The Experts below are selected from a list of 30825 Experts worldwide ranked by ideXlab platform
Charles R. Sullivan - One of the best experts on this subject based on the ideXlab platform.
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fundamental examination of multiple potential Passive Component technologies for future power electronics
IEEE Transactions on Power Electronics, 2018Co-Authors: Phyo Aung Kyaw, Aaron L F Stein, Charles R. SullivanAbstract:Efficient and compact high-power high-frequency Passive energy storage Components are required for miniaturization of power converters and remain a challenging obstacle in power electronics. In this paper, multiple energy storage mechanisms are analyzed on an order-of-magnitude basis to identify potential alternatives for conventional Passive Components, especially magnetics, which have frequency-dependent power losses. The high energy density of mechanical storage methods provides an attractive alternative to the widely used LC resonance. Piezoelectric transduction is explored, and the performance of a piezoelectric resonator is compared to that of an LC resonator in terms of efficiency and power handling capabilities in a resonant switched-capacitor-type circuit. The analysis provides a basis for exploring potential Passive energy storage Component technologies and comparing their performance limits with those of electromagnetic Passive Components. The analysis shows that both electromagnetic and mechanical resonance, in the ideal scenarios, can offer much better performance than do Passive Component technologies in use today. A prototype resonator is built with off-the-shelf C0G capacitors to confirm the low loss and high power predicted by the model. The resulting resonator has an effective resistance of 2.76 $\text{m}{\Omega }$ at 2.70 MHz in 1 ${\text{cm}^{3}}$ volume and can handle 7.42 kW within the rated temperature.
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Fundamental examination of multiple potential Passive Component technologies for future power electronics
2015 IEEE 16th Workshop on Control and Modeling for Power Electronics (COMPEL), 2015Co-Authors: Phyo Aung Kyaw, Charles R. SullivanAbstract:Efficient and compact high-power high-frequency Passive Components are required for miniaturization of power converters and remain a challenging obstacle in power electronics. Multiple energy storage mechanisms are analyzed on an order-of-magnitude basis to identify potential alternatives for Passive Components. The high energy density of mechanical storage methods presents an attractive alternative to the widely-used LC resonance. Piezoelectric transduction is explored and the performance of a piezoelectric resonator is compared to an LC resonator in terms of efficiency and power handling capability in a switched-capacitor type circuit. The analysis provides a basis for exploring potential Passive Component technologies and comparing their performance limits with those of electrical Passive Components.
Phyo Aung Kyaw - One of the best experts on this subject based on the ideXlab platform.
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fundamental examination of multiple potential Passive Component technologies for future power electronics
IEEE Transactions on Power Electronics, 2018Co-Authors: Phyo Aung Kyaw, Aaron L F Stein, Charles R. SullivanAbstract:Efficient and compact high-power high-frequency Passive energy storage Components are required for miniaturization of power converters and remain a challenging obstacle in power electronics. In this paper, multiple energy storage mechanisms are analyzed on an order-of-magnitude basis to identify potential alternatives for conventional Passive Components, especially magnetics, which have frequency-dependent power losses. The high energy density of mechanical storage methods provides an attractive alternative to the widely used LC resonance. Piezoelectric transduction is explored, and the performance of a piezoelectric resonator is compared to that of an LC resonator in terms of efficiency and power handling capabilities in a resonant switched-capacitor-type circuit. The analysis provides a basis for exploring potential Passive energy storage Component technologies and comparing their performance limits with those of electromagnetic Passive Components. The analysis shows that both electromagnetic and mechanical resonance, in the ideal scenarios, can offer much better performance than do Passive Component technologies in use today. A prototype resonator is built with off-the-shelf C0G capacitors to confirm the low loss and high power predicted by the model. The resulting resonator has an effective resistance of 2.76 $\text{m}{\Omega }$ at 2.70 MHz in 1 ${\text{cm}^{3}}$ volume and can handle 7.42 kW within the rated temperature.
