The Experts below are selected from a list of 360 Experts worldwide ranked by ideXlab platform
A S Budiman - One of the best experts on this subject based on the ideXlab platform.
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probing stress and fracture mechanism in encapsulated thin silicon solar cells by synchrotron x ray microdiffraction
Solar Energy Materials and Solar Cells, 2017Co-Authors: Vincent Handara, Ihor Radchenko, Sasi Kumar Tippabhotla, Karthic R Narayanan, Gregoria Illya, Martin Kunz, Nobumichi Tamura, A S BudimanAbstract:Author(s): Handara, VA; Radchenko, I; Tippabhotla, SK; Narayanan, K; Illya, G; Kunz, M; Tamura, N; Budiman, AS | Abstract: © 2016 Elsevier B.V. Thin (l150 µm) silicon solar cell technology is attractive due to the Significant Cost Reduction associated with it. Consequently, fracture mechanisms in the thin silicon solar cells during soldering and lamination need to be fully understood quantitatively in order to enable photovoltaics (PV) systems implementation in both manufacturing and field operations. Synchrotron X-ray Microdiffraction (µSXRD) has proven to be a very effective means to quantitatively probe the mechanical stress which is the driving force of the fracture mechanisms (initiation, propagation, and propensity) in the thin silicon solar cells, especially when they are already encapsulated. In this article, we present the first ever stress examination in encapsulated thin silicon solar cells and show how nominally the same silicon solar cells encapsulated by different polymer encapsulants could have very different residual stresses after the lamination process. It is then not difficult to see how the earlier observation, as reported by Sander et al. (2013) [1], of very different fracture rates within the same silicon solar cells encapsulated by different Ethylene Vinyl Acetate (EVA) materials could come about. The complete second degree tensor components of the residual stress of the silicon solar cells after lamination process are also reported in this paper signifying the full and unique capabilities of the Synchrotron X-Ray Microdiffraction technique not only for measuring residual stress but also for measuring other potential mechanical damage within thin silicon solar cells.
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synchrotron x ray micro diffraction probing stress state in encapsulated thin silicon solar cells
Procedia Engineering, 2016Co-Authors: Sasi Kumar Tippabhotla, Vincent Handara, Ihor Radchenko, Gregoria Illya, Martin Kunz, Nobumichi Tamura, Karthic Narayanan Rengarajan, A S BudimanAbstract:Abstract There has been a strong commercial push towards thinner silicon in the solar photovoltaic (PV) technologies due to the Significant Cost Reduction associated with it. However, in current products made from crystalline solar cell technologies, normal in-plane tensile stress resulting in fracture of silicon cells are observed. To further understand this phenomenon, the synchrotron X-ray micro-diffraction tool was used to perform stress measurements and mapping of the solar cells in the vicinity of the most typically observed crack initiation location, the solder joint. This technique is unique as it has the capabilities to quantitatively determine the stresses and map these stresses with a micron resolution, all while the silicon cells are in encapsulation. A fundamental understanding of the stress magnitudes as well as microstructural characteristics that could lead to crack initiation and propagation could be obtained with this technique. This also confirms that the control of mechanical stress is the key to enable thin silicon solar cell technologies in the coming years.
