The Experts below are selected from a list of 273 Experts worldwide ranked by ideXlab platform
Eva E Simonyi - One of the best experts on this subject based on the ideXlab platform.
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Processing dependent thermal conductivity of nanoporous silica xerogel films
Journal of Applied Physics, 2002Co-Authors: Anurag Jain, Svetlana Rogojevic, Eva E Simonyi, Shom Ponoth, Shyng Tsong Chen, William N Gill, Joel L Plawsky, Paul S HoAbstract:Sintered xerogel films (porous SiO2) show a much higher thermal conductivity than other low dielectric constant (low-K) materials available for the same value of K. The thermal conductivity of xerogels which we have Processed using different methods is compared with that of other low-K materials such as silica hybrid (silsesquioxanes) and polymeric low-K materials. The methods used were: (1) single solvent (ethanol) method, (2) binary solvent (mixture of ethanol and ethylene glycol) method, (3) sintering. For the xerogel films, we show that Process History is as important as the chemistry of the solid matrix or the porosity in determining the thermal conductivity. The thermal conductivity, measured by the 3-ω method or the photothermal deflection method, is affected by phonon scattering, which in turn is effected by the size and distribution of pores and particles and the presence of imperfections such as interfaces, substituted chemical species, impurities, microcracks, and microporosity. The thermal con...
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effects of Processing History on the modulus of silica xerogel films
Journal of Applied Physics, 2001Co-Authors: Anurag Jain, Svetlana Rogojevic, Itty Matthew, Masaru Tomozawa, William N Gill, Joel L Plawsky, Eva E SimonyiAbstract:Sintered xerogel films (porous SiO2) show a higher elastic modulus than other amorphous low dielectric constant (K) materials available for the same value of K. By comparing xerogels that were sintered, templated or made with ethylene glycol or ethanol as solvents, we show that Process History is at least as important as the chemistry of the solid matrix or the porosity. The modulus extrapolated to zero porosity for the porous sintered and templated films is the same as those of the dense films made by chemical vapor deposition of SiO2. This suggests that the solid matrix for sintered xerogel films is close to ideal and their modulus is better because of the ordered arrangement of pores and fusion of particles making up the matrix. The modulus measured by nanoindentation on thick xerogel films (>0.8 μm) is well explained by the open cell foam model.
Anurag Jain - One of the best experts on this subject based on the ideXlab platform.
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Processing dependent thermal conductivity of nanoporous silica xerogel films
Journal of Applied Physics, 2002Co-Authors: Anurag Jain, Svetlana Rogojevic, Eva E Simonyi, Shom Ponoth, Shyng Tsong Chen, William N Gill, Joel L Plawsky, Paul S HoAbstract:Sintered xerogel films (porous SiO2) show a much higher thermal conductivity than other low dielectric constant (low-K) materials available for the same value of K. The thermal conductivity of xerogels which we have Processed using different methods is compared with that of other low-K materials such as silica hybrid (silsesquioxanes) and polymeric low-K materials. The methods used were: (1) single solvent (ethanol) method, (2) binary solvent (mixture of ethanol and ethylene glycol) method, (3) sintering. For the xerogel films, we show that Process History is as important as the chemistry of the solid matrix or the porosity in determining the thermal conductivity. The thermal conductivity, measured by the 3-ω method or the photothermal deflection method, is affected by phonon scattering, which in turn is effected by the size and distribution of pores and particles and the presence of imperfections such as interfaces, substituted chemical species, impurities, microcracks, and microporosity. The thermal con...
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effects of Processing History on the modulus of silica xerogel films
Journal of Applied Physics, 2001Co-Authors: Anurag Jain, Svetlana Rogojevic, Itty Matthew, Masaru Tomozawa, William N Gill, Joel L Plawsky, Eva E SimonyiAbstract:Sintered xerogel films (porous SiO2) show a higher elastic modulus than other amorphous low dielectric constant (K) materials available for the same value of K. By comparing xerogels that were sintered, templated or made with ethylene glycol or ethanol as solvents, we show that Process History is at least as important as the chemistry of the solid matrix or the porosity. The modulus extrapolated to zero porosity for the porous sintered and templated films is the same as those of the dense films made by chemical vapor deposition of SiO2. This suggests that the solid matrix for sintered xerogel films is close to ideal and their modulus is better because of the ordered arrangement of pores and fusion of particles making up the matrix. The modulus measured by nanoindentation on thick xerogel films (>0.8 μm) is well explained by the open cell foam model.
William N Gill - One of the best experts on this subject based on the ideXlab platform.
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Processing dependent thermal conductivity of nanoporous silica xerogel films
Journal of Applied Physics, 2002Co-Authors: Anurag Jain, Svetlana Rogojevic, Eva E Simonyi, Shom Ponoth, Shyng Tsong Chen, William N Gill, Joel L Plawsky, Paul S HoAbstract:Sintered xerogel films (porous SiO2) show a much higher thermal conductivity than other low dielectric constant (low-K) materials available for the same value of K. The thermal conductivity of xerogels which we have Processed using different methods is compared with that of other low-K materials such as silica hybrid (silsesquioxanes) and polymeric low-K materials. The methods used were: (1) single solvent (ethanol) method, (2) binary solvent (mixture of ethanol and ethylene glycol) method, (3) sintering. For the xerogel films, we show that Process History is as important as the chemistry of the solid matrix or the porosity in determining the thermal conductivity. The thermal conductivity, measured by the 3-ω method or the photothermal deflection method, is affected by phonon scattering, which in turn is effected by the size and distribution of pores and particles and the presence of imperfections such as interfaces, substituted chemical species, impurities, microcracks, and microporosity. The thermal con...
