The Experts below are selected from a list of 1578 Experts worldwide ranked by ideXlab platform
Jingjie Zhang - One of the best experts on this subject based on the ideXlab platform.
-
fabrication of glass ni fe p ternary alloy core shell composite hollow microspheres through a modified electroless Plating process
Applied Surface Science, 2008Co-Authors: Zhenguo An, Jingjie ZhangAbstract:Abstract Glass/Ni–Fe–P ternary alloy core/shell composite hollow microspheres were fabricated by a modified electroless Plating process. In the process, a coupling procedure was employed with 3-aminopropyltriethoxy silane as the coupling agent and silver nitRate was used as the activator. The effect of process parameters, such as mole ratio of (NH4)2Fe(SO4)2/NiSO4, pH value of the Plating solution and reaction temperature, on Plating Rate and properties of the composite microspheres were investigated. The results showed that the coupling treatment could improve the uniformity of Ni–Fe–P deposits remarkably. The Plating Rate was reduced rapidly with the increase of mole ratio of (NH4)2Fe(SO4)2/NiSO4. The increase of the pH value could enhance the Plating Rate and the percentage of iron in the deposits. The as-obtained microspheres were magnetically soft at room temperature and their magnetic properties got better with the enhancement of the percentage of iron in the deposits.
-
Fabrication of glass/Ni–Fe–P ternary alloy core/shell composite hollow microspheres through a modified electroless Plating process
Applied Surface Science, 2008Co-Authors: Zhenguo An, Jingjie ZhangAbstract:Abstract Glass/Ni–Fe–P ternary alloy core/shell composite hollow microspheres were fabricated by a modified electroless Plating process. In the process, a coupling procedure was employed with 3-aminopropyltriethoxy silane as the coupling agent and silver nitRate was used as the activator. The effect of process parameters, such as mole ratio of (NH4)2Fe(SO4)2/NiSO4, pH value of the Plating solution and reaction temperature, on Plating Rate and properties of the composite microspheres were investigated. The results showed that the coupling treatment could improve the uniformity of Ni–Fe–P deposits remarkably. The Plating Rate was reduced rapidly with the increase of mole ratio of (NH4)2Fe(SO4)2/NiSO4. The increase of the pH value could enhance the Plating Rate and the percentage of iron in the deposits. The as-obtained microspheres were magnetically soft at room temperature and their magnetic properties got better with the enhancement of the percentage of iron in the deposits.
Zhenguo An - One of the best experts on this subject based on the ideXlab platform.
-
fabrication of glass ni fe p ternary alloy core shell composite hollow microspheres through a modified electroless Plating process
Applied Surface Science, 2008Co-Authors: Zhenguo An, Jingjie ZhangAbstract:Abstract Glass/Ni–Fe–P ternary alloy core/shell composite hollow microspheres were fabricated by a modified electroless Plating process. In the process, a coupling procedure was employed with 3-aminopropyltriethoxy silane as the coupling agent and silver nitRate was used as the activator. The effect of process parameters, such as mole ratio of (NH4)2Fe(SO4)2/NiSO4, pH value of the Plating solution and reaction temperature, on Plating Rate and properties of the composite microspheres were investigated. The results showed that the coupling treatment could improve the uniformity of Ni–Fe–P deposits remarkably. The Plating Rate was reduced rapidly with the increase of mole ratio of (NH4)2Fe(SO4)2/NiSO4. The increase of the pH value could enhance the Plating Rate and the percentage of iron in the deposits. The as-obtained microspheres were magnetically soft at room temperature and their magnetic properties got better with the enhancement of the percentage of iron in the deposits.
-
Fabrication of glass/Ni–Fe–P ternary alloy core/shell composite hollow microspheres through a modified electroless Plating process
Applied Surface Science, 2008Co-Authors: Zhenguo An, Jingjie ZhangAbstract:Abstract Glass/Ni–Fe–P ternary alloy core/shell composite hollow microspheres were fabricated by a modified electroless Plating process. In the process, a coupling procedure was employed with 3-aminopropyltriethoxy silane as the coupling agent and silver nitRate was used as the activator. The effect of process parameters, such as mole ratio of (NH4)2Fe(SO4)2/NiSO4, pH value of the Plating solution and reaction temperature, on Plating Rate and properties of the composite microspheres were investigated. The results showed that the coupling treatment could improve the uniformity of Ni–Fe–P deposits remarkably. The Plating Rate was reduced rapidly with the increase of mole ratio of (NH4)2Fe(SO4)2/NiSO4. The increase of the pH value could enhance the Plating Rate and the percentage of iron in the deposits. The as-obtained microspheres were magnetically soft at room temperature and their magnetic properties got better with the enhancement of the percentage of iron in the deposits.
