The Experts below are selected from a list of 72 Experts worldwide ranked by ideXlab platform

Christine Kallmayer - One of the best experts on this subject based on the ideXlab platform.

  • electronics in textiles Adhesive bonding technology for reliably embedding electronic modules into textile circuits
    Advances in Science and Technology, 2012
    Co-Authors: Malte Von Krshiwoblozki, Torsten Linz, Andreas Neudeck, Christine Kallmayer
    Abstract:

    The interconnection of electronics and textile circuits is still a main challenge for the fabrication of reliable smart textiles. This paper investigates the Thermoplastic Adhesive bonding technology. Electronic modules are bonded to textile substrates with a Thermoplastic non-conductive Adhesive (NCA) film. The modules are placed onto textile circuits with an NCA-film in-between. By applying pressure and heat, the Adhesive melts and contact partners touch. Subsequently cooling solidifies the NCA resulting in an electrical and mechanical contact of the electronic module and the textile circuit. This paper shows the suitability of this technology for knitted, woven, non-woven and embroidered fabrics with metal coated yarns as well as with litz-wires as conductors. Besides, it shows that the interconnection process works well with Thermoplastically insulated conductors. In addition, the design of interposers has been improved in respect to contact formation and miniaturization compared to previous publications. The pitch of the contact pads is set to 1.27 mm. A textile display was realized with smart RGB-Pixels, which are controlled by an I²C-bus on a quadrupolic woven substrate. It demonstrates the applicability and the potential of this technology.

  • Electronics in Textiles – Adhesive Bonding Technology for Reliably Embedding Electronic Modules into Textile Circuits
    Advances in Science and Technology, 2012
    Co-Authors: Malte Von Krshiwoblozki, Torsten Linz, Andreas Neudeck, Christine Kallmayer
    Abstract:

    The interconnection of electronics and textile circuits is still a main challenge for the fabrication of reliable smart textiles. This paper investigates the Thermoplastic Adhesive bonding technology. Electronic modules are bonded to textile substrates with a Thermoplastic non-conductive Adhesive (NCA) film. The modules are placed onto textile circuits with an NCA-film in-between. By applying pressure and heat, the Adhesive melts and contact partners touch. Subsequently cooling solidifies the NCA resulting in an electrical and mechanical contact of the electronic module and the textile circuit. This paper shows the suitability of this technology for knitted, woven, non-woven and embroidered fabrics with metal coated yarns as well as with litz-wires as conductors. Besides, it shows that the interconnection process works well with Thermoplastically insulated conductors. In addition, the design of interposers has been improved in respect to contact formation and miniaturization compared to previous publications. The pitch of the contact pads is set to 1.27 mm. A textile display was realized with smart RGB-Pixels, which are controlled by an I²C-bus on a quadrupolic woven substrate. It demonstrates the applicability and the potential of this technology.

Torsten Linz - One of the best experts on this subject based on the ideXlab platform.

  • electronics in textiles Adhesive bonding technology for reliably embedding electronic modules into textile circuits
    Advances in Science and Technology, 2012
    Co-Authors: Malte Von Krshiwoblozki, Torsten Linz, Andreas Neudeck, Christine Kallmayer
    Abstract:

    The interconnection of electronics and textile circuits is still a main challenge for the fabrication of reliable smart textiles. This paper investigates the Thermoplastic Adhesive bonding technology. Electronic modules are bonded to textile substrates with a Thermoplastic non-conductive Adhesive (NCA) film. The modules are placed onto textile circuits with an NCA-film in-between. By applying pressure and heat, the Adhesive melts and contact partners touch. Subsequently cooling solidifies the NCA resulting in an electrical and mechanical contact of the electronic module and the textile circuit. This paper shows the suitability of this technology for knitted, woven, non-woven and embroidered fabrics with metal coated yarns as well as with litz-wires as conductors. Besides, it shows that the interconnection process works well with Thermoplastically insulated conductors. In addition, the design of interposers has been improved in respect to contact formation and miniaturization compared to previous publications. The pitch of the contact pads is set to 1.27 mm. A textile display was realized with smart RGB-Pixels, which are controlled by an I²C-bus on a quadrupolic woven substrate. It demonstrates the applicability and the potential of this technology.

