The Experts below are selected from a list of 324 Experts worldwide ranked by ideXlab platform

Dong-soo Kwon - One of the best experts on this subject based on the ideXlab platform.

  • THERMO-TACTILE INTERACTION USING TACTILE DISPLAY DEVICE
    IFAC Proceedings Volumes, 2016
    Co-Authors: Gi-hun Yang, Dong-soo Kwon
    Abstract:

    Abstract This paper proposes a tactile display mouse providing both pin-array type tactile display and thermal display. Micro shape and vibrotactile stimuli can be generated by pin-arrayed tactile display and various planar distributed patterns can be also displayed such as Braille cell patterns. Temperature and thermophysical property of object can be displayed by the thermal display device that is composed of a thin film Resistance Temperature Detector(RTD), a Peltier thermoelectric heat pump and a water cooling jacket. To investigate thermo-tactile interaction, an experiment asking perceived magnitude of vibrotactile stimulus according to different Temperature condition was conducted.

  • Development of Quantitative Tactile Display Device to Provide Both Pin- Array-Type Tactile Feedback and Thermal Feedback
    Second Joint EuroHaptics Conference and Symposium on Haptic Interfaces for Virtual Environment and Teleoperator Systems (WHC'07), 2007
    Co-Authors: Gi-hun Yang, Ki-uk Kyung, M.a. Srinivasan, Dong-soo Kwon
    Abstract:

    This paper proposes a tactile display device that can provide both pin-array type tactile feedback and thermal feedback. The pin-array type tactile display is composed of a 6times5 pin-array that is individually actuated by 30 piezoelectric bimorphs. Micro shape and vibrotactile feedback can be generated by the device, and various planar distributed patterns can be displayed as can Braille cell patterns. The thermal feedback device is composed of a thin film Resistance Temperature Detector (RTD), a thermal pad as pin guide made of copper, 3 Peltier thermoelectric heat pumps and a water cooling jacket. Thermal feedback device allows that users can discriminate among different materials by considering the Temperature variation that can be sensed as they touch an object's surface with stimulating heat transfer phenomena between a fingertip and an object

  • Quantitative tactile display device with pin-array type tactile feedback and thermal feedback
    Proceedings 2006 IEEE International Conference on Robotics and Automation 2006. ICRA 2006., 2006
    Co-Authors: Gi-hun Yang, Ki-uk Kyung, M.a. Srinivasan, Dong-soo Kwon
    Abstract:

    This paper proposes a tactile display device providing pin-array type tactile feedback and thermal feedback. The pin-array type tactile display is composed of a 6times5 pin-array that is actuated by 30 piezoelectric bimorphs. Micro shape and vibrotactile feedback can be generated by the device, and various planar distributed patterns can be displayed as can braille cell patterns. The thermal feedback device is composed of a thin film Resistance Temperature Detector (RTD), a Peltier thermoelectric heat pump and a water cooling jacket. Users can discriminate among different materials by considering the Temperature variation that can be sensed as they touch an object's surface. This paper also includes an experimental evaluation of the device to prove effectiveness of displaying textures. Material property discriminating evaluation was conducted using thermal feedback device that displays simulated Temperature profile. To determine the relation between stimulated area and thermal perception sensitivity, a thermal perception experimental setup is developed and the experimental method is described

Gi-hun Yang - One of the best experts on this subject based on the ideXlab platform.

  • THERMO-TACTILE INTERACTION USING TACTILE DISPLAY DEVICE
    IFAC Proceedings Volumes, 2016
    Co-Authors: Gi-hun Yang, Dong-soo Kwon
    Abstract:

    Abstract This paper proposes a tactile display mouse providing both pin-array type tactile display and thermal display. Micro shape and vibrotactile stimuli can be generated by pin-arrayed tactile display and various planar distributed patterns can be also displayed such as Braille cell patterns. Temperature and thermophysical property of object can be displayed by the thermal display device that is composed of a thin film Resistance Temperature Detector(RTD), a Peltier thermoelectric heat pump and a water cooling jacket. To investigate thermo-tactile interaction, an experiment asking perceived magnitude of vibrotactile stimulus according to different Temperature condition was conducted.

