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Joseph L. Cecchia - One of the best experts on this subject based on the ideXlab platform.
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Investigation of the Kinetics of Tungsten Chemical Mechanical Polishing in Potassium Iodate‐Based Slurries: II. Roles of Colloid Species and Slurry Chemistry
Journal of The Electrochemical Society, 1999Co-Authors: David J. Stein, Dale L. Hetherington, Joseph L. CecchiaAbstract:We investigated the role of colloid species and slurry chemistry in tungsten chemical mechanical polishing. Specifically, we measured polish rate and process temperature in Potassium Iodate-based slurries as a function of colloid species and concentration, slurry pH, and Potassium Iodate concentration, as well as polish pressure and polish rotation rate. We investigated slurries containing yttrium-, zirconium-, cerium-, and aluminum-based oxide and hydroxide colloids. We found that the colloid species had a large effect on polish rate and process temperature. The colloids showed two orders of magnitude in the polish rate range from ∼15 to ∼1975 A min -1 under otherwise identical experimental conditions (same polisher, pad, slurry chemistry, pressure, and rotation rates). Colloids of the same metal species from different sources also showed a large range in polish rates. Process temperature was a function of colloid species, however, the trend in polish rate did not always follow that of process temperature. Both polish rate and process temperature were dependent on Potassium Iodate concentration and slurry pH (controlled with a buffer). We also introduce a heuristic polish mechanism to investigate the role of the colloid surface chemistry and its interaction with the tungsten surface. The data indicate that the surface characteristics of the colloid and how this surface interacts with the tungsten surface play a significant role in the mechanism of tungsten removal during polish.
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investigation of the kinetics of tungsten chemical mechanical polishing in Potassium Iodate based slurries ii roles of colloid species and slurry chemistry
Journal of The Electrochemical Society, 1999Co-Authors: David J. Stein, Dale L. Hetherington, Joseph L. CecchiaAbstract:We investigated the role of colloid species and slurry chemistry in tungsten chemical mechanical polishing. Specifically, we measured polish rate and process temperature in Potassium Iodate-based slurries as a function of colloid species and concentration, slurry pH, and Potassium Iodate concentration, as well as polish pressure and polish rotation rate. We investigated slurries containing yttrium-, zirconium-, cerium-, and aluminum-based oxide and hydroxide colloids. We found that the colloid species had a large effect on polish rate and process temperature. The colloids showed two orders of magnitude in the polish rate range from ∼15 to ∼1975 A min -1 under otherwise identical experimental conditions (same polisher, pad, slurry chemistry, pressure, and rotation rates). Colloids of the same metal species from different sources also showed a large range in polish rates. Process temperature was a function of colloid species, however, the trend in polish rate did not always follow that of process temperature. Both polish rate and process temperature were dependent on Potassium Iodate concentration and slurry pH (controlled with a buffer). We also introduce a heuristic polish mechanism to investigate the role of the colloid surface chemistry and its interaction with the tungsten surface. The data indicate that the surface characteristics of the colloid and how this surface interacts with the tungsten surface play a significant role in the mechanism of tungsten removal during polish.
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Investigation of the Kinetics of Tungsten Chemical Mechanical Polishing in Potassium Iodate‐Based Slurries: I. Role of Alumina and Potassium lodate
Journal of The Electrochemical Society, 1999Co-Authors: David J. Stein, Dale L. Hetherington, Joseph L. CecchiaAbstract:We investigated aspects of the kinetics of tungsten chemical mechanical polishing (CMP) in Iodate‐based slurries. Specifically, we performed experiments in which we measured the tungsten polish rate and process temperature as a function of alumina concentration, Potassium Iodate concentration, platen temperature, polish pressure, polish rotation rate, and pad type. We found that the polish rate data fit a multiterm regression model better than the empirical Preston equation. Polish rate was found to vary with all of the factors investigated. Process temperature varied with all of the factors except Potassium Iodate concentration. These results, in combination with an energy balance on the entire process, indicate the change in temperature due to alumina concentration is mostly due to energy input from increased shaft work. This implies that the chemical and physical interactions between the alumina and tungsten surfaces are complex and play an important role in the mechanism of tungsten removal during CMP. © 1999 The Electrochemical Society. All rights reserved.
