The Experts below are selected from a list of 154632 Experts worldwide ranked by ideXlab platform
Leena Ukkonen - One of the best experts on this subject based on the ideXlab platform.
-
Embroidered passive UHF RFID tag on flexible 3D printed Substrate
2017 Progress in Electromagnetics Research Symposium - Fall (PIERS - FALL), 2017Co-Authors: Muhammad Rizwan, Jeremie Torres, Maxime Guibert, Alexandre Massicart, Lauri Sydänheimo, Leena Ukkonen, Toni Bjorninen, Johanna VirkkiAbstract:3D printing, the latest additive manufacturing technique, has the advantage of printing complex 3D structures using layer-by-layer deposition of versatile Materials. The electrical and mechanical properties of these 3D printed Materials can be customized depending on the printing specifications, like infill percentage, in-fill pattern, and thickness. Especially flexible 3D printed Material, NinjaFlex, is a highly potential Substrate Material for wearable passive ultra-high frequency (UHF) radio-frequency identification (RFID) tags. This paper presents the fabrication and wireless evaluation of embroidered passive UHF RFID tags on a 3D printed (NinjaFlex) Substrate. The paper outlines the details of the 3D printing of the Substrate, the characterization of the Substrate Material at the UHF band, the embroidery process using conductive yarn, and the wireless measurement results of the fabricated tags. Measurement results show that the manufactured tags achieve peak read ranges of 6 meters. To the best of our knowledge, this is the first demonstration of embroidery on 3D printed flexible Substrate. The stability of the results show that this hybrid fabrication methodology offers an easy, quick, and cost-effective approach for manufacturing RFID tags for future wearable identification and sensing applications.
-
passive uhf rfid tag for heat sensing applications
IEEE Transactions on Antennas and Propagation, 2012Co-Authors: A A Babar, Lauri Sydänheimo, S Manzari, Atef Z Elsherbeni, Leena UkkonenAbstract:A possible method of utilizing paraffin wax as a Substrate Material in developing a threshold heat sensing radio frequency identification (RFID) tag is discussed. A small narrowband passive UHF RFID tag is made on top of a multilayer Substrate. Paraffin wax acts as the main heat sensitive layer of the Substrate. The properties and characteristics of the paraffin layer change due to heat. The narrowband tag on top of the Substrate is designed to be sensitive enough to detect any structural and physical changes of the Substrate Material. The changes in the properties of the Substrate Material will cause a shift in the operating frequency of the tag. This frequency shift will reduce the performance of the narrowband RFID sensor tag. The change in the properties of paraffin wax after being exposed to heat is irreversible under normal conditions and therefore, the proposed RFID tag can be referred to as a threshold heat sensing device. Such a low-cost solution can be useful in detecting heat exposures in various supply chains and transportation mishandling of heat sensitive items.
A C Taylor - One of the best experts on this subject based on the ideXlab platform.
-
the effect of Substrate Material properties on the failure behaviour of coatings in the erichsen cupping test
Progress in Organic Coatings, 2021Co-Authors: Zhao Cheong, Fabian S Sorce, Sonny Ngo, Chris Lowe, A C TaylorAbstract:Abstract Pre-painted sheet metal produced by coil coating is subjected to large deformations during manufacture of white goods and architectural cladding. The thermosetting polyester coatings must resist failure by cracking, and their formability can be assessed qualitatively using the industry-standard Erichsen cupping test. However, this only provides strains much smaller than the coatings can withstand, and hence does not discriminate between coating behaviour. Finite element (FE) modelling has been used to show that the applied strain governs the failure of coil coatings during forming, and to demonstrate how increased surface strains can be achieved by altering key parameters to make the Erichsen cupping test discriminating and quantitative. The surface strains are increased by increasing the coefficient of friction between the indenter and the Substrate, and by increasing the thickness of the Substrate. A parametric study on Substrate properties showed that a smaller strain hardening exponent (i.e. more plastic behaviour) gave higher surface strains. There was no variation in the surface strains over a temperature range of -60 °C to 60 °C. Understanding how the test conditions and Substrate properties influence the surface strains improves the efficacy of the Erichsen cupping test. The surface strains applied to a coating can be varied by changing the Substrate properties, which allows for greater differentiation between coatings and for the coating failure strains to be determined quantitatively. This provides a data-driven approach to develop and formulate better coatings using a single, efficient and easy test.