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effects of Processing History on the modulus of silica xerogel films
Journal of Applied Physics, 2001Co-Authors: Anurag Jain, Svetlana Rogojevic, Itty Matthew, Masaru Tomozawa, William N Gill, Joel L Plawsky, Eva E SimonyiAbstract:Sintered xerogel films (porous SiO2) show a higher elastic modulus than other amorphous low dielectric constant (K) materials available for the same value of K. By comparing xerogels that were sintered, templated or made with ethylene glycol or ethanol as solvents, we show that Process History is at least as important as the chemistry of the solid matrix or the porosity. The modulus extrapolated to zero porosity for the porous sintered and templated films is the same as those of the dense films made by chemical vapor deposition of SiO2. This suggests that the solid matrix for sintered xerogel films is close to ideal and their modulus is better because of the ordered arrangement of pores and fusion of particles making up the matrix. The modulus measured by nanoindentation on thick xerogel films (>0.8 μm) is well explained by the open cell foam model.
Joel L Plawsky - One of the best experts on this subject based on the ideXlab platform.
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Processing dependent thermal conductivity of nanoporous silica xerogel films
Journal of Applied Physics, 2002Co-Authors: Anurag Jain, Svetlana Rogojevic, Eva E Simonyi, Shom Ponoth, Shyng Tsong Chen, William N Gill, Joel L Plawsky, Paul S HoAbstract:Sintered xerogel films (porous SiO2) show a much higher thermal conductivity than other low dielectric constant (low-K) materials available for the same value of K. The thermal conductivity of xerogels which we have Processed using different methods is compared with that of other low-K materials such as silica hybrid (silsesquioxanes) and polymeric low-K materials. The methods used were: (1) single solvent (ethanol) method, (2) binary solvent (mixture of ethanol and ethylene glycol) method, (3) sintering. For the xerogel films, we show that Process History is as important as the chemistry of the solid matrix or the porosity in determining the thermal conductivity. The thermal conductivity, measured by the 3-ω method or the photothermal deflection method, is affected by phonon scattering, which in turn is effected by the size and distribution of pores and particles and the presence of imperfections such as interfaces, substituted chemical species, impurities, microcracks, and microporosity. The thermal con...
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effects of Processing History on the modulus of silica xerogel films
Journal of Applied Physics, 2001Co-Authors: Anurag Jain, Svetlana Rogojevic, Itty Matthew, Masaru Tomozawa, William N Gill, Joel L Plawsky, Eva E SimonyiAbstract:Sintered xerogel films (porous SiO2) show a higher elastic modulus than other amorphous low dielectric constant (K) materials available for the same value of K. By comparing xerogels that were sintered, templated or made with ethylene glycol or ethanol as solvents, we show that Process History is at least as important as the chemistry of the solid matrix or the porosity. The modulus extrapolated to zero porosity for the porous sintered and templated films is the same as those of the dense films made by chemical vapor deposition of SiO2. This suggests that the solid matrix for sintered xerogel films is close to ideal and their modulus is better because of the ordered arrangement of pores and fusion of particles making up the matrix. The modulus measured by nanoindentation on thick xerogel films (>0.8 μm) is well explained by the open cell foam model.
Svetlana Rogojevic - One of the best experts on this subject based on the ideXlab platform.
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Processing dependent thermal conductivity of nanoporous silica xerogel films
Journal of Applied Physics, 2002Co-Authors: Anurag Jain, Svetlana Rogojevic, Eva E Simonyi, Shom Ponoth, Shyng Tsong Chen, William N Gill, Joel L Plawsky, Paul S HoAbstract:Sintered xerogel films (porous SiO2) show a much higher thermal conductivity than other low dielectric constant (low-K) materials available for the same value of K. The thermal conductivity of xerogels which we have Processed using different methods is compared with that of other low-K materials such as silica hybrid (silsesquioxanes) and polymeric low-K materials. The methods used were: (1) single solvent (ethanol) method, (2) binary solvent (mixture of ethanol and ethylene glycol) method, (3) sintering. For the xerogel films, we show that Process History is as important as the chemistry of the solid matrix or the porosity in determining the thermal conductivity. The thermal conductivity, measured by the 3-ω method or the photothermal deflection method, is affected by phonon scattering, which in turn is effected by the size and distribution of pores and particles and the presence of imperfections such as interfaces, substituted chemical species, impurities, microcracks, and microporosity. The thermal con...
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effects of Processing History on the modulus of silica xerogel films
Journal of Applied Physics, 2001Co-Authors: Anurag Jain, Svetlana Rogojevic, Itty Matthew, Masaru Tomozawa, William N Gill, Joel L Plawsky, Eva E SimonyiAbstract:Sintered xerogel films (porous SiO2) show a higher elastic modulus than other amorphous low dielectric constant (K) materials available for the same value of K. By comparing xerogels that were sintered, templated or made with ethylene glycol or ethanol as solvents, we show that Process History is at least as important as the chemistry of the solid matrix or the porosity. The modulus extrapolated to zero porosity for the porous sintered and templated films is the same as those of the dense films made by chemical vapor deposition of SiO2. This suggests that the solid matrix for sintered xerogel films is close to ideal and their modulus is better because of the ordered arrangement of pores and fusion of particles making up the matrix. The modulus measured by nanoindentation on thick xerogel films (>0.8 μm) is well explained by the open cell foam model.