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investigation of the kinetics of tungsten chemical mechanical polishing in Potassium Iodate based slurries i role of alumina and Potassium lodate
Journal of The Electrochemical Society, 1999Co-Authors: David J. Stein, Dale L. Hetherington, Joseph L. CecchiaAbstract:We investigated aspects of the kinetics of tungsten chemical mechanical polishing (CMP) in Iodate‐based slurries. Specifically, we performed experiments in which we measured the tungsten polish rate and process temperature as a function of alumina concentration, Potassium Iodate concentration, platen temperature, polish pressure, polish rotation rate, and pad type. We found that the polish rate data fit a multiterm regression model better than the empirical Preston equation. Polish rate was found to vary with all of the factors investigated. Process temperature varied with all of the factors except Potassium Iodate concentration. These results, in combination with an energy balance on the entire process, indicate the change in temperature due to alumina concentration is mostly due to energy input from increased shaft work. This implies that the chemical and physical interactions between the alumina and tungsten surfaces are complex and play an important role in the mechanism of tungsten removal during CMP. © 1999 The Electrochemical Society. All rights reserved.
David J. Stein - One of the best experts on this subject based on the ideXlab platform.
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Investigation of the Kinetics of Tungsten Chemical Mechanical Polishing in Potassium Iodate‐Based Slurries: II. Roles of Colloid Species and Slurry Chemistry
Journal of The Electrochemical Society, 1999Co-Authors: David J. Stein, Dale L. Hetherington, Joseph L. CecchiaAbstract:We investigated the role of colloid species and slurry chemistry in tungsten chemical mechanical polishing. Specifically, we measured polish rate and process temperature in Potassium Iodate-based slurries as a function of colloid species and concentration, slurry pH, and Potassium Iodate concentration, as well as polish pressure and polish rotation rate. We investigated slurries containing yttrium-, zirconium-, cerium-, and aluminum-based oxide and hydroxide colloids. We found that the colloid species had a large effect on polish rate and process temperature. The colloids showed two orders of magnitude in the polish rate range from ∼15 to ∼1975 A min -1 under otherwise identical experimental conditions (same polisher, pad, slurry chemistry, pressure, and rotation rates). Colloids of the same metal species from different sources also showed a large range in polish rates. Process temperature was a function of colloid species, however, the trend in polish rate did not always follow that of process temperature. Both polish rate and process temperature were dependent on Potassium Iodate concentration and slurry pH (controlled with a buffer). We also introduce a heuristic polish mechanism to investigate the role of the colloid surface chemistry and its interaction with the tungsten surface. The data indicate that the surface characteristics of the colloid and how this surface interacts with the tungsten surface play a significant role in the mechanism of tungsten removal during polish.
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investigation of the kinetics of tungsten chemical mechanical polishing in Potassium Iodate based slurries ii roles of colloid species and slurry chemistry
Journal of The Electrochemical Society, 1999Co-Authors: David J. Stein, Dale L. Hetherington, Joseph L. CecchiaAbstract:We investigated the role of colloid species and slurry chemistry in tungsten chemical mechanical polishing. Specifically, we measured polish rate and process temperature in Potassium Iodate-based slurries as a function of colloid species and concentration, slurry pH, and Potassium Iodate concentration, as well as polish pressure and polish rotation rate. We investigated slurries containing yttrium-, zirconium-, cerium-, and aluminum-based oxide and hydroxide colloids. We found that the colloid species had a large effect on polish rate and process temperature. The colloids showed two orders of magnitude in the polish rate range from ∼15 to ∼1975 A min -1 under otherwise identical experimental conditions (same polisher, pad, slurry chemistry, pressure, and rotation rates). Colloids of the same metal species from different sources also showed a large range in polish rates. Process temperature was a function of colloid species, however, the trend in polish rate did not always follow that of process temperature. Both polish rate and process temperature were dependent on Potassium Iodate concentration and slurry pH (controlled with a buffer). We also introduce a heuristic polish mechanism to investigate the role of the colloid surface chemistry and its interaction with the tungsten surface. The data indicate that the surface characteristics of the colloid and how this surface interacts with the tungsten surface play a significant role in the mechanism of tungsten removal during polish.
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Investigation of the Kinetics of Tungsten Chemical Mechanical Polishing in Potassium Iodate‐Based Slurries: I. Role of Alumina and Potassium lodate
Journal of The Electrochemical Society, 1999Co-Authors: David J. Stein, Dale L. Hetherington, Joseph L. CecchiaAbstract:We investigated aspects of the kinetics of tungsten chemical mechanical polishing (CMP) in Iodate‐based slurries. Specifically, we performed experiments in which we measured the tungsten polish rate and process temperature as a function of alumina concentration, Potassium Iodate concentration, platen temperature, polish pressure, polish rotation rate, and pad type. We found that the polish rate data fit a multiterm regression model better than the empirical Preston equation. Polish rate was found to vary with all of the factors investigated. Process temperature varied with all of the factors except Potassium Iodate concentration. These results, in combination with an energy balance on the entire process, indicate the change in temperature due to alumina concentration is mostly due to energy input from increased shaft work. This implies that the chemical and physical interactions between the alumina and tungsten surfaces are complex and play an important role in the mechanism of tungsten removal during CMP. © 1999 The Electrochemical Society. All rights reserved.
