The Experts below are selected from a list of 1776 Experts worldwide ranked by ideXlab platform

Xingcheng Xiao - One of the best experts on this subject based on the ideXlab platform.

  • Reversible dry micro-fibrillar Adhesives with thermally controllable adhesion
    Soft Matter, 2009
    Co-Authors: Metin Sitti, Xingcheng Xiao
    Abstract:

    This work reports thin-film terminated micro-fibrillar Adhesives made of Adhesive Polymers and shape memory Polymers as reversible dry Adhesives with thermally controllable adhesion. Structurally different Adhesives were fabricated by coating a continuous thin layer of an elastomeric Adhesive Polymer onto either a flat or a fibrillar shape memory Polymer surface. Experimental results exhibited that pull-off forces of the Adhesives can be up to four times different depending on thermal conditions. These differences originate from the temperature dependence of either the intrinsic adhesion properties of the Adhesive Polymer and/or the stiffness of the sub-surface shape memory Polymer.

  • Reversible dry micro-fibrillar Adhesives with thermally controllable adhesion
    Soft Matter, 2009
    Co-Authors: Seok Kim, Tao Xie, Metin Sitti, Xingcheng Xiao
    Abstract:

    This work reports thin-film terminated micro-fibrillar Adhesives made of Adhesive Polymers and shape memory Polymers as reversible dry Adhesives with thermally controllable adhesion. Structurally different Adhesives were fabricated by coating a continuous thin layer of an elastomeric Adhesive Polymer onto either a flat or a fibrillar shape memory Polymer surface. Experimental results exhibited that pull-off forces of the Adhesives can be up to four times different depending on thermal conditions. These differences originate from the temperature dependence of either the intrinsic adhesion properties of the Adhesive Polymer and/or the stiffness of the sub-surface shape memory Polymer. © 2009 The Royal Society of Chemistry.

Seok Kim - One of the best experts on this subject based on the ideXlab platform.

  • Reversible dry micro-fibrillar Adhesives with thermally controllable adhesion
    Soft Matter, 2009
    Co-Authors: Seok Kim, Tao Xie, Metin Sitti, Xingcheng Xiao
    Abstract:

    This work reports thin-film terminated micro-fibrillar Adhesives made of Adhesive Polymers and shape memory Polymers as reversible dry Adhesives with thermally controllable adhesion. Structurally different Adhesives were fabricated by coating a continuous thin layer of an elastomeric Adhesive Polymer onto either a flat or a fibrillar shape memory Polymer surface. Experimental results exhibited that pull-off forces of the Adhesives can be up to four times different depending on thermal conditions. These differences originate from the temperature dependence of either the intrinsic adhesion properties of the Adhesive Polymer and/or the stiffness of the sub-surface shape memory Polymer. © 2009 The Royal Society of Chemistry.

Metin Sitti - One of the best experts on this subject based on the ideXlab platform.

  • Reversible dry micro-fibrillar Adhesives with thermally controllable adhesion
    Soft Matter, 2009
    Co-Authors: Metin Sitti, Xingcheng Xiao
    Abstract:

    This work reports thin-film terminated micro-fibrillar Adhesives made of Adhesive Polymers and shape memory Polymers as reversible dry Adhesives with thermally controllable adhesion. Structurally different Adhesives were fabricated by coating a continuous thin layer of an elastomeric Adhesive Polymer onto either a flat or a fibrillar shape memory Polymer surface. Experimental results exhibited that pull-off forces of the Adhesives can be up to four times different depending on thermal conditions. These differences originate from the temperature dependence of either the intrinsic adhesion properties of the Adhesive Polymer and/or the stiffness of the sub-surface shape memory Polymer.

