Transverse Thermal Conductivity

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Zhimao Yang - One of the best experts on this subject based on the ideXlab platform.

  • Modified Thermal resistance networks model for Transverse Thermal Conductivity of unidirectional fiber composite
    Composites Communications, 2017
    Co-Authors: Jiang Haiqing, Hitoshi Takagi, Dong Wang, Ke Liu, Yi Zhibing, Cheng Pan, Chuncai Kong, Xiaojun Wang, Zhimao Yang
    Abstract:

    Abstract In this paper, a facile method based on Thermal-electrical analogy technique was developed to solve the heat flow transfer behavior in unidirectional fiber reinforced polymer composite. A modulating Thermal resistance R md , correcting the heat flux, was introduced in the Thermal resistance network to analyze two-dimensional square arrayed square fiber model of composite for its effective Transverse Thermal Conductivity. The result of present method showed a better agreement with that of finite element method (FEM) than existed parallel or series Thermal resistance network. Around this consideration, the composite reinforced by fiber with circular-cross section was also modeled to evaluate the Transverse Thermal Conductivity, which still exhibit well consistent with experimental data. It indicates that the proposed method is enough accurate and effective for evaluating the Thermal Conductivity of unidirectional fiber composite and provides a facile approach to understand the complicated heat flow transfer behavior in composites.

  • effect of chemical treatments on Transverse Thermal Conductivity of unidirectional abaca fiber epoxy composite
    Composites Part A-applied Science and Manufacturing, 2014
    Co-Authors: Xiaozhe Zhang, Zhimao Yang, Hitoshi Takagi, Dong Wang
    Abstract:

    Abstract Present paper investigated the effect of mercerization and silane treatments on the Transverse Thermal conduction properties of unidirectional abaca fiber–epoxy composite fabricated by resin transfer molding. As indicated by FTIR, XRD and SEM, the changes in chemical composition, crystalline and lumen structure of abaca fibers were introduced by chemical treatments. Transverse tensile test showed that the weakest linkage of unidirectional composite changed from interface between abaca fiber bundle and epoxy resin for untreated abaca fiber to interface between elementary fibers treated by mercerization and silanization. With the increasing of weakest linkages strength and the decreasing of void content, the Transverse Thermal Conductivity (TCC) of the composite presents increasing trend. The changing of interfaces, cell wall and lumen derived from chemical treatments are the mainly factors affecting TTC. It was concluded that the abaca fiber composite with controllable Transverse Thermal conduction property can be designed by proper chemical treatment.

  • Effect of chemical treatments on Transverse Thermal Conductivity of unidirectional abaca fiber/epoxy composite
    Composites Part A-applied Science and Manufacturing, 2014
    Co-Authors: Xiaozhe Zhang, Zhimao Yang, Hitoshi Takagi, Dong Wang
    Abstract:

    Abstract Present paper investigated the effect of mercerization and silane treatments on the Transverse Thermal conduction properties of unidirectional abaca fiber–epoxy composite fabricated by resin transfer molding. As indicated by FTIR, XRD and SEM, the changes in chemical composition, crystalline and lumen structure of abaca fibers were introduced by chemical treatments. Transverse tensile test showed that the weakest linkage of unidirectional composite changed from interface between abaca fiber bundle and epoxy resin for untreated abaca fiber to interface between elementary fibers treated by mercerization and silanization. With the increasing of weakest linkages strength and the decreasing of void content, the Transverse Thermal Conductivity (TCC) of the composite presents increasing trend. The changing of interfaces, cell wall and lumen derived from chemical treatments are the mainly factors affecting TTC. It was concluded that the abaca fiber composite with controllable Transverse Thermal conduction property can be designed by proper chemical treatment.

