The Experts below are selected from a list of 3192 Experts worldwide ranked by ideXlab platform
K Mayora - One of the best experts on this subject based on the ideXlab platform.
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a new su 8 process to integrate buried waveguides and sealed microchannels for a lab on a chip
Sensors and Actuators B-chemical, 2006Co-Authors: J M Ruanolopez, Javier Berganzo, M T Arroyo, M Tijero, M Aguirregabiria, Jorge Elizalde, I Aranburu, Francisco J Blanco, K MayoraAbstract:This paper shows a novel use of SU-8, a photodefinable epoxy, to monolithically integrate low cost optical sensors and microfluidic structures. The chip consists of optical connectors, multimode waveguides and sealed microfluidic channels patterned in SU8 on a silicon substrate. We describe in detail an SU-8 microfabrication process consisting of (i) four successive photolithographic steps, (ii) a Bonding process and (iii) a final releasing step. The core of the waveguide is made of standard SU-8, whereas its cladding, with a lower refractive index, is achieved by diluting the SU-8 in a liquid aliphatic resin. Despite the dilution, the SU-8/aliphatic mixture is still patternable by photolithography allowing us to fabricate microchannels. The input and output optical fibres are horizontally aligned to the waveguides by their insertion in U-Grooves, and vertically aligned by the elevation of the waveguide using a lower cladding layer that allows us to lift it up to meet the centre of a standard optical fibre. Microfluidic channels with smooth vertical walls (125 μm height and 30 μm width) have been achieved. Microchannels are sealed by low temperature adhesive Bonding of the SU-8 photopatterned thick-films at a wafer level. Liquid flows in the channels verify good sealing of the microchannels. In order to validate the interaction of these optical-fluidic microcomponents, we carried out an absorption chemical assay. The fabrication procedure described in this article is a fast, reproducible, CMOS compatible and simple way to develop optical Lab-on-a-Chip devices using standard photolithography and Bonding Equipment.
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novel three dimensional embedded su 8 microchannels fabricated using a low temperature full wafer adhesive Bonding
Journal of Micromechanics and Microengineering, 2004Co-Authors: F. Blanco, Javier Berganzo, M T Arroyo, Maria Agirregabiria, M Tijero, Jesus Ruano, I Aramburu, J Garcia, K MayoraAbstract:This paper describes a novel fabrication method for the manufacture of three-dimensional (3D) interconnected microchannels. The fabrication is based on a full wafer polymer Bonding process, using SU-8 polymer epoxy photoresist as a structural material. The technology development includes an improvement of the SU-8 photolithography process in order to produce high uniformity films with good adhesive properties. Hence, 3D embedded microchannels are fabricated by a low temperature adhesive Bonding of the SU-8 photopatterned thick films. The Bonding occurs at temperatures (100–120 °C) lower than those usually applied in Bonding technology. The Bonding process parameters have been chosen in order to achieve a strong and void-free bond. High bond strengths, up to 8 MPa, have been obtained. Several examples using this new technology are shown, including Bonding between different combinations of silicon and Pyrex wafers. This method also allows us to bond wafers with previously surface micromachined structures. Interconnected microchannels with vertical smooth walls and aspect ratios up to five have been obtained. Channels from 40 to 60 µm depth and from 10 to 250 µm width have been achieved. Liquid has been introduced at different levels into the microchannels, verifying good sealing of the 3D interconnected microchannels. The fabrication procedure described in this paper is fast, reproducible, CMOS compatible and easily implementable using standard photolithography and Bonding Equipment.
M Tijero - One of the best experts on this subject based on the ideXlab platform.