  • Electronics in Textiles – Adhesive Bonding Technology for Reliably Embedding Electronic Modules into Textile Circuits
    Advances in Science and Technology, 2012
    Co-Authors: Malte Von Krshiwoblozki, Torsten Linz, Andreas Neudeck, Christine Kallmayer
    Abstract:

    The interconnection of electronics and textile circuits is still a main challenge for the fabrication of reliable smart textiles. This paper investigates the Thermoplastic Adhesive bonding technology. Electronic modules are bonded to textile substrates with a Thermoplastic non-conductive Adhesive (NCA) film. The modules are placed onto textile circuits with an NCA-film in-between. By applying pressure and heat, the Adhesive melts and contact partners touch. Subsequently cooling solidifies the NCA resulting in an electrical and mechanical contact of the electronic module and the textile circuit. This paper shows the suitability of this technology for knitted, woven, non-woven and embroidered fabrics with metal coated yarns as well as with litz-wires as conductors. Besides, it shows that the interconnection process works well with Thermoplastically insulated conductors. In addition, the design of interposers has been improved in respect to contact formation and miniaturization compared to previous publications. The pitch of the contact pads is set to 1.27 mm. A textile display was realized with smart RGB-Pixels, which are controlled by an I²C-bus on a quadrupolic woven substrate. It demonstrates the applicability and the potential of this technology.

Andreas Neudeck - One of the best experts on this subject based on the ideXlab platform.

  • electronics in textiles Adhesive bonding technology for reliably embedding electronic modules into textile circuits
    Advances in Science and Technology, 2012
    Co-Authors: Malte Von Krshiwoblozki, Torsten Linz, Andreas Neudeck, Christine Kallmayer
    Abstract:

    The interconnection of electronics and textile circuits is still a main challenge for the fabrication of reliable smart textiles. This paper investigates the Thermoplastic Adhesive bonding technology. Electronic modules are bonded to textile substrates with a Thermoplastic non-conductive Adhesive (NCA) film. The modules are placed onto textile circuits with an NCA-film in-between. By applying pressure and heat, the Adhesive melts and contact partners touch. Subsequently cooling solidifies the NCA resulting in an electrical and mechanical contact of the electronic module and the textile circuit. This paper shows the suitability of this technology for knitted, woven, non-woven and embroidered fabrics with metal coated yarns as well as with litz-wires as conductors. Besides, it shows that the interconnection process works well with Thermoplastically insulated conductors. In addition, the design of interposers has been improved in respect to contact formation and miniaturization compared to previous publications. The pitch of the contact pads is set to 1.27 mm. A textile display was realized with smart RGB-Pixels, which are controlled by an I²C-bus on a quadrupolic woven substrate. It demonstrates the applicability and the potential of this technology.

  • Electronics in Textiles – Adhesive Bonding Technology for Reliably Embedding Electronic Modules into Textile Circuits
    Advances in Science and Technology, 2012
    Co-Authors: Malte Von Krshiwoblozki, Torsten Linz, Andreas Neudeck, Christine Kallmayer
    Abstract:

    The interconnection of electronics and textile circuits is still a main challenge for the fabrication of reliable smart textiles. This paper investigates the Thermoplastic Adhesive bonding technology. Electronic modules are bonded to textile substrates with a Thermoplastic non-conductive Adhesive (NCA) film. The modules are placed onto textile circuits with an NCA-film in-between. By applying pressure and heat, the Adhesive melts and contact partners touch. Subsequently cooling solidifies the NCA resulting in an electrical and mechanical contact of the electronic module and the textile circuit. This paper shows the suitability of this technology for knitted, woven, non-woven and embroidered fabrics with metal coated yarns as well as with litz-wires as conductors. Besides, it shows that the interconnection process works well with Thermoplastically insulated conductors. In addition, the design of interposers has been improved in respect to contact formation and miniaturization compared to previous publications. The pitch of the contact pads is set to 1.27 mm. A textile display was realized with smart RGB-Pixels, which are controlled by an I²C-bus on a quadrupolic woven substrate. It demonstrates the applicability and the potential of this technology.

Shuji Obata - One of the best experts on this subject based on the ideXlab platform.