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enabling thin silicon technologies for next generation c si solar pv renewable energy systems using synchrotron x ray microdiffraction as stress and crack mechanism probe
Solar Energy Materials and Solar Cells, 2014Co-Authors: A S Budiman, Vincent Handara, Gregoria Illya, Martin Kunz, Nobumichi Tamura, W A Caldwell, C Bonelli, D VerstraetenAbstract:Abstract Recently, there has been a strong commercial push toward thinner silicon in the solar photovoltaic (PV) technologies due to the Significant Cost Reduction associated with it. Tensile stress (normal, in-plane) and fracture of the silicon cells are increasingly observed and reported for products of crystalline solar cell technologies. In an effort to shed light on these topics, stress measurements and mapping of the solar cells in the vicinity of the most typically observed crack initiation locations using synchrotron X-ray microdiffraction technique was conducted and are reported in this paper. The technique is unique as it has the capabilities to quantitatively determine stresses in silicon and to map these stresses with a micron resolution, all while the silicon cells are already encapsulated. With this technique, we aim to gain fundamental understanding of the stress magnitudes as well as characteristics that could lead to crack initiation and propagation. We have thus far found evidences of both extrinsic (device related) as well as intrinsic (crystallographic) nature of silicon cracking, which further confirm that the control of mechanical stress is the key to enable thin silicon solar cell technologies in the coming years. This study represents an ongoing high impact technology research that addresses real and important fundamental materials issue facing the crystalline silicon solar PV industry and contributes directly to the industry drive to reduce Cost of PV systems to grid parity.
Vincent Handara - One of the best experts on this subject based on the ideXlab platform.
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probing stress and fracture mechanism in encapsulated thin silicon solar cells by synchrotron x ray microdiffraction
Solar Energy Materials and Solar Cells, 2017Co-Authors: Vincent Handara, Ihor Radchenko, Sasi Kumar Tippabhotla, Karthic R Narayanan, Gregoria Illya, Martin Kunz, Nobumichi Tamura, A S BudimanAbstract:Author(s): Handara, VA; Radchenko, I; Tippabhotla, SK; Narayanan, K; Illya, G; Kunz, M; Tamura, N; Budiman, AS | Abstract: © 2016 Elsevier B.V. Thin (l150 µm) silicon solar cell technology is attractive due to the Significant Cost Reduction associated with it. Consequently, fracture mechanisms in the thin silicon solar cells during soldering and lamination need to be fully understood quantitatively in order to enable photovoltaics (PV) systems implementation in both manufacturing and field operations. Synchrotron X-ray Microdiffraction (µSXRD) has proven to be a very effective means to quantitatively probe the mechanical stress which is the driving force of the fracture mechanisms (initiation, propagation, and propensity) in the thin silicon solar cells, especially when they are already encapsulated. In this article, we present the first ever stress examination in encapsulated thin silicon solar cells and show how nominally the same silicon solar cells encapsulated by different polymer encapsulants could have very different residual stresses after the lamination process. It is then not difficult to see how the earlier observation, as reported by Sander et al. (2013) [1], of very different fracture rates within the same silicon solar cells encapsulated by different Ethylene Vinyl Acetate (EVA) materials could come about. The complete second degree tensor components of the residual stress of the silicon solar cells after lamination process are also reported in this paper signifying the full and unique capabilities of the Synchrotron X-Ray Microdiffraction technique not only for measuring residual stress but also for measuring other potential mechanical damage within thin silicon solar cells.
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synchrotron x ray micro diffraction probing stress state in encapsulated thin silicon solar cells
Procedia Engineering, 2016Co-Authors: Sasi Kumar Tippabhotla, Vincent Handara, Ihor Radchenko, Gregoria Illya, Martin Kunz, Nobumichi Tamura, Karthic Narayanan Rengarajan, A S BudimanAbstract:Abstract There has been a strong commercial push towards thinner silicon in the solar photovoltaic (PV) technologies due to the Significant Cost Reduction associated with it. However, in current products made from crystalline solar cell technologies, normal in-plane tensile stress resulting in fracture of silicon cells are observed. To further understand this phenomenon, the synchrotron X-ray micro-diffraction tool was used to perform stress measurements and mapping of the solar cells in the vicinity of the most typically observed crack initiation location, the solder joint. This technique is unique as it has the capabilities to quantitatively determine the stresses and map these stresses with a micron resolution, all while the silicon cells are in encapsulation. A fundamental understanding of the stress magnitudes as well as microstructural characteristics that could lead to crack initiation and propagation could be obtained with this technique. This also confirms that the control of mechanical stress is the key to enable thin silicon solar cell technologies in the coming years.