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a new su 8 process to integrate buried waveguides and sealed microchannels for a lab on a chip
Sensors and Actuators B-chemical, 2006Co-Authors: J M Ruanolopez, Javier Berganzo, M T Arroyo, M Tijero, M Aguirregabiria, Jorge Elizalde, I Aranburu, Francisco J Blanco, K MayoraAbstract:This paper shows a novel use of SU-8, a photodefinable epoxy, to monolithically integrate low cost optical sensors and microfluidic structures. The chip consists of optical connectors, multimode waveguides and sealed microfluidic channels patterned in SU8 on a silicon substrate. We describe in detail an SU-8 microfabrication process consisting of (i) four successive photolithographic steps, (ii) a Bonding process and (iii) a final releasing step. The core of the waveguide is made of standard SU-8, whereas its cladding, with a lower refractive index, is achieved by diluting the SU-8 in a liquid aliphatic resin. Despite the dilution, the SU-8/aliphatic mixture is still patternable by photolithography allowing us to fabricate microchannels. The input and output optical fibres are horizontally aligned to the waveguides by their insertion in U-Grooves, and vertically aligned by the elevation of the waveguide using a lower cladding layer that allows us to lift it up to meet the centre of a standard optical fibre. Microfluidic channels with smooth vertical walls (125 μm height and 30 μm width) have been achieved. Microchannels are sealed by low temperature adhesive Bonding of the SU-8 photopatterned thick-films at a wafer level. Liquid flows in the channels verify good sealing of the microchannels. In order to validate the interaction of these optical-fluidic microcomponents, we carried out an absorption chemical assay. The fabrication procedure described in this article is a fast, reproducible, CMOS compatible and simple way to develop optical Lab-on-a-Chip devices using standard photolithography and Bonding Equipment.
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novel three dimensional embedded su 8 microchannels fabricated using a low temperature full wafer adhesive Bonding
Journal of Micromechanics and Microengineering, 2004Co-Authors: F. Blanco, Javier Berganzo, M T Arroyo, Maria Agirregabiria, M Tijero, Jesus Ruano, I Aramburu, J Garcia, K MayoraAbstract:This paper describes a novel fabrication method for the manufacture of three-dimensional (3D) interconnected microchannels. The fabrication is based on a full wafer polymer Bonding process, using SU-8 polymer epoxy photoresist as a structural material. The technology development includes an improvement of the SU-8 photolithography process in order to produce high uniformity films with good adhesive properties. Hence, 3D embedded microchannels are fabricated by a low temperature adhesive Bonding of the SU-8 photopatterned thick films. The Bonding occurs at temperatures (100–120 °C) lower than those usually applied in Bonding technology. The Bonding process parameters have been chosen in order to achieve a strong and void-free bond. High bond strengths, up to 8 MPa, have been obtained. Several examples using this new technology are shown, including Bonding between different combinations of silicon and Pyrex wafers. This method also allows us to bond wafers with previously surface micromachined structures. Interconnected microchannels with vertical smooth walls and aspect ratios up to five have been obtained. Channels from 40 to 60 µm depth and from 10 to 250 µm width have been achieved. Liquid has been introduced at different levels into the microchannels, verifying good sealing of the 3D interconnected microchannels. The fabrication procedure described in this paper is fast, reproducible, CMOS compatible and easily implementable using standard photolithography and Bonding Equipment.
Javier Berganzo - One of the best experts on this subject based on the ideXlab platform.
