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Soon Hyung Hong - One of the best experts on this subject based on the ideXlab platform.

  • Microstructure and Bonding Mechanism of Al/Ti bonded joint using Al–10Si–1Mg filler metal
    Materials Science and Engineering A-structural Materials Properties Microstructure and Processing, 2003
    Co-Authors: Woong H. Sohn, Ha H. Bong, Soon Hyung Hong
    Abstract:

    Abstract The microstructures and liquid state diffusion Bonding Mechanism of cp-Ti to 1050 Al using an Al–10.0wt.%Si–1.0wt.%Mg filler metal with 100 μm in thickness have been investigated at 620 °C under 1×10−4 Torr. The effects of Bonding process parameters on microstructure of bonded joint have been analyzed by using an optical microscope, AES, scanning electron microscopy and EDS. The interfacial bond strength of Al/Ti bonded joints was measured by the single lap shear test. The results show that the Bonding at the interface between Al and filler metal proceeds by wetting the Al with molten filler metal, and followed by removal of oxide layer on surface of Al. The interface between Al and filler metal moved during the isothermal solidification of filler metal by the diffusion of Si from filler metal into Al layer. The interface between Al and filler metal became curved in shape with increasing Bonding time due to capillary force at grain boundaries. The Bonding at the interface between Ti and filler metal proceeds by the formation of two different intermetallic compound layers, identified as Al5Si12Ti7 and Al12Si3Ti5, followed by the growth of the intermetallic compound layers. The interfacial bond strength at Al/Ti joint increased with increasing Bonding time up to 25 min at 620 °C. However, the interfacial bond strength of Al/Ti joint decreased after Bonding time of 25 min at 620 °C due to formation of cavities in Al near Al/intermetallic interfaces.

  • microstructure and Bonding Mechanism of al ti bonded joint using al 10si 1mg filler metal
    Materials Science and Engineering A-structural Materials Properties Microstructure and Processing, 2003
    Co-Authors: Woong H. Sohn, Ha H. Bong, Soon Hyung Hong
    Abstract:

    Abstract The microstructures and liquid state diffusion Bonding Mechanism of cp-Ti to 1050 Al using an Al–10.0wt.%Si–1.0wt.%Mg filler metal with 100 μm in thickness have been investigated at 620 °C under 1×10−4 Torr. The effects of Bonding process parameters on microstructure of bonded joint have been analyzed by using an optical microscope, AES, scanning electron microscopy and EDS. The interfacial bond strength of Al/Ti bonded joints was measured by the single lap shear test. The results show that the Bonding at the interface between Al and filler metal proceeds by wetting the Al with molten filler metal, and followed by removal of oxide layer on surface of Al. The interface between Al and filler metal moved during the isothermal solidification of filler metal by the diffusion of Si from filler metal into Al layer. The interface between Al and filler metal became curved in shape with increasing Bonding time due to capillary force at grain boundaries. The Bonding at the interface between Ti and filler metal proceeds by the formation of two different intermetallic compound layers, identified as Al5Si12Ti7 and Al12Si3Ti5, followed by the growth of the intermetallic compound layers. The interfacial bond strength at Al/Ti joint increased with increasing Bonding time up to 25 min at 620 °C. However, the interfacial bond strength of Al/Ti joint decreased after Bonding time of 25 min at 620 °C due to formation of cavities in Al near Al/intermetallic interfaces.

  • Microstructure and Bonding Mechanism of Al/Ti bonded joint using
    2003
    Co-Authors: Woong H. Sohn, Ha H. Bong, Soon Hyung Hong
    Abstract:

    The microstructures and liquid state diffusion Bonding Mechanism of cp-Ti to 1050 Al using an Al � /10.0wt.%Si � /1.0wt.%Mg filler metal with 100 mm in thickness have been investigated at 620 8C under 1 � /10 � 4 Torr. The effects of Bonding process parameters on microstructure of bonded joint have been analyzed by using an optical microscope, AES, scanning electron microscopy and EDS. The interfacial bond strength of Al/Ti bonded joints was measured by the single lap shear test. The results show that the Bonding at the interface between Al and filler metal proceeds by wetting the Al with molten filler metal, and followed by removal of oxide layer on surface of Al. The interface between Al and filler metal moved during the isothermal solidification of filler metal by the diffusion of Si from filler metal into Al layer. The interface between Al and filler metal became curved in shape with increasing Bonding time due to capillary force at grain boundaries. The Bonding at the interface between Ti and filler metal proceeds by the formation of two different intermetallic compound layers, identified as Al5Si12Ti7 and Al12Si3Ti5, followed by the growth of the intermetallic compound layers. The interfacial bond strength at Al/Ti joint increased with increasing Bonding time up to 25 min at 620 8C. However, the interfacial bond strength of Al/Ti joint decreased after Bonding time of 25 min at 620 8C due to formation of cavities in Al near Al/intermetallic interfaces. # 2003 Elsevier Science B.V. All rights reserved.

Rocco Lupoi - One of the best experts on this subject based on the ideXlab platform.