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enabling thin silicon technologies for next generation c si solar pv renewable energy systems using synchrotron x ray microdiffraction as stress and crack mechanism probe
Solar Energy Materials and Solar Cells, 2014Co-Authors: A S Budiman, Vincent Handara, Gregoria Illya, Martin Kunz, Nobumichi Tamura, W A Caldwell, C Bonelli, D VerstraetenAbstract:Abstract Recently, there has been a strong commercial push toward thinner silicon in the solar photovoltaic (PV) technologies due to the Significant Cost Reduction associated with it. Tensile stress (normal, in-plane) and fracture of the silicon cells are increasingly observed and reported for products of crystalline solar cell technologies. In an effort to shed light on these topics, stress measurements and mapping of the solar cells in the vicinity of the most typically observed crack initiation locations using synchrotron X-ray microdiffraction technique was conducted and are reported in this paper. The technique is unique as it has the capabilities to quantitatively determine stresses in silicon and to map these stresses with a micron resolution, all while the silicon cells are already encapsulated. With this technique, we aim to gain fundamental understanding of the stress magnitudes as well as characteristics that could lead to crack initiation and propagation. We have thus far found evidences of both extrinsic (device related) as well as intrinsic (crystallographic) nature of silicon cracking, which further confirm that the control of mechanical stress is the key to enable thin silicon solar cell technologies in the coming years. This study represents an ongoing high impact technology research that addresses real and important fundamental materials issue facing the crystalline silicon solar PV industry and contributes directly to the industry drive to reduce Cost of PV systems to grid parity.
Gregoria Illya - One of the best experts on this subject based on the ideXlab platform.
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probing stress and fracture mechanism in encapsulated thin silicon solar cells by synchrotron x ray microdiffraction
Solar Energy Materials and Solar Cells, 2017Co-Authors: Vincent Handara, Ihor Radchenko, Sasi Kumar Tippabhotla, Karthic R Narayanan, Gregoria Illya, Martin Kunz, Nobumichi Tamura, A S BudimanAbstract:Author(s): Handara, VA; Radchenko, I; Tippabhotla, SK; Narayanan, K; Illya, G; Kunz, M; Tamura, N; Budiman, AS | Abstract: © 2016 Elsevier B.V. Thin (l150 µm) silicon solar cell technology is attractive due to the Significant Cost Reduction associated with it. Consequently, fracture mechanisms in the thin silicon solar cells during soldering and lamination need to be fully understood quantitatively in order to enable photovoltaics (PV) systems implementation in both manufacturing and field operations. Synchrotron X-ray Microdiffraction (µSXRD) has proven to be a very effective means to quantitatively probe the mechanical stress which is the driving force of the fracture mechanisms (initiation, propagation, and propensity) in the thin silicon solar cells, especially when they are already encapsulated. In this article, we present the first ever stress examination in encapsulated thin silicon solar cells and show how nominally the same silicon solar cells encapsulated by different polymer encapsulants could have very different residual stresses after the lamination process. It is then not difficult to see how the earlier observation, as reported by Sander et al. (2013) [1], of very different fracture rates within the same silicon solar cells encapsulated by different Ethylene Vinyl Acetate (EVA) materials could come about. The complete second degree tensor components of the residual stress of the silicon solar cells after lamination process are also reported in this paper signifying the full and unique capabilities of the Synchrotron X-Ray Microdiffraction technique not only for measuring residual stress but also for measuring other potential mechanical damage within thin silicon solar cells.
