The Experts below are selected from a list of 52764 Experts worldwide ranked by ideXlab platform

Nicolas Gherardi - One of the best experts on this subject based on the ideXlab platform.

  • atmospheric pressure low temperature direct Plasma Technology status and challenges for thin film deposition
    Plasma Processes and Polymers, 2012
    Co-Authors: Françoise Massines, Christian Sarrabournet, Fiorenza Fanelli, Nicolas Naude, Nicolas Gherardi
    Abstract:

    Over the last ten years, expansion of atmospheric pressure Plasma solutions for surface treatment of materials has been remarkable, however direct Plasma Technology for thin film deposition needs still great effort. The objective of this paper is to establish the state of the art on scientific and technologic locks, which have to be opened to consider direct atmospheric pressure Plasma-enhanced chemical vapor deposition (AP-PECVD) a viable option for industrial application. Basic scientific principles to understand and optimize an AP-PECVD process are summarized. Laboratory reactor configurations are reviewed. Reference points for the design and use of AP-PECVD reactors according to the desired thin film properties are given. Finally, solutions to avoid powder formation and to increase the thin film growth rate are discussed.

Nicolas Naude - One of the best experts on this subject based on the ideXlab platform.

  • atmospheric pressure low temperature direct Plasma Technology status and challenges for thin film deposition
    Plasma Processes and Polymers, 2012
    Co-Authors: Françoise Massines, Christian Sarrabournet, Fiorenza Fanelli, Nicolas Naude, Nicolas Gherardi
    Abstract:

    Over the last ten years, expansion of atmospheric pressure Plasma solutions for surface treatment of materials has been remarkable, however direct Plasma Technology for thin film deposition needs still great effort. The objective of this paper is to establish the state of the art on scientific and technologic locks, which have to be opened to consider direct atmospheric pressure Plasma-enhanced chemical vapor deposition (AP-PECVD) a viable option for industrial application. Basic scientific principles to understand and optimize an AP-PECVD process are summarized. Laboratory reactor configurations are reviewed. Reference points for the design and use of AP-PECVD reactors according to the desired thin film properties are given. Finally, solutions to avoid powder formation and to increase the thin film growth rate are discussed.

Aldo R Boccaccini - One of the best experts on this subject based on the ideXlab platform.

  • thermal Plasma Technology for the treatment of wastes a critical review
    Journal of Hazardous Materials, 2009
    Co-Authors: E Gomez, Amutha D Rani, C R Cheeseman, D Deegan, M Wise, Aldo R Boccaccini
    Abstract:

    This review describes the current status of waste treatment using thermal Plasma Technology. A comprehensive analysis of the available scientific and technical literature on waste Plasma treatment is presented, including the treatment of a variety of hazardous wastes, such as residues from municipal solid waste incineration, slag and dust from steel production, asbestos-containing wastes, health care wastes and organic liquid wastes. The principles of thermal Plasma generation and the technologies available are outlined, together with potential applications for Plasma vitrified products. There have been continued advances in the application of Plasma Technology for waste treatment, and this is now a viable alternative to other potential treatment/disposal options. Regulatory, economic and socio-political drivers are promoting adoption of advanced thermal conversion techniques such as thermal Plasma Technology and these are expected to become increasingly commercially viable in the future.

Qinhui Zhang - One of the best experts on this subject based on the ideXlab platform.

  • review on electrical discharge Plasma Technology for wastewater remediation
    Chemical Engineering Journal, 2014
    Co-Authors: Bo Jiang, Jingtang Zheng, Mingbo Wu, Qinhui Zhang
    Abstract:

    Abstract As wastewater remediation becomes a global concern, the development of innovative advanced oxidation processes for wastewater treatment is still a major challenge. With regard to its fast removal rate and environmental compatibility, Plasma Technology is considered as a promising remediation Technology for water remediation. The principles of electrical Plasma with liquids for pollutant removal and the reactors of various electrical discharge types are outlined in this review. To improve energy efficiency, combination of Plasma Technology with catalysts has attracted significant attention. The present review is concerned about present understanding of the mechanisms involved in these combined processes. Further on, detailed discussions are given of the effects of various factors on the performance of pulsed electrical Plasma Technology in water treatment processes. Finally, special attention is paid to the future challenges of Plasma Technology utilized for industrial wastewater treatment.

Françoise Massines - One of the best experts on this subject based on the ideXlab platform.

  • atmospheric pressure low temperature direct Plasma Technology status and challenges for thin film deposition
    Plasma Processes and Polymers, 2012
    Co-Authors: Françoise Massines, Christian Sarrabournet, Fiorenza Fanelli, Nicolas Naude, Nicolas Gherardi
    Abstract:

    Over the last ten years, expansion of atmospheric pressure Plasma solutions for surface treatment of materials has been remarkable, however direct Plasma Technology for thin film deposition needs still great effort. The objective of this paper is to establish the state of the art on scientific and technologic locks, which have to be opened to consider direct atmospheric pressure Plasma-enhanced chemical vapor deposition (AP-PECVD) a viable option for industrial application. Basic scientific principles to understand and optimize an AP-PECVD process are summarized. Laboratory reactor configurations are reviewed. Reference points for the design and use of AP-PECVD reactors according to the desired thin film properties are given. Finally, solutions to avoid powder formation and to increase the thin film growth rate are discussed.