  • Effect of chemical treatments on Transverse Thermal Conductivity of unidirectional abaca fiber/epoxy composite Part A Applied science and manufacturing
    Composites, 2014
    Co-Authors: Ke Liu, Zhimao Yang, Xiaozhe Zhang, Hitoshi Takagi, Dong Wang
    Abstract:

    Present paper investigated the effect of mercerization and silane treatments on the Transverse Thermal conduction properties of unidirectional abaca fiber–epoxy composite fabricated by resin transfer molding. As indicated by FTIR, XRD and SEM, the changes in chemical composition, crystalline and lumen structure of abaca fibers were introduced by chemical treatments. Transverse tensile test showed that the weakest linkage of unidirectional composite changed from interface between abaca fiber bundle and epoxy resin for untreated abaca fiber to interface between elementary fibers treated by mercerization and silanization. With the increasing of weakest linkages strength and the decreasing of void content, the Transverse Thermal Conductivity (TCC) of the composite presents increasing trend. The changing of interfaces, cell wall and lumen derived from chemical treatments are the mainly factors affecting TTC. It was concluded that the abaca fiber composite with controllable Transverse Thermal conduction property can be designed by proper chemical treatment.

  • effect of chemical treatments on Transverse Thermal Conductivity of unidirectional abaca fiber epoxy composite part a applied science and manufacturing
    Composites, 2014
    Co-Authors: Ke Liu, Zhimao Yang, Xiaozhe Zhang, Hitoshi Takagi, Dong Wang
    Abstract:

    Present paper investigated the effect of mercerization and silane treatments on the Transverse Thermal conduction properties of unidirectional abaca fiber–epoxy composite fabricated by resin transfer molding. As indicated by FTIR, XRD and SEM, the changes in chemical composition, crystalline and lumen structure of abaca fibers were introduced by chemical treatments. Transverse tensile test showed that the weakest linkage of unidirectional composite changed from interface between abaca fiber bundle and epoxy resin for untreated abaca fiber to interface between elementary fibers treated by mercerization and silanization. With the increasing of weakest linkages strength and the decreasing of void content, the Transverse Thermal Conductivity (TCC) of the composite presents increasing trend. The changing of interfaces, cell wall and lumen derived from chemical treatments are the mainly factors affecting TTC. It was concluded that the abaca fiber composite with controllable Transverse Thermal conduction property can be designed by proper chemical treatment.

Hitoshi Takagi - One of the best experts on this subject based on the ideXlab platform.

  • Modified Thermal resistance networks model for Transverse Thermal Conductivity of unidirectional fiber composite
    Composites Communications, 2017
    Co-Authors: Jiang Haiqing, Hitoshi Takagi, Dong Wang, Ke Liu, Yi Zhibing, Cheng Pan, Chuncai Kong, Xiaojun Wang, Zhimao Yang
    Abstract:

    Abstract In this paper, a facile method based on Thermal-electrical analogy technique was developed to solve the heat flow transfer behavior in unidirectional fiber reinforced polymer composite. A modulating Thermal resistance R md , correcting the heat flux, was introduced in the Thermal resistance network to analyze two-dimensional square arrayed square fiber model of composite for its effective Transverse Thermal Conductivity. The result of present method showed a better agreement with that of finite element method (FEM) than existed parallel or series Thermal resistance network. Around this consideration, the composite reinforced by fiber with circular-cross section was also modeled to evaluate the Transverse Thermal Conductivity, which still exhibit well consistent with experimental data. It indicates that the proposed method is enough accurate and effective for evaluating the Thermal Conductivity of unidirectional fiber composite and provides a facile approach to understand the complicated heat flow transfer behavior in composites.

  • effect of chemical treatments on Transverse Thermal Conductivity of unidirectional abaca fiber epoxy composite
    Composites Part A-applied Science and Manufacturing, 2014
    Co-Authors: Xiaozhe Zhang, Zhimao Yang, Hitoshi Takagi, Dong Wang
    Abstract:

    Abstract Present paper investigated the effect of mercerization and silane treatments on the Transverse Thermal conduction properties of unidirectional abaca fiber–epoxy composite fabricated by resin transfer molding. As indicated by FTIR, XRD and SEM, the changes in chemical composition, crystalline and lumen structure of abaca fibers were introduced by chemical treatments. Transverse tensile test showed that the weakest linkage of unidirectional composite changed from interface between abaca fiber bundle and epoxy resin for untreated abaca fiber to interface between elementary fibers treated by mercerization and silanization. With the increasing of weakest linkages strength and the decreasing of void content, the Transverse Thermal Conductivity (TCC) of the composite presents increasing trend. The changing of interfaces, cell wall and lumen derived from chemical treatments are the mainly factors affecting TTC. It was concluded that the abaca fiber composite with controllable Transverse Thermal conduction property can be designed by proper chemical treatment.