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investigation of the kinetics of tungsten chemical mechanical polishing in Potassium Iodate based slurries i role of alumina and Potassium lodate
Journal of The Electrochemical Society, 1999Co-Authors: David J. Stein, Dale L. Hetherington, Joseph L. CecchiaAbstract:We investigated aspects of the kinetics of tungsten chemical mechanical polishing (CMP) in Iodate‐based slurries. Specifically, we performed experiments in which we measured the tungsten polish rate and process temperature as a function of alumina concentration, Potassium Iodate concentration, platen temperature, polish pressure, polish rotation rate, and pad type. We found that the polish rate data fit a multiterm regression model better than the empirical Preston equation. Polish rate was found to vary with all of the factors investigated. Process temperature varied with all of the factors except Potassium Iodate concentration. These results, in combination with an energy balance on the entire process, indicate the change in temperature due to alumina concentration is mostly due to energy input from increased shaft work. This implies that the chemical and physical interactions between the alumina and tungsten surfaces are complex and play an important role in the mechanism of tungsten removal during CMP. © 1999 The Electrochemical Society. All rights reserved.
Dale L. Hetherington - One of the best experts on this subject based on the ideXlab platform.
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Investigation of the Kinetics of Tungsten Chemical Mechanical Polishing in Potassium Iodate‐Based Slurries: II. Roles of Colloid Species and Slurry Chemistry
Journal of The Electrochemical Society, 1999Co-Authors: David J. Stein, Dale L. Hetherington, Joseph L. CecchiaAbstract:We investigated the role of colloid species and slurry chemistry in tungsten chemical mechanical polishing. Specifically, we measured polish rate and process temperature in Potassium Iodate-based slurries as a function of colloid species and concentration, slurry pH, and Potassium Iodate concentration, as well as polish pressure and polish rotation rate. We investigated slurries containing yttrium-, zirconium-, cerium-, and aluminum-based oxide and hydroxide colloids. We found that the colloid species had a large effect on polish rate and process temperature. The colloids showed two orders of magnitude in the polish rate range from ∼15 to ∼1975 A min -1 under otherwise identical experimental conditions (same polisher, pad, slurry chemistry, pressure, and rotation rates). Colloids of the same metal species from different sources also showed a large range in polish rates. Process temperature was a function of colloid species, however, the trend in polish rate did not always follow that of process temperature. Both polish rate and process temperature were dependent on Potassium Iodate concentration and slurry pH (controlled with a buffer). We also introduce a heuristic polish mechanism to investigate the role of the colloid surface chemistry and its interaction with the tungsten surface. The data indicate that the surface characteristics of the colloid and how this surface interacts with the tungsten surface play a significant role in the mechanism of tungsten removal during polish.
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investigation of the kinetics of tungsten chemical mechanical polishing in Potassium Iodate based slurries ii roles of colloid species and slurry chemistry
Journal of The Electrochemical Society, 1999Co-Authors: David J. Stein, Dale L. Hetherington, Joseph L. CecchiaAbstract:We investigated the role of colloid species and slurry chemistry in tungsten chemical mechanical polishing. Specifically, we measured polish rate and process temperature in Potassium Iodate-based slurries as a function of colloid species and concentration, slurry pH, and Potassium Iodate concentration, as well as polish pressure and polish rotation rate. We investigated slurries containing yttrium-, zirconium-, cerium-, and aluminum-based oxide and hydroxide colloids. We found that the colloid species had a large effect on polish rate and process temperature. The colloids showed two orders of magnitude in the polish rate range from ∼15 to ∼1975 A min -1 under otherwise identical experimental conditions (same polisher, pad, slurry chemistry, pressure, and rotation rates). Colloids of the same metal species from different sources also showed a large range in polish rates. Process temperature was a function of colloid species, however, the trend in polish rate did not always follow that of process temperature. Both polish rate and process temperature were dependent on Potassium Iodate concentration and slurry pH (controlled with a buffer). We also introduce a heuristic polish mechanism to investigate the role of the colloid surface chemistry and its interaction with the tungsten surface. The data indicate that the surface characteristics of the colloid and how this surface interacts with the tungsten surface play a significant role in the mechanism of tungsten removal during polish.