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a new su 8 process to integrate buried waveguides and sealed microchannels for a lab on a chip
Sensors and Actuators B-chemical, 2006Co-Authors: J M Ruanolopez, Javier Berganzo, M T Arroyo, M Tijero, M Aguirregabiria, Jorge Elizalde, I Aranburu, Francisco J Blanco, K MayoraAbstract:This paper shows a novel use of SU-8, a photodefinable epoxy, to monolithically integrate low cost optical sensors and microfluidic structures. The chip consists of optical connectors, multimode waveguides and sealed microfluidic channels patterned in SU8 on a silicon substrate. We describe in detail an SU-8 microfabrication process consisting of (i) four successive photolithographic steps, (ii) a Bonding process and (iii) a final releasing step. The core of the waveguide is made of standard SU-8, whereas its cladding, with a lower refractive index, is achieved by diluting the SU-8 in a liquid aliphatic resin. Despite the dilution, the SU-8/aliphatic mixture is still patternable by photolithography allowing us to fabricate microchannels. The input and output optical fibres are horizontally aligned to the waveguides by their insertion in U-Grooves, and vertically aligned by the elevation of the waveguide using a lower cladding layer that allows us to lift it up to meet the centre of a standard optical fibre. Microfluidic channels with smooth vertical walls (125 μm height and 30 μm width) have been achieved. Microchannels are sealed by low temperature adhesive Bonding of the SU-8 photopatterned thick-films at a wafer level. Liquid flows in the channels verify good sealing of the microchannels. In order to validate the interaction of these optical-fluidic microcomponents, we carried out an absorption chemical assay. The fabrication procedure described in this article is a fast, reproducible, CMOS compatible and simple way to develop optical Lab-on-a-Chip devices using standard photolithography and Bonding Equipment.
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novel three dimensional embedded su 8 microchannels fabricated using a low temperature full wafer adhesive Bonding
Journal of Micromechanics and Microengineering, 2004Co-Authors: F. Blanco, Javier Berganzo, M T Arroyo, Maria Agirregabiria, M Tijero, Jesus Ruano, I Aramburu, J Garcia, K MayoraAbstract:This paper describes a novel fabrication method for the manufacture of three-dimensional (3D) interconnected microchannels. The fabrication is based on a full wafer polymer Bonding process, using SU-8 polymer epoxy photoresist as a structural material. The technology development includes an improvement of the SU-8 photolithography process in order to produce high uniformity films with good adhesive properties. Hence, 3D embedded microchannels are fabricated by a low temperature adhesive Bonding of the SU-8 photopatterned thick films. The Bonding occurs at temperatures (100–120 °C) lower than those usually applied in Bonding technology. The Bonding process parameters have been chosen in order to achieve a strong and void-free bond. High bond strengths, up to 8 MPa, have been obtained. Several examples using this new technology are shown, including Bonding between different combinations of silicon and Pyrex wafers. This method also allows us to bond wafers with previously surface micromachined structures. Interconnected microchannels with vertical smooth walls and aspect ratios up to five have been obtained. Channels from 40 to 60 µm depth and from 10 to 250 µm width have been achieved. Liquid has been introduced at different levels into the microchannels, verifying good sealing of the 3D interconnected microchannels. The fabrication procedure described in this paper is fast, reproducible, CMOS compatible and easily implementable using standard photolithography and Bonding Equipment.
M T Arroyo - One of the best experts on this subject based on the ideXlab platform.
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a new su 8 process to integrate buried waveguides and sealed microchannels for a lab on a chip
Sensors and Actuators B-chemical, 2006Co-Authors: J M Ruanolopez, Javier Berganzo, M T Arroyo, M Tijero, M Aguirregabiria, Jorge Elizalde, I Aranburu, Francisco J Blanco, K MayoraAbstract:This paper shows a novel use of SU-8, a photodefinable epoxy, to monolithically integrate low cost optical sensors and microfluidic structures. The chip consists of optical connectors, multimode waveguides and sealed microfluidic channels patterned in SU8 on a silicon substrate. We describe in detail an SU-8 microfabrication process consisting of (i) four successive photolithographic steps, (ii) a Bonding process and (iii) a final releasing step. The core of the waveguide is made of standard SU-8, whereas its cladding, with a lower refractive index, is achieved by diluting the SU-8 in a liquid aliphatic resin. Despite the dilution, the SU-8/aliphatic mixture is still patternable by photolithography allowing us to fabricate microchannels. The input and output optical fibres are horizontally aligned to the waveguides by their insertion in U-Grooves, and vertically aligned by the elevation of the waveguide using a lower cladding layer that allows us to lift it up to meet the centre of a standard optical fibre. Microfluidic channels with smooth vertical walls (125 μm height and 30 μm width) have been achieved. Microchannels are sealed by low temperature adhesive Bonding of the SU-8 photopatterned thick-films at a wafer level. Liquid flows in the channels verify good sealing of the microchannels. In order to validate the interaction of these optical-fluidic microcomponents, we carried out an absorption chemical assay. The fabrication procedure described in this article is a fast, reproducible, CMOS compatible and simple way to develop optical Lab-on-a-Chip devices using standard photolithography and Bonding Equipment.