G. Roventi - One of the best experts on this subject based on the ideXlab platform.
-
Ni–Zn–P alloy deposition from sulfate bath: inhibitory effect of zinc
Journal of Applied Electrochemistry, 1999Co-Authors: M. Bouanani, F. Cherkaoui, M. Cherkaoui, S. Belcadi, R. Fratesi, G. RoventiAbstract:Electroless Ni–Zn–P alloy deposition from a sulphate bath, containing sodium hypophosphite as reducer, was investigated. To increase the Plating Rate, the deposition parameters were optimized. The effect of process parameters (T, pH and [Zn^2+]) on the Plating Rate and deposit composition was examined and it was found that the presence of zinc in the bath has an inhibitory effect on the alloy deposition. As a consequence, the percentage of zinc in the electroless Ni–Zn–P alloys never reaches high values. Using cyclic voltammetry the electrodeposition mechanism of Ni–Zn–P alloys was investigated. It was observed that the zinc deposition inhibits the nickel discharge and, as a consequence, its catalytic activity on hypophosphite oxidation. It was also found that increase in temperature or pH leads to the deposition of nickel rich alloys.
M. Bouanani - One of the best experts on this subject based on the ideXlab platform.
-
Ni–Zn–P alloy deposition from sulfate bath: inhibitory effect of zinc
Journal of Applied Electrochemistry, 1999Co-Authors: M. Bouanani, F. Cherkaoui, M. Cherkaoui, S. Belcadi, R. Fratesi, G. RoventiAbstract:Electroless Ni–Zn–P alloy deposition from a sulphate bath, containing sodium hypophosphite as reducer, was investigated. To increase the Plating Rate, the deposition parameters were optimized. The effect of process parameters (T, pH and [Zn^2+]) on the Plating Rate and deposit composition was examined and it was found that the presence of zinc in the bath has an inhibitory effect on the alloy deposition. As a consequence, the percentage of zinc in the electroless Ni–Zn–P alloys never reaches high values. Using cyclic voltammetry the electrodeposition mechanism of Ni–Zn–P alloys was investigated. It was observed that the zinc deposition inhibits the nickel discharge and, as a consequence, its catalytic activity on hypophosphite oxidation. It was also found that increase in temperature or pH leads to the deposition of nickel rich alloys.
Li Xinhai - One of the best experts on this subject based on the ideXlab platform.
-
electroless copper Plating process of n n n n tetrakis 2 hydroxypropyl ethylenediamine system with high Plating Rate
Journal of Central South University of Technology, 2005Co-Authors: Zheng Yajie, Zou Weihong, Yi Danqing, Gong Zhuqing, Li XinhaiAbstract:Electroless copper Plating process of N, N, N′, N′-tetrakis (2-hydroxypropyl)ethylenediamine(THPED) chelating agent was researched comprehensively. The results indicate that Plating Rate decreases with the 3H2O has a bad effect on deposits quality, but 2, 2′-dipyridyl and PEG make deposits quality improve greatly. Low concentration of 2-mercaptobenzothiozole (2-MBT) increases Plating Rate and improves deposits quality, but decreases Plating Rate and worsens deposits quality when 2-MBT reaches 5 mg/L. The optimal conditions of this electroless MBT are 16.8 g/L, 16.0 mL/L, 13.3 g/L, 0.5 g/L, 5.0 mg/L and 2.0 mg/L, respectively, pH value is 12.75,bath temperature is 30 ℃. Plating Rate reaches 9.54 μm/h Plating for 30 min in the bath. The SEM images demonstRate that the surface of copper film is smooth and the crystal is fine.
-
Electroless copper Plating process of N, N, N′, N′-tetrakis (2-hydroxypropyl) ethylenediamine system with high Plating Rate
Journal of Central South University of Technology, 2005Co-Authors: Zou Wei-hong, Yi Danqing, Gong Zhu-qing, Li XinhaiAbstract:Electroless copper Plating process of N, N, N′, N′-tetrakis (2-hydroxypropyl)ethylenediamine(THPED) chelating agent was researched comprehensively. The results indicate that Plating Rate decreases with the 3H2O has a bad effect on deposits quality, but 2, 2′-dipyridyl and PEG make deposits quality improve greatly. Low concentration of 2-mercaptobenzothiozole (2-MBT) increases Plating Rate and improves deposits quality, but decreases Plating Rate and worsens deposits quality when 2-MBT reaches 5 mg/L. The optimal conditions of this electroless MBT are 16.8 g/L, 16.0 mL/L, 13.3 g/L, 0.5 g/L, 5.0 mg/L and 2.0 mg/L, respectively, pH value is 12.75,bath temperature is 30 ℃. Plating Rate reaches 9.54 μm/h Plating for 30 min in the bath. The SEM images demonstRate that the surface of copper film is smooth and the crystal is fine.