Vapor Phase

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Roya Maboudian - One of the best experts on this subject based on the ideXlab platform.

  • Vapor Phase anti-stiction coatings for MEMS
    IEEE Transactions on Device and Materials Reliability, 2003
    Co-Authors: W. Robert Ashurst, Carlo Carraro, Roya Maboudian
    Abstract:

    This paper describes a processing method which allows for the application of a dichlorodimethylsilane (DDMS) anti-stiction monolayer to MEMS devices on a wafer scale from the Vapor Phase. By utilizing Vapor Phase processing, many problems associated with liquid processing can be overcome. We have designed and built a reactor system that allows for the Vapor Phase deposition of a variety of anti-stiction coatings on both die and full 200 mm wafer levels. Contact angle analysis, atomic force microscopy (AFM) and thermal annealing have been used to characterize the film on Si(100). Film properties such as apparent work of adhesion and coefficient of static friction are obtained from coated micromachine test structures. It is shown that the DDMS monolayer deposited from the Vapor Phase is as effective at reducing adhesion and friction as the DDMS monolayer deposited from the (conventional) liquid Phase. Moreover, it is shown that the DDMS coating can be successfully applied to a 150 mm wafer of released devices. Post-packaging data show substantial improvement in the stiction behavior of coated devices versus uncoated devices.

  • Vapor Phase anti-stiction coatings for MEMS
    IEEE Transactions on Device and Materials Reliability, 2003
    Co-Authors: W. Robert Ashurst, Carlo Carraro, Roya Maboudian
    Abstract:

    Due to their large surface-area-to-volume ratio, most micromechanical devices are susceptible to adhesion, friction, and wear. Conventional approaches to abate the deleterious effects of adhesion and friction rely on the deposition of organically based anti-stiction monolayers produced from liquid Phase processes. It has become widely accepted that liquid Phase monolayer processes are less desirable than Vapor Phase processes, especially for manufacturing purposes. Thus, current research is aimed at the development of Vapor Phase anti-stiction processes that yield comparable or better films than their corresponding liquid Phase processes. To date, a variety of monolayer systems that have been well established via liquid Phase deposition processes have been adapted to Vapor processes. In this paper, current trends in anti-stiction technology and a discussion of available Vapor Phase anti-stiction methods are presented.

W. Robert Ashurst - One of the best experts on this subject based on the ideXlab platform.

  • Vapor Phase anti-stiction coatings for MEMS
    IEEE Transactions on Device and Materials Reliability, 2003
    Co-Authors: W. Robert Ashurst, Carlo Carraro, Roya Maboudian
    Abstract:

    This paper describes a processing method which allows for the application of a dichlorodimethylsilane (DDMS) anti-stiction monolayer to MEMS devices on a wafer scale from the Vapor Phase. By utilizing Vapor Phase processing, many problems associated with liquid processing can be overcome. We have designed and built a reactor system that allows for the Vapor Phase deposition of a variety of anti-stiction coatings on both die and full 200 mm wafer levels. Contact angle analysis, atomic force microscopy (AFM) and thermal annealing have been used to characterize the film on Si(100). Film properties such as apparent work of adhesion and coefficient of static friction are obtained from coated micromachine test structures. It is shown that the DDMS monolayer deposited from the Vapor Phase is as effective at reducing adhesion and friction as the DDMS monolayer deposited from the (conventional) liquid Phase. Moreover, it is shown that the DDMS coating can be successfully applied to a 150 mm wafer of released devices. Post-packaging data show substantial improvement in the stiction behavior of coated devices versus uncoated devices.

  • Vapor Phase anti-stiction coatings for MEMS
    IEEE Transactions on Device and Materials Reliability, 2003
    Co-Authors: W. Robert Ashurst, Carlo Carraro, Roya Maboudian
    Abstract:

    Due to their large surface-area-to-volume ratio, most micromechanical devices are susceptible to adhesion, friction, and wear. Conventional approaches to abate the deleterious effects of adhesion and friction rely on the deposition of organically based anti-stiction monolayers produced from liquid Phase processes. It has become widely accepted that liquid Phase monolayer processes are less desirable than Vapor Phase processes, especially for manufacturing purposes. Thus, current research is aimed at the development of Vapor Phase anti-stiction processes that yield comparable or better films than their corresponding liquid Phase processes. To date, a variety of monolayer systems that have been well established via liquid Phase deposition processes have been adapted to Vapor processes. In this paper, current trends in anti-stiction technology and a discussion of available Vapor Phase anti-stiction methods are presented.

Carlo Carraro - One of the best experts on this subject based on the ideXlab platform.

  • Vapor Phase anti-stiction coatings for MEMS
    IEEE Transactions on Device and Materials Reliability, 2003
    Co-Authors: W. Robert Ashurst, Carlo Carraro, Roya Maboudian
    Abstract:

    This paper describes a processing method which allows for the application of a dichlorodimethylsilane (DDMS) anti-stiction monolayer to MEMS devices on a wafer scale from the Vapor Phase. By utilizing Vapor Phase processing, many problems associated with liquid processing can be overcome. We have designed and built a reactor system that allows for the Vapor Phase deposition of a variety of anti-stiction coatings on both die and full 200 mm wafer levels. Contact angle analysis, atomic force microscopy (AFM) and thermal annealing have been used to characterize the film on Si(100). Film properties such as apparent work of adhesion and coefficient of static friction are obtained from coated micromachine test structures. It is shown that the DDMS monolayer deposited from the Vapor Phase is as effective at reducing adhesion and friction as the DDMS monolayer deposited from the (conventional) liquid Phase. Moreover, it is shown that the DDMS coating can be successfully applied to a 150 mm wafer of released devices. Post-packaging data show substantial improvement in the stiction behavior of coated devices versus uncoated devices.

  • Vapor Phase anti-stiction coatings for MEMS
    IEEE Transactions on Device and Materials Reliability, 2003
    Co-Authors: W. Robert Ashurst, Carlo Carraro, Roya Maboudian
    Abstract:

    Due to their large surface-area-to-volume ratio, most micromechanical devices are susceptible to adhesion, friction, and wear. Conventional approaches to abate the deleterious effects of adhesion and friction rely on the deposition of organically based anti-stiction monolayers produced from liquid Phase processes. It has become widely accepted that liquid Phase monolayer processes are less desirable than Vapor Phase processes, especially for manufacturing purposes. Thus, current research is aimed at the development of Vapor Phase anti-stiction processes that yield comparable or better films than their corresponding liquid Phase processes. To date, a variety of monolayer systems that have been well established via liquid Phase deposition processes have been adapted to Vapor processes. In this paper, current trends in anti-stiction technology and a discussion of available Vapor Phase anti-stiction methods are presented.

J C Zolper - One of the best experts on this subject based on the ideXlab platform.

Mark T Swihart - One of the best experts on this subject based on the ideXlab platform.

  • Vapor Phase synthesis of nanoparticles
    Current Opinion in Colloid and Interface Science, 2003
    Co-Authors: Mark T Swihart
    Abstract:

    An overview of methods for preparing nanoparticles in the Vapor Phase is given, and recent advances are reviewed. Developments in instrumentation for monitoring Vapor-Phase synthesis of nanoparticles and in modeling these processes are also included. The most important developments relate to improved control and understanding of nanoparticle aggregation and coalescence during synthesis, and to methods for producing multi-component nanoparticles.