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synchrotron x ray micro diffraction probing stress state in encapsulated thin silicon solar cells
Procedia Engineering, 2016Co-Authors: Sasi Kumar Tippabhotla, Vincent Handara, Ihor Radchenko, Gregoria Illya, Martin Kunz, Nobumichi Tamura, Karthic Narayanan Rengarajan, A S BudimanAbstract:Abstract There has been a strong commercial push towards thinner silicon in the solar photovoltaic (PV) technologies due to the Significant Cost Reduction associated with it. However, in current products made from crystalline solar cell technologies, normal in-plane tensile stress resulting in fracture of silicon cells are observed. To further understand this phenomenon, the synchrotron X-ray micro-diffraction tool was used to perform stress measurements and mapping of the solar cells in the vicinity of the most typically observed crack initiation location, the solder joint. This technique is unique as it has the capabilities to quantitatively determine the stresses and map these stresses with a micron resolution, all while the silicon cells are in encapsulation. A fundamental understanding of the stress magnitudes as well as microstructural characteristics that could lead to crack initiation and propagation could be obtained with this technique. This also confirms that the control of mechanical stress is the key to enable thin silicon solar cell technologies in the coming years.
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enabling thin silicon technologies for next generation c si solar pv renewable energy systems using synchrotron x ray microdiffraction as stress and crack mechanism probe
Solar Energy Materials and Solar Cells, 2014Co-Authors: A S Budiman, Vincent Handara, Gregoria Illya, Martin Kunz, Nobumichi Tamura, W A Caldwell, C Bonelli, D VerstraetenAbstract:Abstract Recently, there has been a strong commercial push toward thinner silicon in the solar photovoltaic (PV) technologies due to the Significant Cost Reduction associated with it. Tensile stress (normal, in-plane) and fracture of the silicon cells are increasingly observed and reported for products of crystalline solar cell technologies. In an effort to shed light on these topics, stress measurements and mapping of the solar cells in the vicinity of the most typically observed crack initiation locations using synchrotron X-ray microdiffraction technique was conducted and are reported in this paper. The technique is unique as it has the capabilities to quantitatively determine stresses in silicon and to map these stresses with a micron resolution, all while the silicon cells are already encapsulated. With this technique, we aim to gain fundamental understanding of the stress magnitudes as well as characteristics that could lead to crack initiation and propagation. We have thus far found evidences of both extrinsic (device related) as well as intrinsic (crystallographic) nature of silicon cracking, which further confirm that the control of mechanical stress is the key to enable thin silicon solar cell technologies in the coming years. This study represents an ongoing high impact technology research that addresses real and important fundamental materials issue facing the crystalline silicon solar PV industry and contributes directly to the industry drive to reduce Cost of PV systems to grid parity.
Nobumichi Tamura - One of the best experts on this subject based on the ideXlab platform.
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probing stress and fracture mechanism in encapsulated thin silicon solar cells by synchrotron x ray microdiffraction
Solar Energy Materials and Solar Cells, 2017Co-Authors: Vincent Handara, Ihor Radchenko, Sasi Kumar Tippabhotla, Karthic R Narayanan, Gregoria Illya, Martin Kunz, Nobumichi Tamura, A S BudimanAbstract:Author(s): Handara, VA; Radchenko, I; Tippabhotla, SK; Narayanan, K; Illya, G; Kunz, M; Tamura, N; Budiman, AS | Abstract: © 2016 Elsevier B.V. Thin (l150 µm) silicon solar cell technology is attractive due to the Significant Cost Reduction associated with it. Consequently, fracture mechanisms in the thin silicon solar cells during soldering and lamination need to be fully understood quantitatively in order to enable photovoltaics (PV) systems implementation in both manufacturing and field operations. Synchrotron X-ray Microdiffraction (µSXRD) has proven to be a very effective means to quantitatively probe the mechanical stress which is the driving force of the fracture mechanisms (initiation, propagation, and propensity) in the thin silicon solar cells, especially when they are already encapsulated. In this article, we present the first ever stress examination in encapsulated thin silicon solar cells and show how nominally the same silicon solar cells encapsulated by different polymer encapsulants could have very different residual stresses after the lamination process. It is then not difficult to see how the earlier observation, as reported by Sander et al. (2013) [1], of very different fracture rates within the same silicon solar cells encapsulated by different Ethylene Vinyl Acetate (EVA) materials could come about. The complete second degree tensor components of the residual stress of the silicon solar cells after lamination process are also reported in this paper signifying the full and unique capabilities of the Synchrotron X-Ray Microdiffraction technique not only for measuring residual stress but also for measuring other potential mechanical damage within thin silicon solar cells.