  • Effect of chemical treatments on Transverse Thermal Conductivity of unidirectional abaca fiber/epoxy composite
    Composites Part A-applied Science and Manufacturing, 2014
    Co-Authors: Xiaozhe Zhang, Zhimao Yang, Hitoshi Takagi, Dong Wang
    Abstract:

    Abstract Present paper investigated the effect of mercerization and silane treatments on the Transverse Thermal conduction properties of unidirectional abaca fiber–epoxy composite fabricated by resin transfer molding. As indicated by FTIR, XRD and SEM, the changes in chemical composition, crystalline and lumen structure of abaca fibers were introduced by chemical treatments. Transverse tensile test showed that the weakest linkage of unidirectional composite changed from interface between abaca fiber bundle and epoxy resin for untreated abaca fiber to interface between elementary fibers treated by mercerization and silanization. With the increasing of weakest linkages strength and the decreasing of void content, the Transverse Thermal Conductivity (TCC) of the composite presents increasing trend. The changing of interfaces, cell wall and lumen derived from chemical treatments are the mainly factors affecting TTC. It was concluded that the abaca fiber composite with controllable Transverse Thermal conduction property can be designed by proper chemical treatment.

  • Effect of chemical treatments on Transverse Thermal Conductivity of unidirectional abaca fiber/epoxy composite Part A Applied science and manufacturing
    Composites, 2014
    Co-Authors: Ke Liu, Zhimao Yang, Xiaozhe Zhang, Hitoshi Takagi, Dong Wang
    Abstract:

    Present paper investigated the effect of mercerization and silane treatments on the Transverse Thermal conduction properties of unidirectional abaca fiber–epoxy composite fabricated by resin transfer molding. As indicated by FTIR, XRD and SEM, the changes in chemical composition, crystalline and lumen structure of abaca fibers were introduced by chemical treatments. Transverse tensile test showed that the weakest linkage of unidirectional composite changed from interface between abaca fiber bundle and epoxy resin for untreated abaca fiber to interface between elementary fibers treated by mercerization and silanization. With the increasing of weakest linkages strength and the decreasing of void content, the Transverse Thermal Conductivity (TCC) of the composite presents increasing trend. The changing of interfaces, cell wall and lumen derived from chemical treatments are the mainly factors affecting TTC. It was concluded that the abaca fiber composite with controllable Transverse Thermal conduction property can be designed by proper chemical treatment.

  • effect of chemical treatments on Transverse Thermal Conductivity of unidirectional abaca fiber epoxy composite part a applied science and manufacturing
    Composites, 2014
    Co-Authors: Ke Liu, Zhimao Yang, Xiaozhe Zhang, Hitoshi Takagi, Dong Wang
    Abstract:

    Present paper investigated the effect of mercerization and silane treatments on the Transverse Thermal conduction properties of unidirectional abaca fiber–epoxy composite fabricated by resin transfer molding. As indicated by FTIR, XRD and SEM, the changes in chemical composition, crystalline and lumen structure of abaca fibers were introduced by chemical treatments. Transverse tensile test showed that the weakest linkage of unidirectional composite changed from interface between abaca fiber bundle and epoxy resin for untreated abaca fiber to interface between elementary fibers treated by mercerization and silanization. With the increasing of weakest linkages strength and the decreasing of void content, the Transverse Thermal Conductivity (TCC) of the composite presents increasing trend. The changing of interfaces, cell wall and lumen derived from chemical treatments are the mainly factors affecting TTC. It was concluded that the abaca fiber composite with controllable Transverse Thermal conduction property can be designed by proper chemical treatment.

P. J. Loos - One of the best experts on this subject based on the ideXlab platform.

  • Interface Effect on the Transverse Thermal Conductivity of SiO_2 Films Deposited on Silicon
    MRS Online Proceedings Library, 1998
    Co-Authors: W. Zhao, F. R. Brotzen, L. Hehn, P. J. Loos
    Abstract:

    Earlier work revealed that the Transverse Thermal Conductivity of thin films of amorphous SiO_2 deposited on monocrystalline silicon decreased substantially when the film thickness was less than about 1 μm. When multiple interfaces were created by the intercalation of thin intermediate layers of polycrystalline silicon into the SiO_2 film, the thickness effect was enhanced. This observation pointed to an interfacial effect. A model accounting for the interface effect is discussed.

