Strong Adhesion

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M Jamesh - One of the best experts on this subject based on the ideXlab platform.

D R Mckenzie - One of the best experts on this subject based on the ideXlab platform.

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  • printed highly conductive cu films with Strong Adhesion enabled by low energy photonic sintering on low tg flexible plastic substrate
    Nanotechnology, 2017
    Co-Authors: Shuangshuang Shao, Zheng Chen, Zheng Cui
    Abstract:

    Copper (Cu) films and circuits were fabricated by screen-printing Cu nanoink on low-Tg (glass transition temperature) flexible plastic substrates (PEN and PET) instead of widely used high-Tg polyimide (PI) substrate. Photonic sintering of printed Cu films was carried out using intensive pulsed light (IPL). Low resistivities of 28 μΩ cm on PEN and 44 μΩ cm on PET were obtained without damaging the substrates. The sintered Cu films exhibited Strong Adhesion to PEN and PET substrates, with measured Adhesion strength of 5B by the ASTM D3359 international standard, whereas the top part of the copper film on the PI substrate was stripped off during the Adhesion test. The sintered Cu films also showed excellent stability in harsh conditions and mechanical flexibility in rolling tests. The underlying mechanisms of the high conductivity and Strong Adhesion on PEN and PET substrates with low-energy IPL sintering were investigated. Simple circuits and radio frequency identification antennas were made by screen-printing Cu nanoink and IPL sintering, demonstrating the technique's feasibility for practical applications.

  • printed highly conductive cu films with Strong Adhesion enabled by low energy photonic sintering on low tg flexible plastic substrate
    Nanotechnology, 2017
    Co-Authors: Xinzhou Wu, Shuangshuang Shao, Zheng Chen
    Abstract:

    Copper (Cu) films and circuits were fabricated by screen-printing Cu nanoink on low-Tg (glass transition temperature) flexible plastic substrates (PEN and PET) instead of widely used high-Tg polyimide (PI) substrate. Photonic sintering of printed Cu films was carried out using intensive pulsed light (IPL). Low resistivities of 28 μΩ cm on PEN and 44 μΩ cm on PET were obtained without damaging the substrates. The sintered Cu films exhibited Strong Adhesion to PEN and PET substrates, with measured Adhesion strength of 5B by the ASTM D3359 international standard, whereas the top part of the copper film on the PI substrate was stripped off during the Adhesion test. The sintered Cu films also showed excellent stability in harsh conditions and mechanical flexibility in rolling tests. The underlying mechanisms of the high conductivity and Strong Adhesion on PEN and PET substrates with low-energy IPL sintering were investigated. Simple circuits and radio frequency identification antennas were made by screen-printing Cu nanoink and IPL sintering, demonstrating the technique's feasibility for practical applications.