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Investigation of the Kinetics of Tungsten Chemical Mechanical Polishing in Potassium Iodate‐Based Slurries: I. Role of Alumina and Potassium lodate
Journal of The Electrochemical Society, 1999Co-Authors: David J. Stein, Dale L. Hetherington, Joseph L. CecchiaAbstract:We investigated aspects of the kinetics of tungsten chemical mechanical polishing (CMP) in Iodate‐based slurries. Specifically, we performed experiments in which we measured the tungsten polish rate and process temperature as a function of alumina concentration, Potassium Iodate concentration, platen temperature, polish pressure, polish rotation rate, and pad type. We found that the polish rate data fit a multiterm regression model better than the empirical Preston equation. Polish rate was found to vary with all of the factors investigated. Process temperature varied with all of the factors except Potassium Iodate concentration. These results, in combination with an energy balance on the entire process, indicate the change in temperature due to alumina concentration is mostly due to energy input from increased shaft work. This implies that the chemical and physical interactions between the alumina and tungsten surfaces are complex and play an important role in the mechanism of tungsten removal during CMP. © 1999 The Electrochemical Society. All rights reserved.
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investigation of the kinetics of tungsten chemical mechanical polishing in Potassium Iodate based slurries i role of alumina and Potassium lodate
Journal of The Electrochemical Society, 1999Co-Authors: David J. Stein, Dale L. Hetherington, Joseph L. CecchiaAbstract:We investigated aspects of the kinetics of tungsten chemical mechanical polishing (CMP) in Iodate‐based slurries. Specifically, we performed experiments in which we measured the tungsten polish rate and process temperature as a function of alumina concentration, Potassium Iodate concentration, platen temperature, polish pressure, polish rotation rate, and pad type. We found that the polish rate data fit a multiterm regression model better than the empirical Preston equation. Polish rate was found to vary with all of the factors investigated. Process temperature varied with all of the factors except Potassium Iodate concentration. These results, in combination with an energy balance on the entire process, indicate the change in temperature due to alumina concentration is mostly due to energy input from increased shaft work. This implies that the chemical and physical interactions between the alumina and tungsten surfaces are complex and play an important role in the mechanism of tungsten removal during CMP. © 1999 The Electrochemical Society. All rights reserved.
K. Muraleedharan - One of the best experts on this subject based on the ideXlab platform.
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Thermal decomposition kinetics of Potassium Iodate
Journal of Thermal Analysis and Calorimetry, 2013Co-Authors: K. MuraleedharanAbstract:The effect of gamma ray irradiation on the rate and kinetics of thermal decomposition of Potassium Iodate (KIO_3) has been studied by thermogravimetry (TG) under non-isothermal conditions at different heating rates (3, 5, 7, and 10 K min^−1). The thermal decomposition data were analyzed using isoconversional methods of Flynn–Wall–Ozawa, Kissinger–Akahira–Sunose, and Friedman. Irradiation with gamma rays increases the rate of the decomposition and is dependent on the irradiation dose. The activation energy decreases on irradiation. The enhancement of the rate of the thermal decomposition of KIO_3 upon irradiation is due to the combined effect of the production of displacements and extended lattice defects and chemical damage in KIO_3. Non-isothermal model fitting method of analysis showed that the thermal decomposition of irradiated KIO_3 is best described by the contracting sphere model equation, with an activation energy value of ~340 kJ mol^−1.
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Thermal decomposition kinetics of Potassium Iodate
Journal of Thermal Analysis and Calorimetry, 2010Co-Authors: K. MuraleedharanAbstract:The rate and kinetics of the thermal decomposition of Potassium Iodate (KIO3) has been studied as a function of particle size, in the range 63–150 μm, by isothermal thermogravimetry at different temperatures, 790, 795, 800 and 805 K in nitrogen atmosphere. The theoretical and experimental mass loss data are in good agreement for the thermal decomposition of all samples of KIO3 at all temperatures studied. The isothermal decomposition of all samples of KIO3 was subjected to both model-fitting and model-free (isoconversional) kinetic methods of analysis. It has been observed that the activation energy values are independent of the particle size. Isothermal model-fitting analysis shows that the thermal decomposition kinetics of all the samples of KIO3 studied can be best described by the contracting cube equation.
Shoji Kajigaeshi - One of the best experts on this subject based on the ideXlab platform.
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preparation of aromatic iodoacetyl derivatives by direct iodination with a Potassium iodide Potassium Iodate sulfuric acid system
Bulletin of the Chemical Society of Japan, 1992Co-Authors: Tsuyoshi Okamoto, Takaaki Kakinami, Tetsuo Nishimura, Irwan Hermawan, Shoji KajigaeshiAbstract:The reaction of aromatic acetyl derivatives with Potassium iodide and Potassium Iodate in acetic acid in the presence of sulfuric acid at room temperature gave iodoacethyl derivatives in good yields.