  • Development of Quantitative Tactile Display Device to Provide Both Pin- Array-Type Tactile Feedback and Thermal Feedback
    Second Joint EuroHaptics Conference and Symposium on Haptic Interfaces for Virtual Environment and Teleoperator Systems (WHC'07), 2007
    Co-Authors: Gi-hun Yang, Ki-uk Kyung, M.a. Srinivasan, Dong-soo Kwon
    Abstract:

    This paper proposes a tactile display device that can provide both pin-array type tactile feedback and thermal feedback. The pin-array type tactile display is composed of a 6times5 pin-array that is individually actuated by 30 piezoelectric bimorphs. Micro shape and vibrotactile feedback can be generated by the device, and various planar distributed patterns can be displayed as can Braille cell patterns. The thermal feedback device is composed of a thin film Resistance Temperature Detector (RTD), a thermal pad as pin guide made of copper, 3 Peltier thermoelectric heat pumps and a water cooling jacket. Thermal feedback device allows that users can discriminate among different materials by considering the Temperature variation that can be sensed as they touch an object's surface with stimulating heat transfer phenomena between a fingertip and an object

  • Quantitative tactile display device with pin-array type tactile feedback and thermal feedback
    Proceedings 2006 IEEE International Conference on Robotics and Automation 2006. ICRA 2006., 2006
    Co-Authors: Gi-hun Yang, Ki-uk Kyung, M.a. Srinivasan, Dong-soo Kwon
    Abstract:

    This paper proposes a tactile display device providing pin-array type tactile feedback and thermal feedback. The pin-array type tactile display is composed of a 6times5 pin-array that is actuated by 30 piezoelectric bimorphs. Micro shape and vibrotactile feedback can be generated by the device, and various planar distributed patterns can be displayed as can braille cell patterns. The thermal feedback device is composed of a thin film Resistance Temperature Detector (RTD), a Peltier thermoelectric heat pump and a water cooling jacket. Users can discriminate among different materials by considering the Temperature variation that can be sensed as they touch an object's surface. This paper also includes an experimental evaluation of the device to prove effectiveness of displaying textures. Material property discriminating evaluation was conducted using thermal feedback device that displays simulated Temperature profile. To determine the relation between stimulated area and thermal perception sensitivity, a thermal perception experimental setup is developed and the experimental method is described

A Bhattacharyya - One of the best experts on this subject based on the ideXlab platform.

  • burn in and thermal cyclic tests to determine the short term reliability of a thin film Resistance Temperature Detector
    Microelectronics Reliability, 2012
    Co-Authors: Julian W Post, A Bhattacharyya
    Abstract:

    Abstract In this paper, experimental data and theory are presented for two methods of the thermal failure of a multi-layer, thin film Resistance Temperature Detector (RTD). The methods are: (i) while placed in a low pressure inert gas atmosphere, the Temperature of the RTD was increased incrementally by means of joule heating until failure (burn-in test), and (ii) the RTD was thermally cycled in both a low-pressure inert gas atmosphere as well as in air at atmospheric pressure. The performance of the RTD was analyzed with respect to three factors: (i) changes in electrical resistivity with respect to Temperature of the Ti–Cu–Ti trace that forms the conductive path of the RTD, (ii) degradation of the encapsulation layers, especially the Benzocyclobutene (BCB) with emphasis on its impact on radiation, and (iii) failure of the trace due to crack formation. Environmental effects on performance and probable causes of failure are discussed.

  • experimental results and a user friendly model of heat transfer from a thin film Resistance Temperature Detector
    Applied Thermal Engineering, 2009
    Co-Authors: Julian W Post, A Bhattacharyya, M Imran
    Abstract:

    Abstract The research reported in this paper has focused on the different modes of heat transfer – conductive (to the substrate), conductive and convective (to the environment) and radiative (to the environment) – from an on-chip Resistance Temperature Detector (RTD). The study has been carried out at various input voltages, various pressures ranging from atmospheric to vacuum, and for two classes of platforms for the device – thermal insulators (glass wool and ceramic), and a thermal conductor (aluminum block). The transient Temperature–time response of the RTD under the various conditions stated above was recorded. A heat transfer model approximately accounting for all the modes of heat transfer was introduced. The calibration parameters of the model allowed us to quantify the different modes of heat transfer. The model uncovers the fact that the heat losses to the environment via conduction and convection are almost as much as the heat lost by radiation (radiative effects were unequivocally confirmed experimentally). Compared to these losses, conductive heat losses from the RTD to its underlying substructure are far more dominant (almost five times). We also give an analysis originating from the exact form of conservation of energy and demonstrate that the use of the simplified model has led to the most dominant heat transfer mode of conduction to the substrate being underestimated by no more than 7.89% (at the highest input power tested).

  • saline soak tests to determine the short term reliability of an in situ thin film Resistance Temperature Detector
    Microelectronics Reliability, 2008
    Co-Authors: Julian W Post, A Bhattacharyya
    Abstract:

    Abstract With an objective to assess the short-term reliability of thin film, encapsulated Resistance Temperature Detectors (RTDs) in corrosive environments, these were placed in aqueous soak solutions of double de-ionized water (DDI) and phosphate buffered solution (PBS) or saline for eight weeks. They were removed weekly in order to characterize the effects of the solutions on their electrical properties, as well as their thermal response. The solutions were analyzed weekly as well with an FT-IR spectrometer in order to determine if chemical reactions took place during the soak tests and optical micrographic studies were carried out too. The RTDs appeared not to suffer degradation during the period of study. Nonetheless, it turned out that the soak tests offer a user-friendly and safe approach to remove the Benzocyclobutene (BCB) layer; this is an issue that is likely to be of some interest in the electronics fabrication community.