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synchrotron x ray micro diffraction probing stress state in encapsulated thin silicon solar cells
Procedia Engineering, 2016Co-Authors: Sasi Kumar Tippabhotla, Vincent Handara, Ihor Radchenko, Gregoria Illya, Martin Kunz, Nobumichi Tamura, Karthic Narayanan Rengarajan, A S BudimanAbstract:Abstract There has been a strong commercial push towards thinner silicon in the solar photovoltaic (PV) technologies due to the Significant Cost Reduction associated with it. However, in current products made from crystalline solar cell technologies, normal in-plane tensile stress resulting in fracture of silicon cells are observed. To further understand this phenomenon, the synchrotron X-ray micro-diffraction tool was used to perform stress measurements and mapping of the solar cells in the vicinity of the most typically observed crack initiation location, the solder joint. This technique is unique as it has the capabilities to quantitatively determine the stresses and map these stresses with a micron resolution, all while the silicon cells are in encapsulation. A fundamental understanding of the stress magnitudes as well as microstructural characteristics that could lead to crack initiation and propagation could be obtained with this technique. This also confirms that the control of mechanical stress is the key to enable thin silicon solar cell technologies in the coming years.
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enabling thin silicon technologies for next generation c si solar pv renewable energy systems using synchrotron x ray microdiffraction as stress and crack mechanism probe
Solar Energy Materials and Solar Cells, 2014Co-Authors: A S Budiman, Vincent Handara, Gregoria Illya, Martin Kunz, Nobumichi Tamura, W A Caldwell, C Bonelli, D VerstraetenAbstract:Abstract Recently, there has been a strong commercial push toward thinner silicon in the solar photovoltaic (PV) technologies due to the Significant Cost Reduction associated with it. Tensile stress (normal, in-plane) and fracture of the silicon cells are increasingly observed and reported for products of crystalline solar cell technologies. In an effort to shed light on these topics, stress measurements and mapping of the solar cells in the vicinity of the most typically observed crack initiation locations using synchrotron X-ray microdiffraction technique was conducted and are reported in this paper. The technique is unique as it has the capabilities to quantitatively determine stresses in silicon and to map these stresses with a micron resolution, all while the silicon cells are already encapsulated. With this technique, we aim to gain fundamental understanding of the stress magnitudes as well as characteristics that could lead to crack initiation and propagation. We have thus far found evidences of both extrinsic (device related) as well as intrinsic (crystallographic) nature of silicon cracking, which further confirm that the control of mechanical stress is the key to enable thin silicon solar cell technologies in the coming years. This study represents an ongoing high impact technology research that addresses real and important fundamental materials issue facing the crystalline silicon solar PV industry and contributes directly to the industry drive to reduce Cost of PV systems to grid parity.
Martin Kunz - One of the best experts on this subject based on the ideXlab platform.
