Thermal Processing

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Jeyamkondan Subbiah - One of the best experts on this subject based on the ideXlab platform.

  • Continuous Radiofrequency-Assisted Thermal Processing of Packaged Soft Wheat Flour
    Current Journal of Applied Science and Technology, 2020
    Co-Authors: Sreenivasula Reddy Boreddy, Jeyamkondan Subbiah
    Abstract:

    Soft wheat flour (SWF) is a low-moisture food ingredient in many ready-to-eat foods. Foodborne illnesses and outbreaks from consumption of multiple low-moisture foods heightened the importance of its microbiological safety. Traditional Thermal Processing methods take a long time to achieve desired pasteurization and are not suitable for Processing the packaged products. The novel continuous radiofrequency (RF)-assisted Thermal Processing for packaged SWF was investigated with an objective of reducing the Processing time. The temperature profiles in packaged SWF during RF heating at eight different locations under the stationary and moving conditions were investigated. The temperature difference between the coldest and the hottest locations in stationary RF heating of packaged SWF was 31°C. When the package was flipped up-side down along the long axis in stationary condition, the temperature difference was reduced to 24°C. The RF heating uniformity of packaged SWF with the conveyor movement improved and the temperature difference between the hottest and the coldest locations under this condition was only 15°C. The quality parameters of packaged SWF at 80°C for 7 h were not significantly different from that of the unpasteurized and batch mode processed SWF. This study demonstrated the continuous RF-assisted Thermal Processing of packaged SWF.

  • Radiofrequency-Assisted Thermal Processing of Soft Wheat Flour.
    Journal of food science, 2019
    Co-Authors: Sreenivasula Reddy Boreddy, Devin J. Rose, Jeyamkondan Subbiah
    Abstract:

    Wheat flour may be Thermally processed to improve microbiological safety; however, come-up time for Thermal Processing of wheat flour is long due to its low Thermal conductivity. In the present study, a novel radiofrequency (RF)-assisted Thermal Processing approach was investigated for reducing the come-up time of soft wheat flour (SWF) and for improving microbiological safety. The temperature and time combinations of 80 °C for 7 and 10 hr, 90 °C for 2 and 3 hr, and 100 °C for 0.75 and 1 hr for RF-assisted Thermal Processing were selected to achieve a minimum of a 7-log reduction in Salmonella spp. The quality and functional properties of RF-assisted Thermally processed SWF was evaluated by solvent retention capacity (SRC), swelling power, sodium dodecyl sulfate sedimentation tests, and rapid-visco-analyzer test, and the values were compared with the untreated (unpasteurized) and commercially pasteurized SWF. All the SRC attributes at 80 °C for 7 hr, 90 °C for 2 hr and 100 °C for 0.75 hr were not significantly different from that of the unpasteurized SWF. The optimum RF-assisted Thermal Processing conditions of 80 °C for 7 hr and 90 °C for 2 hr were recommended for pasteurization of SWF without any compromise in the quality and functionality. PRACTICAL APPLICATION: Thermal Processing of low-moisture foods such as flours and powders through traditional methods is not practical due to extremely long come-up times. Novel radiofrequency-assisted Thermal Processing is poised to reduce the Processing time 89 times for 100 °C. The Processing parameters determined in this study will enhance the microbiological safety of wheat flour without compromising the quality and functionality.

Paul Siffert - One of the best experts on this subject based on the ideXlab platform.

  • Towards high‐eficiency silicon solar cells by rapid Thermal Processing
    Progress in Photovoltaics, 1994
    Co-Authors: Bouchaib Hartiti, J.-c. Muller, R. Schindler, A. Slaoui, B. Wagner, I. Reis, A. Eyer, Paul Siffert
    Abstract:

    Rapid Thermal Processing can offer many advantages, such as small overall Thermal budget and low power and time consumption, in a strategy focused on cost-effective techniques for the preparation of solar cells in a continuous way. We show here that this very short duration (a few tens of seconds) of isoThermal heating performed in a lamp furnace can be used for many Thermal steps of silicon solar cell Processing. Rapid Thermal Processing was applied to form the p-n junction from a phosphorus-doped spin-on silica film deposted on (100) silicon substrates at typical Processing temperatures between 800 and 1100°C. the solar cells showed conversion efficiencies as good as those processed in a conventional way.

Sreenivasula Reddy Boreddy - One of the best experts on this subject based on the ideXlab platform.