  • an induction heating method with traveling magnetic field for long structure metal
    Electrical Engineering in Japan, 2009
    Co-Authors: Takamitsu Sekine, Hideo Tomita, Shuji Obata, Yukio Saito
    Abstract:

    A novel dismantlable adhesion method for recycling operation of interior materials is proposed. This method applies a high-frequency induction heating (IH) and a Thermoplastic Adhesive. For adhesion of interior materials to long steel studs, a conventional spiral coil such as IH cooking heater is inadequate for uniform heating to the stud. Therefore, we have proposed an induction heating method with traveling magnetic field for perfect long structure bonding. In this paper, we describe the new adhesion method using a 20-kHz, three-phase 200-V inverter and linear induction coil. From induction heating characteristics to thin steel plates and long studs, the method demonstrates its usefulness for uniform heating to long structures. © 2009 Wiley Periodicals, Inc. Electr Eng Jpn, 168(4): 32–39, 2009; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/eej.20833

  • an induction heating method with traveling magnetic field for long structure metal
    Ieej Transactions on Industry Applications, 2007
    Co-Authors: Takamitsu Sekine, Hideo Tomita, Shuji Obata, Yukio Saito
    Abstract:

    A novel dismantlable adhesion method for recycling operation of interior materials is proposed. This method is applied a high frequency induction heating and a Thermoplastic Adhesive. For an adhesion of interior material to long steel stud, a conventional spiral coil as like IH cooking heater gives inadequateness for uniform heating to the stud. Therefore, we have proposed an induction heating method with traveling magnetic field for perfect long structures bonding. In this paper, we describe on the new adhesion method using the 20kHz, three-phase 200V inverter and linear induction coil. From induction heating characteristics to thin steel plates and long studs, the method is cleared the usefulness for uniform heating to long structures.

  • induction heating using traveling magnetic field and three phase high frequency inverter
    European Conference on Power Electronics and Applications, 2005
    Co-Authors: Hideo Tomita, Takamitsu Sekine, Shuji Obata
    Abstract:

    An effective dismantleable adhesion method is proposed for an interior material construction and mechanical assembling process for industry, etc. The method is applied an induction heating and Thermoplastic Adhesive. This paper is described on the new induction heating device using traveling magnetic field with the three-phase linear coil and high-frequency inverter for bonding of a long straight material. From the analysis and experiment, it is shown that the short pitch winding coil is effective for uniform heating on a straight metal. The device with this coil is applicable to adhesion and dismantling of a long steel stud and wall material for interior construction, for example

Takamitsu Sekine - One of the best experts on this subject based on the ideXlab platform.

  • an induction heating method with traveling magnetic field for long structure metal
    Electrical Engineering in Japan, 2009
    Co-Authors: Takamitsu Sekine, Hideo Tomita, Shuji Obata, Yukio Saito
    Abstract:

    A novel dismantlable adhesion method for recycling operation of interior materials is proposed. This method applies a high-frequency induction heating (IH) and a Thermoplastic Adhesive. For adhesion of interior materials to long steel studs, a conventional spiral coil such as IH cooking heater is inadequate for uniform heating to the stud. Therefore, we have proposed an induction heating method with traveling magnetic field for perfect long structure bonding. In this paper, we describe the new adhesion method using a 20-kHz, three-phase 200-V inverter and linear induction coil. From induction heating characteristics to thin steel plates and long studs, the method demonstrates its usefulness for uniform heating to long structures. © 2009 Wiley Periodicals, Inc. Electr Eng Jpn, 168(4): 32–39, 2009; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/eej.20833

  • an induction heating method with traveling magnetic field for long structure metal
    Ieej Transactions on Industry Applications, 2007
    Co-Authors: Takamitsu Sekine, Hideo Tomita, Shuji Obata, Yukio Saito
    Abstract:

    A novel dismantlable adhesion method for recycling operation of interior materials is proposed. This method is applied a high frequency induction heating and a Thermoplastic Adhesive. For an adhesion of interior material to long steel stud, a conventional spiral coil as like IH cooking heater gives inadequateness for uniform heating to the stud. Therefore, we have proposed an induction heating method with traveling magnetic field for perfect long structures bonding. In this paper, we describe on the new adhesion method using the 20kHz, three-phase 200V inverter and linear induction coil. From induction heating characteristics to thin steel plates and long studs, the method is cleared the usefulness for uniform heating to long structures.

  • induction heating using traveling magnetic field and three phase high frequency inverter
    European Conference on Power Electronics and Applications, 2005
    Co-Authors: Hideo Tomita, Takamitsu Sekine, Shuji Obata
    Abstract:

    An effective dismantleable adhesion method is proposed for an interior material construction and mechanical assembling process for industry, etc. The method is applied an induction heating and Thermoplastic Adhesive. This paper is described on the new induction heating device using traveling magnetic field with the three-phase linear coil and high-frequency inverter for bonding of a long straight material. From the analysis and experiment, it is shown that the short pitch winding coil is effective for uniform heating on a straight metal. The device with this coil is applicable to adhesion and dismantling of a long steel stud and wall material for interior construction, for example