The Experts below are selected from a list of 270 Experts worldwide ranked by ideXlab platform
Wenwu Wu - One of the best experts on this subject based on the ideXlab platform.
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Thermal-deformation coupling in thermal network for Transient Analysis of spindle-bearing system
International Journal of Thermal Sciences, 2016Co-Authors: Ke Yan, Wei Mi, Jinhua Zhang, Jun Hong, Wenwu WuAbstract:Transient Analysis by thermal network method for complex structures like the spindle-bearing system is essential but insufficient. In this paper, the network approach was developed for spindle Transient Analysis in consideration of thermal-structure interaction. Firstly, the radial and axial deformation of spindle system during assembling process, deformation by thermal extension and centrifugal effect were all obtained. Then the Transient Analysis was deduced based on traditional steady model, the thermal-deformation coupling and some other time-varying parameters. Experiment results indicate that temperature by steady model is of large deviation, while by the Transient model is much more accurate. Finally, the temperature rising curves, the balance time of the spindle system and temperature rise feature for continuous working conditions were all achieved and discussed.
Yuichi Tanji - One of the best experts on this subject based on the ideXlab platform.
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ICECS - Circuit-based FDTD method for Transient Analysis of mutually coupled system
2008 15th IEEE International Conference on Electronics Circuits and Systems, 2008Co-Authors: Yuichi TanjiAbstract:The circuit-based FDTD method for Transient Analysis of a mutually coupled system is presented. To speed up the Transient Analysis, the reluctance matrix is introduced. We provide how to generate the sparse reluctance matrix with guaranteed stability. Furthermore, we show that the relaxation methods used for the Transient Analysis converge when the stability of the reluctance matrix is guaranteed. We confirm that the proposed method is 18 times faster than HSPICE and is 352 times faster than Berkeley SPICE when the full capacitance and inductance matrices are used. Moreover, when the sparse capacitance and inductance matrices are used, the proposed method is 69 times faster than HSPICE and is 1,349 times faster than Berkeley SPICE, though a small-scale problem is analyzed.
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Circuit-based FDTD method for Transient Analysis of mutually coupled system
2008 15th IEEE International Conference on Electronics Circuits and Systems, 2008Co-Authors: Yuichi TanjiAbstract:The circuit-based FDTD method for Transient Analysis of a mutually coupled system is presented. To speed up the Transient Analysis, the reluctance matrix is introduced. We provide how to generate the sparse reluctance matrix with guaranteed stability. Furthermore, we show that the relaxation methods used for the Transient Analysis converge when the stability of the reluctance matrix is guaranteed. We confirm that the proposed method is 18 times faster than HSPICE and is 352 times faster than Berkeley SPICE when the full capacitance and inductance matrices are used. Moreover, when the sparse capacitance and inductance matrices are used, the proposed method is 69 times faster than HSPICE and is 1,349 times faster than Berkeley SPICE, though a small-scale problem is analyzed.
Ke Yan - One of the best experts on this subject based on the ideXlab platform.
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Thermal-deformation coupling in thermal network for Transient Analysis of spindle-bearing system
International Journal of Thermal Sciences, 2016Co-Authors: Ke Yan, Wei Mi, Jinhua Zhang, Jun Hong, Wenwu WuAbstract:Transient Analysis by thermal network method for complex structures like the spindle-bearing system is essential but insufficient. In this paper, the network approach was developed for spindle Transient Analysis in consideration of thermal-structure interaction. Firstly, the radial and axial deformation of spindle system during assembling process, deformation by thermal extension and centrifugal effect were all obtained. Then the Transient Analysis was deduced based on traditional steady model, the thermal-deformation coupling and some other time-varying parameters. Experiment results indicate that temperature by steady model is of large deviation, while by the Transient model is much more accurate. Finally, the temperature rising curves, the balance time of the spindle system and temperature rise feature for continuous working conditions were all achieved and discussed.
Carlos Christoffersen - One of the best experts on this subject based on the ideXlab platform.
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Wave-based Transient Analysis using block Newton-Jacobi
2011 24th Canadian Conference on Electrical and Computer Engineering(CCECE), 2011Co-Authors: Muhammad Kabir, Carlos ChristoffersenAbstract:A recently introduced wave-based Transient Analysis uses relaxation and thus does not require large matrix decompositions at each nonlinear iteration. The use of waves results in guaranteed convergence for any linear passive circuit and some types of nonlinear circuits, but the convergence rate can not be controlled. In this work, the wave-based Transient Analysis is re-formulated using a block Newton-Jacobi approach and the convergence properties of the original and new formulations are compared with the simulation of two microwave circuits.
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CCECE - Wave-based Transient Analysis using block Newton-Jacobi
2011 24th Canadian Conference on Electrical and Computer Engineering(CCECE), 2011Co-Authors: Muhammad Kabir, Carlos ChristoffersenAbstract:A recently introduced wave-based Transient Analysis uses relaxation and thus does not require large matrix decompositions at each nonlinear iteration. The use of waves results in guaranteed convergence for any linear passive circuit and some types of nonlinear circuits, but the convergence rate can not be controlled. In this work, the wave-based Transient Analysis is re-formulated using a block Newton-Jacobi approach and the convergence properties of the original and new formulations are compared with the simulation of two microwave circuits.
Wei Mi - One of the best experts on this subject based on the ideXlab platform.
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Thermal-deformation coupling in thermal network for Transient Analysis of spindle-bearing system
International Journal of Thermal Sciences, 2016Co-Authors: Ke Yan, Wei Mi, Jinhua Zhang, Jun Hong, Wenwu WuAbstract:Transient Analysis by thermal network method for complex structures like the spindle-bearing system is essential but insufficient. In this paper, the network approach was developed for spindle Transient Analysis in consideration of thermal-structure interaction. Firstly, the radial and axial deformation of spindle system during assembling process, deformation by thermal extension and centrifugal effect were all obtained. Then the Transient Analysis was deduced based on traditional steady model, the thermal-deformation coupling and some other time-varying parameters. Experiment results indicate that temperature by steady model is of large deviation, while by the Transient model is much more accurate. Finally, the temperature rising curves, the balance time of the spindle system and temperature rise feature for continuous working conditions were all achieved and discussed.