  • Continuous Radiofrequency-Assisted Thermal Processing of Packaged Soft Wheat Flour
    Current Journal of Applied Science and Technology, 2020
    Co-Authors: Sreenivasula Reddy Boreddy, Jeyamkondan Subbiah
    Abstract:

    Soft wheat flour (SWF) is a low-moisture food ingredient in many ready-to-eat foods. Foodborne illnesses and outbreaks from consumption of multiple low-moisture foods heightened the importance of its microbiological safety. Traditional Thermal Processing methods take a long time to achieve desired pasteurization and are not suitable for Processing the packaged products. The novel continuous radiofrequency (RF)-assisted Thermal Processing for packaged SWF was investigated with an objective of reducing the Processing time. The temperature profiles in packaged SWF during RF heating at eight different locations under the stationary and moving conditions were investigated. The temperature difference between the coldest and the hottest locations in stationary RF heating of packaged SWF was 31°C. When the package was flipped up-side down along the long axis in stationary condition, the temperature difference was reduced to 24°C. The RF heating uniformity of packaged SWF with the conveyor movement improved and the temperature difference between the hottest and the coldest locations under this condition was only 15°C. The quality parameters of packaged SWF at 80°C for 7 h were not significantly different from that of the unpasteurized and batch mode processed SWF. This study demonstrated the continuous RF-assisted Thermal Processing of packaged SWF.

  • Radiofrequency-Assisted Thermal Processing of Soft Wheat Flour.
    Journal of food science, 2019
    Co-Authors: Sreenivasula Reddy Boreddy, Devin J. Rose, Jeyamkondan Subbiah
    Abstract:

    Wheat flour may be Thermally processed to improve microbiological safety; however, come-up time for Thermal Processing of wheat flour is long due to its low Thermal conductivity. In the present study, a novel radiofrequency (RF)-assisted Thermal Processing approach was investigated for reducing the come-up time of soft wheat flour (SWF) and for improving microbiological safety. The temperature and time combinations of 80 °C for 7 and 10 hr, 90 °C for 2 and 3 hr, and 100 °C for 0.75 and 1 hr for RF-assisted Thermal Processing were selected to achieve a minimum of a 7-log reduction in Salmonella spp. The quality and functional properties of RF-assisted Thermally processed SWF was evaluated by solvent retention capacity (SRC), swelling power, sodium dodecyl sulfate sedimentation tests, and rapid-visco-analyzer test, and the values were compared with the untreated (unpasteurized) and commercially pasteurized SWF. All the SRC attributes at 80 °C for 7 hr, 90 °C for 2 hr and 100 °C for 0.75 hr were not significantly different from that of the unpasteurized SWF. The optimum RF-assisted Thermal Processing conditions of 80 °C for 7 hr and 90 °C for 2 hr were recommended for pasteurization of SWF without any compromise in the quality and functionality. PRACTICAL APPLICATION: Thermal Processing of low-moisture foods such as flours and powders through traditional methods is not practical due to extremely long come-up times. Novel radiofrequency-assisted Thermal Processing is poised to reduce the Processing time 89 times for 100 °C. The Processing parameters determined in this study will enhance the microbiological safety of wheat flour without compromising the quality and functionality.

Bouchaib Hartiti - One of the best experts on this subject based on the ideXlab platform.

  • Towards high‐eficiency silicon solar cells by rapid Thermal Processing
    Progress in Photovoltaics, 1994
    Co-Authors: Bouchaib Hartiti, J.-c. Muller, R. Schindler, A. Slaoui, B. Wagner, I. Reis, A. Eyer, Paul Siffert
    Abstract:

    Rapid Thermal Processing can offer many advantages, such as small overall Thermal budget and low power and time consumption, in a strategy focused on cost-effective techniques for the preparation of solar cells in a continuous way. We show here that this very short duration (a few tens of seconds) of isoThermal heating performed in a lamp furnace can be used for many Thermal steps of silicon solar cell Processing. Rapid Thermal Processing was applied to form the p-n junction from a phosphorus-doped spin-on silica film deposted on (100) silicon substrates at typical Processing temperatures between 800 and 1100°C. the solar cells showed conversion efficiencies as good as those processed in a conventional way.

S. Narayanan - One of the best experts on this subject based on the ideXlab platform.

  • Rapid Thermal Processing of Screen Printed Ohmic Contacts
    Journal of The Electrochemical Society, 1997
    Co-Authors: D. Ratakonda, Rajendra Singh, L. Vedula, Ajeet Rohatgi, J. Mejia, S. Narayanan
    Abstract:

    Screen printed ohmic contacts are an integral part of a number of semiconductor devices including solar cells. In this paper, silver (Ag)/aluminum (Al) ohmic contacts to p-type silicon were screen printed and annealed by rapid Thermal Processing. Different lamp configurations, which provided a different photon spectrum on the surface of the metal film, were used to demonstrate the role of photoeffects in the formation of ohmic contacts by rapid Thermal Processing. The availability of large number of high energy photons on the metal surface resulted in lower Processing cycle time as well as improved electrical, structural, and mechanical properties of the metal contact.