-
The effect of Substrate Material properties on the failure behaviour of coatings in the Erichsen cupping test
'Elsevier BV', 2021Co-Authors: Cheong Z, Fabian S Sorce, Ngo S, Lowe C, A C TaylorAbstract:© 2020 Elsevier B.V. Pre-painted sheet metal produced by coil coating is subjected to large deformations during manufacture of white goods and architectural cladding. The thermosetting polyester coatings must resist failure by cracking, and their formability can be assessed qualitatively using the industry-standard Erichsen cupping test. However, this only provides strains much smaller than the coatings can withstand, and hence does not discriminate between coating behaviour. Finite element (FE) modelling has been used to show that the applied strain governs the failure of coil coatings during forming, and to demonstrate how increased surface strains can be achieved by altering key parameters to make the Erichsen cupping test discriminating and quantitative. The surface strains are increased by increasing the coefficient of friction between the indenter and the Substrate, and by increasing the thickness of the Substrate. A parametric study on Substrate properties showed that a smaller strain hardening exponent (i.e. more plastic behaviour) gave higher surface strains. There was no variation in the surface strains over a temperature range of -60 °C to 60 °C. Understanding how the test conditions and Substrate properties influence the surface strains improves the efficacy of the Erichsen cupping test. The surface strains applied to a coating can be varied by changing the Substrate properties, which allows for greater differentiation between coatings and for the coating failure strains to be determined quantitatively. This provides a data-driven approach to develop and formulate better coatings using a single, efficient and easy test
A A Babar - One of the best experts on this subject based on the ideXlab platform.
-
passive uhf rfid tag for heat sensing applications
IEEE Transactions on Antennas and Propagation, 2012Co-Authors: A A Babar, Lauri Sydänheimo, S Manzari, Atef Z Elsherbeni, Leena UkkonenAbstract:A possible method of utilizing paraffin wax as a Substrate Material in developing a threshold heat sensing radio frequency identification (RFID) tag is discussed. A small narrowband passive UHF RFID tag is made on top of a multilayer Substrate. Paraffin wax acts as the main heat sensitive layer of the Substrate. The properties and characteristics of the paraffin layer change due to heat. The narrowband tag on top of the Substrate is designed to be sensitive enough to detect any structural and physical changes of the Substrate Material. The changes in the properties of the Substrate Material will cause a shift in the operating frequency of the tag. This frequency shift will reduce the performance of the narrowband RFID sensor tag. The change in the properties of paraffin wax after being exposed to heat is irreversible under normal conditions and therefore, the proposed RFID tag can be referred to as a threshold heat sensing device. Such a low-cost solution can be useful in detecting heat exposures in various supply chains and transportation mishandling of heat sensitive items.
Zhao Cheong - One of the best experts on this subject based on the ideXlab platform.
-
the effect of Substrate Material properties on the failure behaviour of coatings in the erichsen cupping test
Progress in Organic Coatings, 2021Co-Authors: Zhao Cheong, Fabian S Sorce, Sonny Ngo, Chris Lowe, A C TaylorAbstract:Abstract Pre-painted sheet metal produced by coil coating is subjected to large deformations during manufacture of white goods and architectural cladding. The thermosetting polyester coatings must resist failure by cracking, and their formability can be assessed qualitatively using the industry-standard Erichsen cupping test. However, this only provides strains much smaller than the coatings can withstand, and hence does not discriminate between coating behaviour. Finite element (FE) modelling has been used to show that the applied strain governs the failure of coil coatings during forming, and to demonstrate how increased surface strains can be achieved by altering key parameters to make the Erichsen cupping test discriminating and quantitative. The surface strains are increased by increasing the coefficient of friction between the indenter and the Substrate, and by increasing the thickness of the Substrate. A parametric study on Substrate properties showed that a smaller strain hardening exponent (i.e. more plastic behaviour) gave higher surface strains. There was no variation in the surface strains over a temperature range of -60 °C to 60 °C. Understanding how the test conditions and Substrate properties influence the surface strains improves the efficacy of the Erichsen cupping test. The surface strains applied to a coating can be varied by changing the Substrate properties, which allows for greater differentiation between coatings and for the coating failure strains to be determined quantitatively. This provides a data-driven approach to develop and formulate better coatings using a single, efficient and easy test.
E. Pfender - One of the best experts on this subject based on the ideXlab platform.
-
process study of thermal plasma chemical vapor deposition of diamond part i Substrate Material temperature and methane concentration
Plasma Chemistry and Plasma Processing, 1992Co-Authors: J Heberlein, E. PfenderAbstract:Effects of process parameters on diamond film synthesis in DC thermal plasma jet reactors are discussed including Substrate Material, methane concentration and Substrate temperature. Diamond has been deposited on silicon, molybdenum, tungsten, tantalum, copper, nickel, titanium, and stainless steel. The adhesion of diamond film to the Substrate is greatly affected by the type of Substrate used. It has been found that the methane concentration strongly affects the grain size of the diamond films. Increased methane concentrations result in smaller grain sizes due to the increased number of secondary nucleations on the existing facets of diamond crystals. Substrate temperature has a strong effect on the morphology of diamond films. With increasing Substrate temperature, the predominant orientation of the crystal growth planes changes from the (111) to the (100) planes. Studies of the variation of the film quality across the Substrate due to the nonuniformity of thermal plasma jets indicate that microcrystalline graphite formation starts at the corners and edges of diamond crystals when the conditions become unfavorable for diamond deposition.
