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Bare Wafer

The Experts below are selected from a list of 237 Experts worldwide ranked by ideXlab platform

Kyihwan Park – 1st expert on this subject based on the ideXlab platform

  • Vibration reduction control of a voice coil motor (VCM)-driven actuator for SPM applications
    The International Journal of Advanced Manufacturing Technology, 2010
    Co-Authors: Jongkyu Jung, Woosub Youm, Kyihwan Park

    Abstract:

    This paper presents vibration reduction control of a voice coil motor (VCM)-driven actuator for SPM applications. We had developed a VCM nanoscanner. The scanner has flexure hinges structure. However, the VCM nanoscanner has some problems of thermal drift and small damping compared to the PZT driven nanoscanner. Especially, the small damping coefficient of the VCM nanoscanner causes mechanical vibration when the control input signal is near to the resonance frequencies of the scanner. Additionally, disturbance to the VCM scanner and electronic noise in the sensor also causes the mechanical vibration when they are near to the resonant frequencies. The mechanical vibration reduces the servo bandwidth as well as the accuracy, which deteriorates the AFM image of the samples. We design input shaping prefilter to reduce the signal applied to the VCM nanoscanner and electronic noise in the sensor whose frequency is close to the resonant frequency of the VCM nanoscanner. We measure the time and frequency response of the VCM scanner without using the prefilter and with using the prefilter. Finally, the topology images of a Bare Wafer are measured and compared using the AFM.

  • Vibration reduction control of a voice coil motor (VCM) nano scanner
    International Journal of Precision Engineering and Manufacturing, 2009
    Co-Authors: Jongkyu Jung, Woosub Youm, Kyihwan Park

    Abstract:

    This paper presents vibration reduction control of a voice coil motor (VCM) nano scanner. We had developed a VCM scanner. The scanner has flexure hinges structure. However, the VCM nano scanner has some problems of thermal drift and small damping compared to the PZT driven nano scanner. Especially, the small damping coefficient of the VCM scanner causes mechanical vibration when the control input signal is near to the resonance frequencies. Additionally, disturbance to the VCM scanner and electronic noise in the sensor also cause the mechanical vibration when they are near to the resonant frequencies. The mechanical vibration reduces the servo bandwidth as well as the accuracy, which deteriorates the AFM image of the samples. We design a pre-filter to reduce the signal applied to the VCM nano scanner and electronic noise in the sensor whose frequency is closed the resonant frequency of the VCM nano scanner. We measure the time and frequency response of the VCM scanner without using the pre-filter and with using the pre-filter. Finally, the topology images of a Bare Wafer are measured and compared using the AFM.

Jongkyu Jung – 2nd expert on this subject based on the ideXlab platform

  • Vibration reduction control of a voice coil motor (VCM)-driven actuator for SPM applications
    The International Journal of Advanced Manufacturing Technology, 2010
    Co-Authors: Jongkyu Jung, Woosub Youm, Kyihwan Park

    Abstract:

    This paper presents vibration reduction control of a voice coil motor (VCM)-driven actuator for SPM applications. We had developed a VCM nanoscanner. The scanner has flexure hinges structure. However, the VCM nanoscanner has some problems of thermal drift and small damping compared to the PZT driven nanoscanner. Especially, the small damping coefficient of the VCM nanoscanner causes mechanical vibration when the control input signal is near to the resonance frequencies of the scanner. Additionally, disturbance to the VCM scanner and electronic noise in the sensor also causes the mechanical vibration when they are near to the resonant frequencies. The mechanical vibration reduces the servo bandwidth as well as the accuracy, which deteriorates the AFM image of the samples. We design input shaping prefilter to reduce the signal applied to the VCM nanoscanner and electronic noise in the sensor whose frequency is close to the resonant frequency of the VCM nanoscanner. We measure the time and frequency response of the VCM scanner without using the prefilter and with using the prefilter. Finally, the topology images of a Bare Wafer are measured and compared using the AFM.

  • Vibration reduction control of a voice coil motor (VCM) nano scanner
    International Journal of Precision Engineering and Manufacturing, 2009
    Co-Authors: Jongkyu Jung, Woosub Youm, Kyihwan Park

    Abstract:

    This paper presents vibration reduction control of a voice coil motor (VCM) nano scanner. We had developed a VCM scanner. The scanner has flexure hinges structure. However, the VCM nano scanner has some problems of thermal drift and small damping compared to the PZT driven nano scanner. Especially, the small damping coefficient of the VCM scanner causes mechanical vibration when the control input signal is near to the resonance frequencies. Additionally, disturbance to the VCM scanner and electronic noise in the sensor also cause the mechanical vibration when they are near to the resonant frequencies. The mechanical vibration reduces the servo bandwidth as well as the accuracy, which deteriorates the AFM image of the samples. We design a pre-filter to reduce the signal applied to the VCM nano scanner and electronic noise in the sensor whose frequency is closed the resonant frequency of the VCM nano scanner. We measure the time and frequency response of the VCM scanner without using the pre-filter and with using the pre-filter. Finally, the topology images of a Bare Wafer are measured and compared using the AFM.

Chang-ki Hong – 3rd expert on this subject based on the ideXlab platform

  • Effect of Slurry pH on Poly Silicon CMP
    , 2011
    Co-Authors: Young-jae Kang, Bong-kyun Kang, Jin-goo Park, Yi-koan Hong, Bo-un Yoon, Chang-ki Hong

    Abstract:

    , its higher reliability than Al gate materials, and its ability to be deposited conformally over steep topography. The shrinkage of devices below 100 nm requires more stringent and new CMP processes including poly silicon CMP. Poly silicon can be polished easily with similar pads and slurries as they are used for the planarization of silicon oxide. In this study, single crystal and poly silicon Wafers were polished as a function of pH in silica based slurry to understand and compare the polishing mechanism of silicon. The static and dynamic etch rates and removal rate were measured as a function of slurry pH (11 ~ 13). The friction force and polishing temperature were also measured at different pHs. The single crystal silicon (Bare silicon) showed higher removal rate than the poly silicon. However, higher friction force was measured on poly silicon Wafer than on Bare Wafer. Keywords: Poly silicon CMP, Single crystal silicon CMP, Etch rate, Removal rate, Friction force

  • Effect of Slurry pH on Poly Silicon CMP
    International Conference on Planarization CMP Technology, 2007
    Co-Authors: Young-jae Kang, Bong-kyun Kang, Jin-goo Park, Yi-koan Hong, Bo-un Yoon, Chang-ki Hong

    Abstract:

    Heavily doped poly silicon films have been widely used as gate electrodes and interconnections in MOS circuits because of its compatibility with subsequent high temperature processing, its excellent interface with thermal SiO2, its higher reliability than Al gate materials, and its ability to be deposited conformally over steep topography. The shrinkage of devices below 100 nm requires more stringent and new CMP processes including poly silicon CMP. Poly silicon can be polished easily with similar pads and slurries as they are used for the planarization of silicon oxide. In this study, single crystal and poly silicon Wafers were polished as a function of pH in silica based slurry to understand and compare the polishing mechanism of silicon. The static and dynamic etch rates and removal rate were measured as a function of slurry pH (11 ~ 13). The friction force and polishing temperature were also measured at different pHs. The single crystal silicon (Bare silicon) showed higher removal rate than the poly silicon. However, higher friction force was measured on poly silicon Wafer than on Bare Wafer.