The Experts below are selected from a list of 45 Experts worldwide ranked by ideXlab platform

Ricky T. Tjeung - One of the best experts on this subject based on the ideXlab platform.

  • Thermally activated solvent bonding of Polymers
    Microsystem Technologies, 2008
    Co-Authors: S. H. Ng, Ricky T. Tjeung, A. C. W. Lu, Z.f. Wang, I Rodriguez, N. F. Rooij
    Abstract:

    We present a thermally activated solvent bonding technique for the formation of embedded microstructures in Polymer. It is based on the temperature dependent Solubility of Polymer in a liquid that is not a solvent at room temperature. With thermal activation, the liquid is transformed into a solvent of the Polymer, creating a bonding capability through segmental or chain interdiffusion at the bonding interface. The technique has advantages over the more commonly used thermal bonding due to its much lower operation temperature (30°C lower than the material’s T _g), lower load, as well as shorter time. Lap shear test indicated bonding shear strength of up to 2.9 MPa. Leak test based on the bubble emission technique showed that the bonded microfluidic device can withstand at least six bars (87 psi) of internal pressure (gauge) in the microchannel. This technique can be applied to other systems of Polymer and solvent.

  • FORMATION of EMBEDDED MICROSTRUCTURES BY THERMAL ACTIVATED SOLVENT BONDING
    2007
    Co-Authors: Ricky T. Tjeung, Z.f. Wang, I Rodriguez, N. De Rooij
    Abstract:

    We present a thermal activated solvent bonding technique for the formation of embedded microstrucutres in Polymer. It is based on the temperature dependent Solubility of Polymer in a liquid that is not a solvent at room temperature. With thermal activation, the liquid is transformed into a solvent of the Polymer, creating a bonding capability through segmental or chain interdiffusion at the bonding interface. The technique has advantages over the more commonly used thermal bonding due to its much lower operation temperature (30 °C lower than the material's Tg), lower load, as well as shorter time. Lap shear test indicated bonding shear strength of up to 2.9 MPa. Leak test based on the bubble emission technique showed that the bonded microfluidic device can withstand at least 6 bars (87 psi) of internal pressure (gauge) in the microchannel. This technique can be applied to other systems of Polymer and solvent.

Yinlin Song - One of the best experts on this subject based on the ideXlab platform.

  • synthesis and optical properties of poly 2 n methyl n 4 4 ethynylphenylazo phenyl amino ethyl butyrate
    Macromolecular Chemistry and Physics, 2005
    Co-Authors: Shouchun Yin, Min Fang, Wenfang Shi, Yachen Gao, Yinlin Song
    Abstract:

    The high-molecular-weight functional polyacetylene that contain a para-aminoazobenzene chromophore, poly[2- {N-Methyl-N-(4-(4-ethynylphenylazo)phenyl)amino}ethyl butyrate] [poly(EAPAB)], was synthesized in moderate yield and characterized by FT-IR, H NMR, UV-vis, TGA, and GPC. The nonlinear optical and optical limiting properties were performed with 8 ns pulse width at 532 nm wavelength. The results show that the introduction of the flexible amino group effectively improved the Solubility of Polymer [poly(EAPAB)] in common organic solvent, such as CHCl 3 , THF, and dioxane, while poly(4-ethynylazobenzene) [poly(4EAB)] without the flexible amino group shows poor Solubility in common organic solvent. Simultaneously, poly(EAPAB) still shows good thermal stability, large thirdorder nonlinear optical property, and novel optical limiting property owing to the functionalization of the para-aminoazobenzene chromophore.

N. F. Rooij - One of the best experts on this subject based on the ideXlab platform.

  • Thermally activated solvent bonding of Polymers
    Microsystem Technologies, 2008
    Co-Authors: S. H. Ng, Ricky T. Tjeung, A. C. W. Lu, Z.f. Wang, I Rodriguez, N. F. Rooij
    Abstract:

    We present a thermally activated solvent bonding technique for the formation of embedded microstructures in Polymer. It is based on the temperature dependent Solubility of Polymer in a liquid that is not a solvent at room temperature. With thermal activation, the liquid is transformed into a solvent of the Polymer, creating a bonding capability through segmental or chain interdiffusion at the bonding interface. The technique has advantages over the more commonly used thermal bonding due to its much lower operation temperature (30°C lower than the material’s T _g), lower load, as well as shorter time. Lap shear test indicated bonding shear strength of up to 2.9 MPa. Leak test based on the bubble emission technique showed that the bonded microfluidic device can withstand at least six bars (87 psi) of internal pressure (gauge) in the microchannel. This technique can be applied to other systems of Polymer and solvent.