  • Reversible dry micro-fibrillar Adhesives with thermally controllable adhesion
    Soft Matter, 2009
    Co-Authors: Seok Kim, Tao Xie, Metin Sitti, Xingcheng Xiao
    Abstract:

    This work reports thin-film terminated micro-fibrillar Adhesives made of Adhesive Polymers and shape memory Polymers as reversible dry Adhesives with thermally controllable adhesion. Structurally different Adhesives were fabricated by coating a continuous thin layer of an elastomeric Adhesive Polymer onto either a flat or a fibrillar shape memory Polymer surface. Experimental results exhibited that pull-off forces of the Adhesives can be up to four times different depending on thermal conditions. These differences originate from the temperature dependence of either the intrinsic adhesion properties of the Adhesive Polymer and/or the stiffness of the sub-surface shape memory Polymer. © 2009 The Royal Society of Chemistry.

Tao Xie - One of the best experts on this subject based on the ideXlab platform.

  • Reversible dry micro-fibrillar Adhesives with thermally controllable adhesion
    Soft Matter, 2009
    Co-Authors: Seok Kim, Tao Xie, Metin Sitti, Xingcheng Xiao
    Abstract:

    This work reports thin-film terminated micro-fibrillar Adhesives made of Adhesive Polymers and shape memory Polymers as reversible dry Adhesives with thermally controllable adhesion. Structurally different Adhesives were fabricated by coating a continuous thin layer of an elastomeric Adhesive Polymer onto either a flat or a fibrillar shape memory Polymer surface. Experimental results exhibited that pull-off forces of the Adhesives can be up to four times different depending on thermal conditions. These differences originate from the temperature dependence of either the intrinsic adhesion properties of the Adhesive Polymer and/or the stiffness of the sub-surface shape memory Polymer. © 2009 The Royal Society of Chemistry.

Ritesh Ray Chaudhuri - One of the best experts on this subject based on the ideXlab platform.

  • Adhesive Polymer Bonding Method for Integration of III-V Thin-Film Optoelectronic Devices Onto Silicon Substrate
    IEEE Transactions on Components Packaging and Manufacturing Technology, 2018
    Co-Authors: Jing Xiao, Ritesh Ray Chaudhuri
    Abstract:

    This paper demonstrates the integration of thin-film III-V compound semiconductor devices onto silicon-based host substrate using an Adhesive Polymer bonding technique. A thermoplastic Polymer, Polymethyl methacrylate, was employed as the bonding layer due to its low curing temperature and capability to provide uniform contact between bonding surfaces without significant bonding pressures. This enables the proposed integration of ultrathin devices with potential of low-cost, low-temperature, yet simple processing. The III-V semiconductor-based thin-film devices were separately fabricated from their preferred growth substrate utilizing epitaxial lift-off technique. A $2 \times 2$ array of thin-film devices was integrated by the proposed approach. 3-D topology of the integrated devices was studied by optical profilometer. Scanning electron microscope images of the bonding interfaces were discussed to present the uniform contact between thin-film device and bonding layer. Post-processing to the silicon substrate with integrated devices was also investigated to provide insights on layer-by-layer integration for complex and advanced integrated microsystems.

  • Adhesive Polymer Bonding Method for Integration of III-V Thin-Film Optoelectronic Devices Onto Silicon Substrate
    IEEE Transactions on Components Packaging and Manufacturing Technology, 2018
    Co-Authors: Jing Xiao, Ritesh Ray Chaudhuri
    Abstract:

    This paper demonstrates the integration of thin-film III-V compound semiconductor devices onto silicon-based host substrate using an Adhesive Polymer bonding technique. A thermoplastic Polymer, Polymethyl methacrylate, was employed as the bonding layer due to its low curing temperature and capability to provide uniform contact between bonding surfaces without significant bonding pressures. This enables the proposed integration of ultrathin devices with potential of low-cost, low-temperature, yet simple processing. The III-V semiconductor-based thin-film devices were separately fabricated from their preferred growth substrate utilizing epitaxial lift-off technique. A 2×2 array of thin-film devices was integrated by the proposed approach. 3-D topology of the integrated devices was studied by optical profilometer. Scanning electron microscope images of the bonding interfaces were discussed to present the uniform contact between thin-film device and bonding layer. Post-processing to the silicon substrate with integrated devices was also investigated to provide insights on layer-by-layer integration for complex and advanced integrated microsystems.