  • effect of thin film thicknesses and materials on the response of rtds and microthermocouples
    IEEE Sensors Journal, 2006
    Co-Authors: M Imran, A Bhattacharyya
    Abstract:

    Fabrication and thermal characterization of a Resistance Temperature Detector (RTD) heater and microthermocouples (MTs) on silicon substrates have been reported in this paper. The influence of film thickness and nickel-gold (Au) electroplating on RTD on its steady-state Temperature with respect to its steady-state electrical power input and Resistance is studied. Further, the thermal effects of multiple thermocouples in a thermopile as well as the effects of Au layers in the contact pads of the thermopiles on their open-circuit Seebeck voltage are studied. Therein lies the novelty of this paper. The in situ operating relationships for the RTD heater and the MT are provided

  • the effects of heat sinks and environmental pressure on the transient thermal response of a Resistance Temperature Detector rtd
    Proceedings of SPIE the International Society for Optical Engineering, 2006
    Co-Authors: Julian W Post, M Imran, A Bhattacharyya
    Abstract:

    Compactness and portability of MEMS sensors and actuators with dedicated power sources are governed not only by the size of the system components but also by the size and durability of the power source itself. This work is part of a project on the characterization and modeling of heat transfer of an on-chip assembly of RTDs (Resistance Temperature Detectors), microthermocouples and thin films of different materials. In this paper, we investigate the effects of conductive and convective heat transfer on the response of an RTD. Especially, the effects of a range of pressures from atmospheric to near-vacuum conditions at different applied voltages on the electrical energy consumption of an on-chip RTD are investigated. The transient Temperature - time response as well as the power consumption of the RTD under the aforementioned conditions are also reported. Conductive effects are far more important than any other heat transfer mechanism; these effects are quantified.

M Imran - One of the best experts on this subject based on the ideXlab platform.

  • experimental results and a user friendly model of heat transfer from a thin film Resistance Temperature Detector
    Applied Thermal Engineering, 2009
    Co-Authors: Julian W Post, A Bhattacharyya, M Imran
    Abstract:

    Abstract The research reported in this paper has focused on the different modes of heat transfer – conductive (to the substrate), conductive and convective (to the environment) and radiative (to the environment) – from an on-chip Resistance Temperature Detector (RTD). The study has been carried out at various input voltages, various pressures ranging from atmospheric to vacuum, and for two classes of platforms for the device – thermal insulators (glass wool and ceramic), and a thermal conductor (aluminum block). The transient Temperature–time response of the RTD under the various conditions stated above was recorded. A heat transfer model approximately accounting for all the modes of heat transfer was introduced. The calibration parameters of the model allowed us to quantify the different modes of heat transfer. The model uncovers the fact that the heat losses to the environment via conduction and convection are almost as much as the heat lost by radiation (radiative effects were unequivocally confirmed experimentally). Compared to these losses, conductive heat losses from the RTD to its underlying substructure are far more dominant (almost five times). We also give an analysis originating from the exact form of conservation of energy and demonstrate that the use of the simplified model has led to the most dominant heat transfer mode of conduction to the substrate being underestimated by no more than 7.89% (at the highest input power tested).

  • effect of thin film thicknesses and materials on the response of rtds and microthermocouples
    IEEE Sensors Journal, 2006
    Co-Authors: M Imran, A Bhattacharyya
    Abstract:

    Fabrication and thermal characterization of a Resistance Temperature Detector (RTD) heater and microthermocouples (MTs) on silicon substrates have been reported in this paper. The influence of film thickness and nickel-gold (Au) electroplating on RTD on its steady-state Temperature with respect to its steady-state electrical power input and Resistance is studied. Further, the thermal effects of multiple thermocouples in a thermopile as well as the effects of Au layers in the contact pads of the thermopiles on their open-circuit Seebeck voltage are studied. Therein lies the novelty of this paper. The in situ operating relationships for the RTD heater and the MT are provided

  • the effects of heat sinks and environmental pressure on the transient thermal response of a Resistance Temperature Detector rtd
    Proceedings of SPIE the International Society for Optical Engineering, 2006
    Co-Authors: Julian W Post, M Imran, A Bhattacharyya
    Abstract:

    Compactness and portability of MEMS sensors and actuators with dedicated power sources are governed not only by the size of the system components but also by the size and durability of the power source itself. This work is part of a project on the characterization and modeling of heat transfer of an on-chip assembly of RTDs (Resistance Temperature Detectors), microthermocouples and thin films of different materials. In this paper, we investigate the effects of conductive and convective heat transfer on the response of an RTD. Especially, the effects of a range of pressures from atmospheric to near-vacuum conditions at different applied voltages on the electrical energy consumption of an on-chip RTD are investigated. The transient Temperature - time response as well as the power consumption of the RTD under the aforementioned conditions are also reported. Conductive effects are far more important than any other heat transfer mechanism; these effects are quantified.