  • The Transverse Thermal Conductivity of thin dielectric films
    High temperature and materials science, 1995
    Co-Authors: A. J. Griffin, F. R. Brotzen, P. J. Loos
    Abstract:

    Thin films of SiO{sub 2} and Si{sub 3}N{sub 4} are commonly used as protective coating and gate dielectrics in many microelectronic applications. Device-reliability requirements dictate that the SiO{sub 2} and Si{sub 3}N{sub 4} thin films adequately remove heat away from thin-film metallic conductors in order to avoid poor device performance and premature device failure. Recent findings indicate that the Transverse (i.e., across the film thickness) Thermal Conductivity of thin dielectric films dependents strongly on film thickness. This strong thickness dependences is discussed in terms of a n interfacial Thermal resistance. The experimentally determined Thermal Conductivity of thin dielectric films is therefore termed as an effective Thermal Conductivity because it is actually composed of an intrinsic Thermal resistance owing to the film an dan interfacial Thermal resistance. Because these results are applicable to a variety of thin-film applications, such as high temperature wear- and corrosion-resistant coatings and high temperature micro-electronic devices, bulk and thin-film Thermal Conductivity of crystalline and amorphous materials will be reviewed, contrasted, and discussed.

  • Effect of thickness on the Transverse Thermal Conductivity of thin dielectric films
    Journal of Applied Physics, 1994
    Co-Authors: A. J. Griffin, F. R. Brotzen, P. J. Loos
    Abstract:

    The Transverse Thermal conductivities of SiO2 thin films are determined as a function of film thickness. The results indicate that the apparent Thermal conductivities of SiO2 thin films are much lower than the Thermal Conductivity of bulk SiO2. In addition, a slight decrease in the Thermal Conductivity is observed as the average temperature within the dielectric film increases. The average Transverse Thermal Conductivity decreases drastically as the film thickness is reduced. This strong thickness dependence is explained in terms of an interfacial Thermal resistance that develops at the SiO2/Si interface. The experimentally determined value for the interfacial Thermal resistance, Rint, is 2.05 mm2 °C W−1.

  • The effective Transverse Thermal Conductivity of amorphous Si3N4 thin films
    Journal of Applied Physics, 1994
    Co-Authors: A. J. Griffin, F. R. Brotzen, P. J. Loos
    Abstract:

    The effective Transverse Thermal Conductivity of Si3N4 thin films is determined as a function of film thickness. Results indicate that the effective Thermal Conductivity behavior of Si3N4 thin films is similar to that exhibited by amorphous SiO2 films; that is, there is no significant difference between the Thermal Conductivity of amorphous Si3N4 and amorphous SiO2 thin films as a function of thickness or temperature. The average effective Transverse Thermal Conductivity decreases drastically as the film thickness is reduced. This strong thickness dependence is ascribed to a Thermal resistance that is localized at the amorphous film/Si‐substrate interface. Within the narrow temperature range studied, the interfacial Thermal resistance and the intrinsic Conductivity of amorphous films increase with temperature; however, the interfacial resistance dominates as the film thickness is reduced. In light of the observed similarities between the Si3N4 results and those previously obtained on SiO2, the reduction in the effective Thermal Conductivity of amorphous thin films with decreasing thickness is discussed in terms of both interfacial Thermal resistance and scattering mechanisms in amorphous solids.

Dong Wang - One of the best experts on this subject based on the ideXlab platform.

  • Modified Thermal resistance networks model for Transverse Thermal Conductivity of unidirectional fiber composite
    Composites Communications, 2017
    Co-Authors: Jiang Haiqing, Hitoshi Takagi, Dong Wang, Ke Liu, Yi Zhibing, Cheng Pan, Chuncai Kong, Xiaojun Wang, Zhimao Yang
    Abstract:

    Abstract In this paper, a facile method based on Thermal-electrical analogy technique was developed to solve the heat flow transfer behavior in unidirectional fiber reinforced polymer composite. A modulating Thermal resistance R md , correcting the heat flux, was introduced in the Thermal resistance network to analyze two-dimensional square arrayed square fiber model of composite for its effective Transverse Thermal Conductivity. The result of present method showed a better agreement with that of finite element method (FEM) than existed parallel or series Thermal resistance network. Around this consideration, the composite reinforced by fiber with circular-cross section was also modeled to evaluate the Transverse Thermal Conductivity, which still exhibit well consistent with experimental data. It indicates that the proposed method is enough accurate and effective for evaluating the Thermal Conductivity of unidirectional fiber composite and provides a facile approach to understand the complicated heat flow transfer behavior in composites.