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Fundamental examination of multiple potential Passive Component technologies for future power electronics
2015 IEEE 16th Workshop on Control and Modeling for Power Electronics (COMPEL), 2015Co-Authors: Phyo Aung Kyaw, Charles R. SullivanAbstract:Efficient and compact high-power high-frequency Passive Components are required for miniaturization of power converters and remain a challenging obstacle in power electronics. Multiple energy storage mechanisms are analyzed on an order-of-magnitude basis to identify potential alternatives for Passive Components. The high energy density of mechanical storage methods presents an attractive alternative to the widely-used LC resonance. Piezoelectric transduction is explored and the performance of a piezoelectric resonator is compared to an LC resonator in terms of efficiency and power handling capability in a switched-capacitor type circuit. The analysis provides a basis for exploring potential Passive Component technologies and comparing their performance limits with those of electrical Passive Components.
Dushan Boroyevich - One of the best experts on this subject based on the ideXlab platform.
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optimum design guidelines for the modular multilevel converter in active front end applications considerations for Passive Component reduction
IEEE Power Electronics Magazine, 2018Co-Authors: Alinaghi Marzoughi, Rolando Burgos, Dushan BoroyevichAbstract:The modular multilevel converter (MMC), introduced by Lesnicar and Marquardt in 2003 [1], is one of the most popular topologies among the multilevel converters. With the introduction of this converter, and thanks to its capability in transformerless dc-ac and ac-dc conversion at high voltages, a new era has begun in the power conversion field. An important application of the MMC converter is in the rectifier mode operation, where the converter serves as an active front end (AFE) to generate the dc link required for the operation of medium-voltage motor drives, HVDC systems, frequency change systems, and so on.
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comparison of three phase ac ac matrix converter and voltage dc link back to back converter topologies based on emi filter
Energy Conversion Congress and Exposition, 2013Co-Authors: Bo Wen, Xuning Zhang, Qiong Wang, Rolando Burgos, Paolo Mattavelli, Dushan BoroyevichAbstract:This paper presents a comparison of a direct matrix converter, a two-level dc-link back-to-back converter, a two-level interleaved dc-link back-to-back converter and a three-level dc-link back-to-back converter for a 30 kW permanent magnet synchronous motor drive based on Passive Component and electromagnetic interference (EMI) filter volume and weight. The results show the tradeoff between different converter topologies.
David Redinger - One of the best experts on this subject based on the ideXlab platform.
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an ink jet deposited Passive Component process for rfid
IEEE Transactions on Electron Devices, 2004Co-Authors: David Redinger, Steven Molesa, R Farschi, Vivek SubramanianAbstract:An all ink-jet-deposited process capable of creating high-quality Passive devices suitable for an RFID front-end is described. Gold nanocrystals are printed to create conductive lines with sheet resistance as low as 23 m/spl Omega/ per square. Optimal printing conditions are found for polyimide dielectric layers and films as thin as 340 nm are produced. These results are used to create spiral inductors, interconnect, and parallel plate capacitors.
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An all-printed Passive Component technology for low-cost RFID
Device Research Conference - Conference Digest DRC, 2003Co-Authors: David Redinger, Rouin Farshchi, V SubramanianAbstract:In this paper, we demonstrate an all-printed Passive Component technology on plastic, including inductors, capacitors, and multilevel interconnects. This represents an important step towards the development of ultra-low-cost RFID on plastic
T M Jahns - One of the best experts on this subject based on the ideXlab platform.
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evolving and emerging applications of power electronics in systems
IEEE Journal of Emerging and Selected Topics in Power Electronics, 2013Co-Authors: J G Kassakian, T M JahnsAbstract:The continuing trend toward greater electrification and control of functions in consumer, commercial, industrial, transportation, and even medical applications promises a dynamic and increasingly important role for power electronics. The growing penetration of power electronics in energy systems is driven by new materials such as SiC and GaN, as well as new packaging technologies which allow the physical integration of electronics with powered and controlled devices such as motors. Advances in very high-frequency conversion led by the application of SiC and GaN devices promises to make converter-on-a-chip technology possible, but concurrent advances in Passive Component technology are necessary. The principal challenge to application penetration remains cost reduction.