Julian W Post - One of the best experts on this subject based on the ideXlab platform.

  • burn in and thermal cyclic tests to determine the short term reliability of a thin film Resistance Temperature Detector
    Microelectronics Reliability, 2012
    Co-Authors: Julian W Post, A Bhattacharyya
    Abstract:

    Abstract In this paper, experimental data and theory are presented for two methods of the thermal failure of a multi-layer, thin film Resistance Temperature Detector (RTD). The methods are: (i) while placed in a low pressure inert gas atmosphere, the Temperature of the RTD was increased incrementally by means of joule heating until failure (burn-in test), and (ii) the RTD was thermally cycled in both a low-pressure inert gas atmosphere as well as in air at atmospheric pressure. The performance of the RTD was analyzed with respect to three factors: (i) changes in electrical resistivity with respect to Temperature of the Ti–Cu–Ti trace that forms the conductive path of the RTD, (ii) degradation of the encapsulation layers, especially the Benzocyclobutene (BCB) with emphasis on its impact on radiation, and (iii) failure of the trace due to crack formation. Environmental effects on performance and probable causes of failure are discussed.

  • experimental results and a user friendly model of heat transfer from a thin film Resistance Temperature Detector
    Applied Thermal Engineering, 2009
    Co-Authors: Julian W Post, A Bhattacharyya, M Imran
    Abstract:

    Abstract The research reported in this paper has focused on the different modes of heat transfer – conductive (to the substrate), conductive and convective (to the environment) and radiative (to the environment) – from an on-chip Resistance Temperature Detector (RTD). The study has been carried out at various input voltages, various pressures ranging from atmospheric to vacuum, and for two classes of platforms for the device – thermal insulators (glass wool and ceramic), and a thermal conductor (aluminum block). The transient Temperature–time response of the RTD under the various conditions stated above was recorded. A heat transfer model approximately accounting for all the modes of heat transfer was introduced. The calibration parameters of the model allowed us to quantify the different modes of heat transfer. The model uncovers the fact that the heat losses to the environment via conduction and convection are almost as much as the heat lost by radiation (radiative effects were unequivocally confirmed experimentally). Compared to these losses, conductive heat losses from the RTD to its underlying substructure are far more dominant (almost five times). We also give an analysis originating from the exact form of conservation of energy and demonstrate that the use of the simplified model has led to the most dominant heat transfer mode of conduction to the substrate being underestimated by no more than 7.89% (at the highest input power tested).

  • saline soak tests to determine the short term reliability of an in situ thin film Resistance Temperature Detector
    Microelectronics Reliability, 2008
    Co-Authors: Julian W Post, A Bhattacharyya
    Abstract:

    Abstract With an objective to assess the short-term reliability of thin film, encapsulated Resistance Temperature Detectors (RTDs) in corrosive environments, these were placed in aqueous soak solutions of double de-ionized water (DDI) and phosphate buffered solution (PBS) or saline for eight weeks. They were removed weekly in order to characterize the effects of the solutions on their electrical properties, as well as their thermal response. The solutions were analyzed weekly as well with an FT-IR spectrometer in order to determine if chemical reactions took place during the soak tests and optical micrographic studies were carried out too. The RTDs appeared not to suffer degradation during the period of study. Nonetheless, it turned out that the soak tests offer a user-friendly and safe approach to remove the Benzocyclobutene (BCB) layer; this is an issue that is likely to be of some interest in the electronics fabrication community.

  • the effects of heat sinks and environmental pressure on the transient thermal response of a Resistance Temperature Detector rtd
    Proceedings of SPIE the International Society for Optical Engineering, 2006
    Co-Authors: Julian W Post, M Imran, A Bhattacharyya
    Abstract:

    Compactness and portability of MEMS sensors and actuators with dedicated power sources are governed not only by the size of the system components but also by the size and durability of the power source itself. This work is part of a project on the characterization and modeling of heat transfer of an on-chip assembly of RTDs (Resistance Temperature Detectors), microthermocouples and thin films of different materials. In this paper, we investigate the effects of conductive and convective heat transfer on the response of an RTD. Especially, the effects of a range of pressures from atmospheric to near-vacuum conditions at different applied voltages on the electrical energy consumption of an on-chip RTD are investigated. The transient Temperature - time response as well as the power consumption of the RTD under the aforementioned conditions are also reported. Conductive effects are far more important than any other heat transfer mechanism; these effects are quantified.