  • effect of chemical treatments on Transverse Thermal Conductivity of unidirectional abaca fiber epoxy composite
    Composites Part A-applied Science and Manufacturing, 2014
    Co-Authors: Xiaozhe Zhang, Zhimao Yang, Hitoshi Takagi, Dong Wang
    Abstract:

    Abstract Present paper investigated the effect of mercerization and silane treatments on the Transverse Thermal conduction properties of unidirectional abaca fiber–epoxy composite fabricated by resin transfer molding. As indicated by FTIR, XRD and SEM, the changes in chemical composition, crystalline and lumen structure of abaca fibers were introduced by chemical treatments. Transverse tensile test showed that the weakest linkage of unidirectional composite changed from interface between abaca fiber bundle and epoxy resin for untreated abaca fiber to interface between elementary fibers treated by mercerization and silanization. With the increasing of weakest linkages strength and the decreasing of void content, the Transverse Thermal Conductivity (TCC) of the composite presents increasing trend. The changing of interfaces, cell wall and lumen derived from chemical treatments are the mainly factors affecting TTC. It was concluded that the abaca fiber composite with controllable Transverse Thermal conduction property can be designed by proper chemical treatment.

  • Effect of chemical treatments on Transverse Thermal Conductivity of unidirectional abaca fiber/epoxy composite
    Composites Part A-applied Science and Manufacturing, 2014
    Co-Authors: Xiaozhe Zhang, Zhimao Yang, Hitoshi Takagi, Dong Wang
    Abstract:

    Abstract Present paper investigated the effect of mercerization and silane treatments on the Transverse Thermal conduction properties of unidirectional abaca fiber–epoxy composite fabricated by resin transfer molding. As indicated by FTIR, XRD and SEM, the changes in chemical composition, crystalline and lumen structure of abaca fibers were introduced by chemical treatments. Transverse tensile test showed that the weakest linkage of unidirectional composite changed from interface between abaca fiber bundle and epoxy resin for untreated abaca fiber to interface between elementary fibers treated by mercerization and silanization. With the increasing of weakest linkages strength and the decreasing of void content, the Transverse Thermal Conductivity (TCC) of the composite presents increasing trend. The changing of interfaces, cell wall and lumen derived from chemical treatments are the mainly factors affecting TTC. It was concluded that the abaca fiber composite with controllable Transverse Thermal conduction property can be designed by proper chemical treatment.

  • Effect of chemical treatments on Transverse Thermal Conductivity of unidirectional abaca fiber/epoxy composite Part A Applied science and manufacturing
    Composites, 2014
    Co-Authors: Ke Liu, Zhimao Yang, Xiaozhe Zhang, Hitoshi Takagi, Dong Wang
    Abstract:

    Present paper investigated the effect of mercerization and silane treatments on the Transverse Thermal conduction properties of unidirectional abaca fiber–epoxy composite fabricated by resin transfer molding. As indicated by FTIR, XRD and SEM, the changes in chemical composition, crystalline and lumen structure of abaca fibers were introduced by chemical treatments. Transverse tensile test showed that the weakest linkage of unidirectional composite changed from interface between abaca fiber bundle and epoxy resin for untreated abaca fiber to interface between elementary fibers treated by mercerization and silanization. With the increasing of weakest linkages strength and the decreasing of void content, the Transverse Thermal Conductivity (TCC) of the composite presents increasing trend. The changing of interfaces, cell wall and lumen derived from chemical treatments are the mainly factors affecting TTC. It was concluded that the abaca fiber composite with controllable Transverse Thermal conduction property can be designed by proper chemical treatment.