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novel three dimensional embedded su 8 microchannels fabricated using a low temperature full wafer adhesive Bonding
Journal of Micromechanics and Microengineering, 2004Co-Authors: F. Blanco, Javier Berganzo, M T Arroyo, Maria Agirregabiria, M Tijero, Jesus Ruano, I Aramburu, J Garcia, K MayoraAbstract:This paper describes a novel fabrication method for the manufacture of three-dimensional (3D) interconnected microchannels. The fabrication is based on a full wafer polymer Bonding process, using SU-8 polymer epoxy photoresist as a structural material. The technology development includes an improvement of the SU-8 photolithography process in order to produce high uniformity films with good adhesive properties. Hence, 3D embedded microchannels are fabricated by a low temperature adhesive Bonding of the SU-8 photopatterned thick films. The Bonding occurs at temperatures (100–120 °C) lower than those usually applied in Bonding technology. The Bonding process parameters have been chosen in order to achieve a strong and void-free bond. High bond strengths, up to 8 MPa, have been obtained. Several examples using this new technology are shown, including Bonding between different combinations of silicon and Pyrex wafers. This method also allows us to bond wafers with previously surface micromachined structures. Interconnected microchannels with vertical smooth walls and aspect ratios up to five have been obtained. Channels from 40 to 60 µm depth and from 10 to 250 µm width have been achieved. Liquid has been introduced at different levels into the microchannels, verifying good sealing of the 3D interconnected microchannels. The fabrication procedure described in this paper is fast, reproducible, CMOS compatible and easily implementable using standard photolithography and Bonding Equipment.
J M Ruanolopez - One of the best experts on this subject based on the ideXlab platform.
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a new su 8 process to integrate buried waveguides and sealed microchannels for a lab on a chip
Sensors and Actuators B-chemical, 2006Co-Authors: J M Ruanolopez, Javier Berganzo, M T Arroyo, M Tijero, M Aguirregabiria, Jorge Elizalde, I Aranburu, Francisco J Blanco, K MayoraAbstract:This paper shows a novel use of SU-8, a photodefinable epoxy, to monolithically integrate low cost optical sensors and microfluidic structures. The chip consists of optical connectors, multimode waveguides and sealed microfluidic channels patterned in SU8 on a silicon substrate. We describe in detail an SU-8 microfabrication process consisting of (i) four successive photolithographic steps, (ii) a Bonding process and (iii) a final releasing step. The core of the waveguide is made of standard SU-8, whereas its cladding, with a lower refractive index, is achieved by diluting the SU-8 in a liquid aliphatic resin. Despite the dilution, the SU-8/aliphatic mixture is still patternable by photolithography allowing us to fabricate microchannels. The input and output optical fibres are horizontally aligned to the waveguides by their insertion in U-Grooves, and vertically aligned by the elevation of the waveguide using a lower cladding layer that allows us to lift it up to meet the centre of a standard optical fibre. Microfluidic channels with smooth vertical walls (125 μm height and 30 μm width) have been achieved. Microchannels are sealed by low temperature adhesive Bonding of the SU-8 photopatterned thick-films at a wafer level. Liquid flows in the channels verify good sealing of the microchannels. In order to validate the interaction of these optical-fluidic microcomponents, we carried out an absorption chemical assay. The fabrication procedure described in this article is a fast, reproducible, CMOS compatible and simple way to develop optical Lab-on-a-Chip devices using standard photolithography and Bonding Equipment.