Z.f. Wang - One of the best experts on this subject based on the ideXlab platform.

  • Thermally activated solvent bonding of Polymers
    Microsystem Technologies, 2008
    Co-Authors: S. H. Ng, Ricky T. Tjeung, A. C. W. Lu, Z.f. Wang, I Rodriguez, N. F. Rooij
    Abstract:

    We present a thermally activated solvent bonding technique for the formation of embedded microstructures in Polymer. It is based on the temperature dependent Solubility of Polymer in a liquid that is not a solvent at room temperature. With thermal activation, the liquid is transformed into a solvent of the Polymer, creating a bonding capability through segmental or chain interdiffusion at the bonding interface. The technique has advantages over the more commonly used thermal bonding due to its much lower operation temperature (30°C lower than the material’s T _g), lower load, as well as shorter time. Lap shear test indicated bonding shear strength of up to 2.9 MPa. Leak test based on the bubble emission technique showed that the bonded microfluidic device can withstand at least six bars (87 psi) of internal pressure (gauge) in the microchannel. This technique can be applied to other systems of Polymer and solvent.

  • FORMATION of EMBEDDED MICROSTRUCTURES BY THERMAL ACTIVATED SOLVENT BONDING
    2007
    Co-Authors: Ricky T. Tjeung, Z.f. Wang, I Rodriguez, N. De Rooij
    Abstract:

    We present a thermal activated solvent bonding technique for the formation of embedded microstrucutres in Polymer. It is based on the temperature dependent Solubility of Polymer in a liquid that is not a solvent at room temperature. With thermal activation, the liquid is transformed into a solvent of the Polymer, creating a bonding capability through segmental or chain interdiffusion at the bonding interface. The technique has advantages over the more commonly used thermal bonding due to its much lower operation temperature (30 °C lower than the material's Tg), lower load, as well as shorter time. Lap shear test indicated bonding shear strength of up to 2.9 MPa. Leak test based on the bubble emission technique showed that the bonded microfluidic device can withstand at least 6 bars (87 psi) of internal pressure (gauge) in the microchannel. This technique can be applied to other systems of Polymer and solvent.

I Rodriguez - One of the best experts on this subject based on the ideXlab platform.

  • Thermally activated solvent bonding of Polymers
    Microsystem Technologies, 2008
    Co-Authors: S. H. Ng, Ricky T. Tjeung, A. C. W. Lu, Z.f. Wang, I Rodriguez, N. F. Rooij
    Abstract:

    We present a thermally activated solvent bonding technique for the formation of embedded microstructures in Polymer. It is based on the temperature dependent Solubility of Polymer in a liquid that is not a solvent at room temperature. With thermal activation, the liquid is transformed into a solvent of the Polymer, creating a bonding capability through segmental or chain interdiffusion at the bonding interface. The technique has advantages over the more commonly used thermal bonding due to its much lower operation temperature (30°C lower than the material’s T _g), lower load, as well as shorter time. Lap shear test indicated bonding shear strength of up to 2.9 MPa. Leak test based on the bubble emission technique showed that the bonded microfluidic device can withstand at least six bars (87 psi) of internal pressure (gauge) in the microchannel. This technique can be applied to other systems of Polymer and solvent.

  • FORMATION of EMBEDDED MICROSTRUCTURES BY THERMAL ACTIVATED SOLVENT BONDING
    2007
    Co-Authors: Ricky T. Tjeung, Z.f. Wang, I Rodriguez, N. De Rooij
    Abstract:

    We present a thermal activated solvent bonding technique for the formation of embedded microstrucutres in Polymer. It is based on the temperature dependent Solubility of Polymer in a liquid that is not a solvent at room temperature. With thermal activation, the liquid is transformed into a solvent of the Polymer, creating a bonding capability through segmental or chain interdiffusion at the bonding interface. The technique has advantages over the more commonly used thermal bonding due to its much lower operation temperature (30 °C lower than the material's Tg), lower load, as well as shorter time. Lap shear test indicated bonding shear strength of up to 2.9 MPa. Leak test based on the bubble emission technique showed that the bonded microfluidic device can withstand at least 6 bars (87 psi) of internal pressure (gauge) in the microchannel. This technique can be applied to other systems of Polymer and solvent.