literature on the application of low temperature solders, specifically for SAC BGA with low temperature solder paste. iNEMI has conducted a wide range of dynamic warpage characterization of different electronic Package types, namely Package on Package, fine pitch BGA, large FCBGA Package with and without lids, and a wide selection of PBGA Packages. The database generated has been reviewed to understand the impact of low temperature solder on dynamic warpage considerations which avoids the typical maximum peak and valley warpage present at higher reflow temperatures. Additional consideration should be given to the rate and magnitude of contour change during LTS solidification phase that can induce a solder hot tear defect. It was found that mostly the PBGA and FCBGA Package Require greater attention and optimization for LTS adoption.
Wei Keat Loh - One of the best experts on this subject based on the ideXlab platform.
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impact of low temperature solder on electronic Package dynamic warpage behavior and Requirement
Electronic Components and Technology Conference, 2019Co-Authors: Wei Keat Loh, Ron W Kulterman, Chih Chung HsuAbstract:Low temperature solder (LTS) adoption has increased over the years with the primary focus on reducing energy consumption. The fundamentals of dynamic warpage are well established in SMT industry, but there is minimal literature on the application of low temperature solders, specifically for SAC BGA with low temperature solder paste. iNEMI has conducted a wide range of dynamic warpage characterization of different electronic Package types, namely Package on Package, fine pitch BGA, large FCBGA Package with and without lids, and a wide selection of PBGA Packages. The database generated has been reviewed to understand the impact of low temperature solder on dynamic warpage considerations which avoids the typical maximum peak and valley warpage present at higher reflow temperatures. Additional consideration should be given to the rate and magnitude of contour change during LTS solidification phase that can induce a solder hot tear defect. It was found that mostly the PBGA and FCBGA Package Require greater attention and optimization for LTS adoption.
Ron W Kulterman - One of the best experts on this subject based on the ideXlab platform.
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impact of low temperature solder on electronic Package dynamic warpage behavior and Requirement
Electronic Components and Technology Conference, 2019Co-Authors: Wei Keat Loh, Ron W Kulterman, Chih Chung HsuAbstract:Low temperature solder (LTS) adoption has increased over the years with the primary focus on reducing energy consumption. The fundamentals of dynamic warpage are well established in SMT industry, but there is minimal literature on the application of low temperature solders, specifically for SAC BGA with low temperature solder paste. iNEMI has conducted a wide range of dynamic warpage characterization of different electronic Package types, namely Package on Package, fine pitch BGA, large FCBGA Package with and without lids, and a wide selection of PBGA Packages. The database generated has been reviewed to understand the impact of low temperature solder on dynamic warpage considerations which avoids the typical maximum peak and valley warpage present at higher reflow temperatures. Additional consideration should be given to the rate and magnitude of contour change during LTS solidification phase that can induce a solder hot tear defect. It was found that mostly the PBGA and FCBGA Package Require greater attention and optimization for LTS adoption.
Ábel Vértesy - One of the best experts on this subject based on the ideXlab platform.
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RoxygenReady: Create Roxygen skeletons for all of your functions before compiling it into an R Package.
2018Co-Authors: Ábel VértesyAbstract:Create Roxygen skeletons for all of your functions before compiling it into an R Package. Roxygen2 is an awesome tool to easily create a Package from your function library. RoxygenReady helps in creating the function annotations needed to compile a proper Package by Roxygen2. More precisely, RoxygenReady creates Roxygen skeletons, a certain format for inline function annotation (see below). By so, it spares you a lot of time documenting your functions easily and precisely. The annotation skeleton it creates, can be automatically compiled into a Package with a few lines of code. Packages are the standard way of distribution R code, as they integrate with other services, code sharing becomes much easier. See the installation section for an example. You can pass a whole file to RoxygenReady, and it will create Roxygen skeletons for all functions defined in the file! Installation and Usage Install directly from GitHub via devtools with one R command: devtools::install_github(repo = "vertesy/RoxygenReady/RoxygenReady") ...then simply load the Package: Require("RoxygenReady") and create Roxygen skeletons for your functions RoxygenReady("Path/to/your/script.r") Workflow Explained: a streamlined Package creation 1. You start out with your .R file containing your favorite functions. print11more
