Semiconductor Lithography

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Rahul Kapoor - One of the best experts on this subject based on the ideXlab platform.

  • value creation in innovation ecosystems how the structure of technological interdependence affects firm performance in new technology generations
    Strategic Management Journal, 2010
    Co-Authors: Ron Adner, Rahul Kapoor
    Abstract:

    The success of an innovating firm often depends on the efforts of other innovators in its environment. How do the challenges faced by external innovators affect the focal firm's outcomes? To address this question we first characterize the external environment according to the structure of interdependence. We follow the flow of inputs and outputs in the ecosystem to distinguish between upstream components that are bundled by the focal firm, and downstream complements that are bundled by the firm's customers. We hypothesize that the effects of external innovation challenges depend not only on their magnitude, but also on their location in the ecosystem relative to the focal firm. We identify a key asymmetry that results from the location of challenges relative to a focal firm—greater upstream innovation challenges in components enhance the benefits that accrue to technology leaders, while greater downstream innovation challenges in complements erode these benefits. We further propose that the effectiveness of vertical integration as a strategy to manage ecosystem interdependence increases over the course of the technology life cycle. We explore these arguments in the context of the global Semiconductor Lithography equipment industry from its emergence in 1962 to 2005 across nine distinct technology generations. We find strong empirical support for our framework. Copyright © 2009 John Wiley & Sons, Ltd.

  • value creation in innovation ecosystems how the structure of technological interdependence affects firm performance in new technology generations
    2009
    Co-Authors: Ron Adner, Rahul Kapoor
    Abstract:

    The success of an innovating firm often depends on the efforts of other innovators in its environment. How do the challenges faced by external innovators affect the focal firm's outcomes? To address this question we first characterize the external environment according to the structure of interdependence. We follow the flow of inputs and outputs in the ecosystem to distinguish between upstream components that are bundled by the focal firm, and downstream complements that are bundled by the firm's customers. We argue that the effect of external innovation challenges depends not only on their magnitude, but also on their location in the ecosystem relative to the focal firm - whereas greater innovation challenges in components enhances the benefits that accrue to technology leaders, greater innovation challenges in complements erodes these benefits. We further argue that the effectiveness of vertical integration as a strategy to manage ecosystem interdependence increases over the course of the technology life cycle. We explore these arguments in the context of the global Semiconductor Lithography industry from its emergence in 1962 to 2005 across nine distinct technology generations. We find strong support for our arguments.

Xuegong Deng - One of the best experts on this subject based on the ideXlab platform.

  • high performance large area deep ultraviolet to infrared polarizers based on 40 nm line 78 nm space nanowire grids
    Applied Physics Letters, 2007
    Co-Authors: Jian Jim Wang, Frank Walters, Xiaoming Liu, Paul Sciortino, Xuegong Deng
    Abstract:

    Large-area, 100mm in diameter, aluminum nanowire grids with 40nm line/78nm space were fabricated with full-wafer immersion interference Lithography. The aluminum nanowire grids with a 59nm half-pitch work as a highly efficient optical polarizer for deep ultraviolet wavelength down to ∼250nm. In addition, an extremely high contrast from 10 000:1 to 50 000:1 was achieved across the whole visible and near-infrared wavelength range, along with good transmittance (85%–90%). The broadband large-area high-performance polarizer operating down to deep ultraviolet wavelength opens up applications including Semiconductor Lithography and metrology applications.

Ron Adner - One of the best experts on this subject based on the ideXlab platform.

  • value creation in innovation ecosystems how the structure of technological interdependence affects firm performance in new technology generations
    Strategic Management Journal, 2010
    Co-Authors: Ron Adner, Rahul Kapoor
    Abstract:

    The success of an innovating firm often depends on the efforts of other innovators in its environment. How do the challenges faced by external innovators affect the focal firm's outcomes? To address this question we first characterize the external environment according to the structure of interdependence. We follow the flow of inputs and outputs in the ecosystem to distinguish between upstream components that are bundled by the focal firm, and downstream complements that are bundled by the firm's customers. We hypothesize that the effects of external innovation challenges depend not only on their magnitude, but also on their location in the ecosystem relative to the focal firm. We identify a key asymmetry that results from the location of challenges relative to a focal firm—greater upstream innovation challenges in components enhance the benefits that accrue to technology leaders, while greater downstream innovation challenges in complements erode these benefits. We further propose that the effectiveness of vertical integration as a strategy to manage ecosystem interdependence increases over the course of the technology life cycle. We explore these arguments in the context of the global Semiconductor Lithography equipment industry from its emergence in 1962 to 2005 across nine distinct technology generations. We find strong empirical support for our framework. Copyright © 2009 John Wiley & Sons, Ltd.

  • value creation in innovation ecosystems how the structure of technological interdependence affects firm performance in new technology generations
    2009
    Co-Authors: Ron Adner, Rahul Kapoor
    Abstract:

    The success of an innovating firm often depends on the efforts of other innovators in its environment. How do the challenges faced by external innovators affect the focal firm's outcomes? To address this question we first characterize the external environment according to the structure of interdependence. We follow the flow of inputs and outputs in the ecosystem to distinguish between upstream components that are bundled by the focal firm, and downstream complements that are bundled by the firm's customers. We argue that the effect of external innovation challenges depends not only on their magnitude, but also on their location in the ecosystem relative to the focal firm - whereas greater innovation challenges in components enhances the benefits that accrue to technology leaders, greater innovation challenges in complements erodes these benefits. We further argue that the effectiveness of vertical integration as a strategy to manage ecosystem interdependence increases over the course of the technology life cycle. We explore these arguments in the context of the global Semiconductor Lithography industry from its emergence in 1962 to 2005 across nine distinct technology generations. We find strong support for our arguments.

Jian Jim Wang - One of the best experts on this subject based on the ideXlab platform.

  • high performance large area deep ultraviolet to infrared polarizers based on 40 nm line 78 nm space nanowire grids
    Applied Physics Letters, 2007
    Co-Authors: Jian Jim Wang, Frank Walters, Xiaoming Liu, Paul Sciortino, Xuegong Deng
    Abstract:

    Large-area, 100mm in diameter, aluminum nanowire grids with 40nm line/78nm space were fabricated with full-wafer immersion interference Lithography. The aluminum nanowire grids with a 59nm half-pitch work as a highly efficient optical polarizer for deep ultraviolet wavelength down to ∼250nm. In addition, an extremely high contrast from 10 000:1 to 50 000:1 was achieved across the whole visible and near-infrared wavelength range, along with good transmittance (85%–90%). The broadband large-area high-performance polarizer operating down to deep ultraviolet wavelength opens up applications including Semiconductor Lithography and metrology applications.

Paul Sciortino - One of the best experts on this subject based on the ideXlab platform.

  • high performance large area deep ultraviolet to infrared polarizers based on 40 nm line 78 nm space nanowire grids
    Applied Physics Letters, 2007
    Co-Authors: Jian Jim Wang, Frank Walters, Xiaoming Liu, Paul Sciortino, Xuegong Deng
    Abstract:

    Large-area, 100mm in diameter, aluminum nanowire grids with 40nm line/78nm space were fabricated with full-wafer immersion interference Lithography. The aluminum nanowire grids with a 59nm half-pitch work as a highly efficient optical polarizer for deep ultraviolet wavelength down to ∼250nm. In addition, an extremely high contrast from 10 000:1 to 50 000:1 was achieved across the whole visible and near-infrared wavelength range, along with good transmittance (85%–90%). The broadband large-area high-performance polarizer operating down to deep ultraviolet wavelength opens up applications including Semiconductor Lithography and metrology applications.