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probing stress and fracture mechanism in encapsulated thin silicon solar cells by synchrotron x ray microdiffraction
Solar Energy Materials and Solar Cells, 2017Co-Authors: Vincent Handara, Ihor Radchenko, Sasi Kumar Tippabhotla, Karthic R Narayanan, Gregoria Illya, Martin Kunz, Nobumichi Tamura, A S BudimanAbstract:Author(s): Handara, VA; Radchenko, I; Tippabhotla, SK; Narayanan, K; Illya, G; Kunz, M; Tamura, N; Budiman, AS | Abstract: © 2016 Elsevier B.V. Thin (l150 µm) silicon solar cell technology is attractive due to the Significant Cost Reduction associated with it. Consequently, fracture mechanisms in the thin silicon solar cells during soldering and lamination need to be fully understood quantitatively in order to enable photovoltaics (PV) systems implementation in both manufacturing and field operations. Synchrotron X-ray Microdiffraction (µSXRD) has proven to be a very effective means to quantitatively probe the mechanical stress which is the driving force of the fracture mechanisms (initiation, propagation, and propensity) in the thin silicon solar cells, especially when they are already encapsulated. In this article, we present the first ever stress examination in encapsulated thin silicon solar cells and show how nominally the same silicon solar cells encapsulated by different polymer encapsulants could have very different residual stresses after the lamination process. It is then not difficult to see how the earlier observation, as reported by Sander et al. (2013) [1], of very different fracture rates within the same silicon solar cells encapsulated by different Ethylene Vinyl Acetate (EVA) materials could come about. The complete second degree tensor components of the residual stress of the silicon solar cells after lamination process are also reported in this paper signifying the full and unique capabilities of the Synchrotron X-Ray Microdiffraction technique not only for measuring residual stress but also for measuring other potential mechanical damage within thin silicon solar cells.
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synchrotron x ray micro diffraction probing stress state in encapsulated thin silicon solar cells
Procedia Engineering, 2016Co-Authors: Sasi Kumar Tippabhotla, Vincent Handara, Ihor Radchenko, Gregoria Illya, Martin Kunz, Nobumichi Tamura, Karthic Narayanan Rengarajan, A S BudimanAbstract:Abstract There has been a strong commercial push towards thinner silicon in the solar photovoltaic (PV) technologies due to the Significant Cost Reduction associated with it. However, in current products made from crystalline solar cell technologies, normal in-plane tensile stress resulting in fracture of silicon cells are observed. To further understand this phenomenon, the synchrotron X-ray micro-diffraction tool was used to perform stress measurements and mapping of the solar cells in the vicinity of the most typically observed crack initiation location, the solder joint. This technique is unique as it has the capabilities to quantitatively determine the stresses and map these stresses with a micron resolution, all while the silicon cells are in encapsulation. A fundamental understanding of the stress magnitudes as well as microstructural characteristics that could lead to crack initiation and propagation could be obtained with this technique. This also confirms that the control of mechanical stress is the key to enable thin silicon solar cell technologies in the coming years.
-
enabling thin silicon technologies for next generation c si solar pv renewable energy systems using synchrotron x ray microdiffraction as stress and crack mechanism probe
Solar Energy Materials and Solar Cells, 2014Co-Authors: A S Budiman, Vincent Handara, Gregoria Illya, Martin Kunz, Nobumichi Tamura, W A Caldwell, C Bonelli, D VerstraetenAbstract:Abstract Recently, there has been a strong commercial push toward thinner silicon in the solar photovoltaic (PV) technologies due to the Significant Cost Reduction associated with it. Tensile stress (normal, in-plane) and fracture of the silicon cells are increasingly observed and reported for products of crystalline solar cell technologies. In an effort to shed light on these topics, stress measurements and mapping of the solar cells in the vicinity of the most typically observed crack initiation locations using synchrotron X-ray microdiffraction technique was conducted and are reported in this paper. The technique is unique as it has the capabilities to quantitatively determine stresses in silicon and to map these stresses with a micron resolution, all while the silicon cells are already encapsulated. With this technique, we aim to gain fundamental understanding of the stress magnitudes as well as characteristics that could lead to crack initiation and propagation. We have thus far found evidences of both extrinsic (device related) as well as intrinsic (crystallographic) nature of silicon cracking, which further confirm that the control of mechanical stress is the key to enable thin silicon solar cell technologies in the coming years. This study represents an ongoing high impact technology research that addresses real and important fundamental materials issue facing the crystalline silicon solar PV industry and contributes directly to the industry drive to reduce Cost of PV systems to grid parity.