  • effect of chemical treatments on Transverse Thermal Conductivity of unidirectional abaca fiber epoxy composite part a applied science and manufacturing
    Composites, 2014
    Co-Authors: Ke Liu, Zhimao Yang, Xiaozhe Zhang, Hitoshi Takagi, Dong Wang
    Abstract:

    Present paper investigated the effect of mercerization and silane treatments on the Transverse Thermal conduction properties of unidirectional abaca fiber–epoxy composite fabricated by resin transfer molding. As indicated by FTIR, XRD and SEM, the changes in chemical composition, crystalline and lumen structure of abaca fibers were introduced by chemical treatments. Transverse tensile test showed that the weakest linkage of unidirectional composite changed from interface between abaca fiber bundle and epoxy resin for untreated abaca fiber to interface between elementary fibers treated by mercerization and silanization. With the increasing of weakest linkages strength and the decreasing of void content, the Transverse Thermal Conductivity (TCC) of the composite presents increasing trend. The changing of interfaces, cell wall and lumen derived from chemical treatments are the mainly factors affecting TTC. It was concluded that the abaca fiber composite with controllable Transverse Thermal conduction property can be designed by proper chemical treatment.

A. J. Griffin - One of the best experts on this subject based on the ideXlab platform.

  • The Transverse Thermal Conductivity of thin dielectric films
    High temperature and materials science, 1995
    Co-Authors: A. J. Griffin, F. R. Brotzen, P. J. Loos
    Abstract:

    Thin films of SiO{sub 2} and Si{sub 3}N{sub 4} are commonly used as protective coating and gate dielectrics in many microelectronic applications. Device-reliability requirements dictate that the SiO{sub 2} and Si{sub 3}N{sub 4} thin films adequately remove heat away from thin-film metallic conductors in order to avoid poor device performance and premature device failure. Recent findings indicate that the Transverse (i.e., across the film thickness) Thermal Conductivity of thin dielectric films dependents strongly on film thickness. This strong thickness dependences is discussed in terms of a n interfacial Thermal resistance. The experimentally determined Thermal Conductivity of thin dielectric films is therefore termed as an effective Thermal Conductivity because it is actually composed of an intrinsic Thermal resistance owing to the film an dan interfacial Thermal resistance. Because these results are applicable to a variety of thin-film applications, such as high temperature wear- and corrosion-resistant coatings and high temperature micro-electronic devices, bulk and thin-film Thermal Conductivity of crystalline and amorphous materials will be reviewed, contrasted, and discussed.

  • Effect of thickness on the Transverse Thermal Conductivity of thin dielectric films
    Journal of Applied Physics, 1994
    Co-Authors: A. J. Griffin, F. R. Brotzen, P. J. Loos
    Abstract:

    The Transverse Thermal conductivities of SiO2 thin films are determined as a function of film thickness. The results indicate that the apparent Thermal conductivities of SiO2 thin films are much lower than the Thermal Conductivity of bulk SiO2. In addition, a slight decrease in the Thermal Conductivity is observed as the average temperature within the dielectric film increases. The average Transverse Thermal Conductivity decreases drastically as the film thickness is reduced. This strong thickness dependence is explained in terms of an interfacial Thermal resistance that develops at the SiO2/Si interface. The experimentally determined value for the interfacial Thermal resistance, Rint, is 2.05 mm2 °C W−1.

  • The effective Transverse Thermal Conductivity of amorphous Si3N4 thin films
    Journal of Applied Physics, 1994
    Co-Authors: A. J. Griffin, F. R. Brotzen, P. J. Loos
    Abstract:

    The effective Transverse Thermal Conductivity of Si3N4 thin films is determined as a function of film thickness. Results indicate that the effective Thermal Conductivity behavior of Si3N4 thin films is similar to that exhibited by amorphous SiO2 films; that is, there is no significant difference between the Thermal Conductivity of amorphous Si3N4 and amorphous SiO2 thin films as a function of thickness or temperature. The average effective Transverse Thermal Conductivity decreases drastically as the film thickness is reduced. This strong thickness dependence is ascribed to a Thermal resistance that is localized at the amorphous film/Si‐substrate interface. Within the narrow temperature range studied, the interfacial Thermal resistance and the intrinsic Conductivity of amorphous films increase with temperature; however, the interfacial resistance dominates as the film thickness is reduced. In light of the observed similarities between the Si3N4 results and those previously obtained on SiO2, the reduction in the effective Thermal Conductivity of amorphous thin films with decreasing thickness is discussed in terms of both interfacial Thermal resistance and scattering mechanisms in amorphous solids.