  • new insights into the coating substrate interfacial Bonding Mechanism in cold spray
    Scripta Materialia, 2016
    Co-Authors: Yingchun Xie, Shuo Yin, Chaoyue Chen, Marie-pierre Planche, Hanlin Liao, Rocco Lupoi
    Abstract:

    Abstract A new theory was proposed to explain the interfacial Bonding Mechanism of hard Ni coating onto soft Al substrate. The experimental results indicate that the metal-to-metal contact and the consequent metallurgical Bonding at the coating/substrate interface were absent in the single particle depositing but could be achieved in the full coating deposition. Based on this, it is proposed that the particle peening effect breaks the cracked oxides that remained at the coating/substrate interface into nano-pieces and promotes further deformation of materials. Thus, the pores caused by the bridge-like oxides at the interface are filled and the discontinuous metal-to-metal contact is achieved.

  • New insights into the coating/substrate interfacial Bonding Mechanism in cold spray
    Scripta Materialia, 2016
    Co-Authors: Yingchun Xie, Shuo Yin, Chaoyue Chen, Marie-pierre Planche, Hanlin Liao, Rocco Lupoi
    Abstract:

    Abstract A new theory was proposed to explain the interfacial Bonding Mechanism of hard Ni coating onto soft Al substrate. The experimental results indicate that the metal-to-metal contact and the consequent metallurgical Bonding at the coating/substrate interface were absent in the single particle depositing but could be achieved in the full coating deposition. Based on this, it is proposed that the particle peening effect breaks the cracked oxides that remained at the coating/substrate interface into nano-pieces and promotes further deformation of materials. Thus, the pores caused by the bridge-like oxides at the interface are filled and the discontinuous metal-to-metal contact is achieved.

Tadashi Kokubo - One of the best experts on this subject based on the ideXlab platform.

  • bone Bonding Mechanism of β tricalcium phosphate
    Journal of Biomedical Materials Research, 1991
    Co-Authors: Seiya Kotani, Yoshitsugu Fujita, Toshiaki Kitsugi, Takashi Nakamura, T. Yamamuro, Chikara Ohtsuki, Tadashi Kokubo
    Abstract:

    It has been proposed that the formation of a surface apatite layer in vivo on surface active ceramics is an essential condition for chemical Bonding between ceramics and bone tissue. To clarify the difference in bone-Bonding Mechanisms between surface active ceramics and bioresorbable ceramics, two experiments were performed using plates of dense β-tricalcium phosphate (β-TCP). First, plates of β-TCP were implanted subcutaneously in rats for 8 weeks. Surface change due to bioresorption was observed with scanning electron microscopy. Formation of the apatite layer on the surface was investigated using thin-film x-ray diffraction and Fourier transform infrared reflection spectroscopy. Second, plates of β-TCP were implanted in tibiae of rabbits for 8 and 25 weeks and subjected to the detaching test to measure bone-Bonding strength. β-TCP bonded strongly to bone. Undecalcified sections of the interface of bone and β-TCP were examined with SEM-EPMA. However, by physicochemical methods, no formation of surface apatite layer was observed. These results suggest that β-TCP bonds to bone through microanchoring between bone and rough surface of resorbed β-TCP.

  • Bone Bonding Mechanism of β‐tricalcium phosphate
    Journal of biomedical materials research, 1991
    Co-Authors: Seiya Kotani, Yoshitsugu Fujita, Toshiaki Kitsugi, Takashi Nakamura, T. Yamamuro, Chikara Ohtsuki, Tadashi Kokubo
    Abstract:

    It has been proposed that the formation of a surface apatite layer in vivo on surface active ceramics is an essential condition for chemical Bonding between ceramics and bone tissue. To clarify the difference in bone-Bonding Mechanisms between surface active ceramics and bioresorbable ceramics, two experiments were performed using plates of dense β-tricalcium phosphate (β-TCP). First, plates of β-TCP were implanted subcutaneously in rats for 8 weeks. Surface change due to bioresorption was observed with scanning electron microscopy. Formation of the apatite layer on the surface was investigated using thin-film x-ray diffraction and Fourier transform infrared reflection spectroscopy. Second, plates of β-TCP were implanted in tibiae of rabbits for 8 and 25 weeks and subjected to the detaching test to measure bone-Bonding strength. β-TCP bonded strongly to bone. Undecalcified sections of the interface of bone and β-TCP were examined with SEM-EPMA. However, by physicochemical methods, no formation of surface apatite layer was observed. These results suggest that β-TCP bonds to bone through microanchoring between bone and rough surface of resorbed β-TCP.

Woong H. Sohn - One of the best experts on this subject based on the ideXlab platform.

  • Microstructure and Bonding Mechanism of Al/Ti bonded joint using Al–10Si–1Mg filler metal
    Materials Science and Engineering A-structural Materials Properties Microstructure and Processing, 2003
    Co-Authors: Woong H. Sohn, Ha H. Bong, Soon Hyung Hong
    Abstract:

    Abstract The microstructures and liquid state diffusion Bonding Mechanism of cp-Ti to 1050 Al using an Al–10.0wt.%Si–1.0wt.%Mg filler metal with 100 μm in thickness have been investigated at 620 °C under 1×10−4 Torr. The effects of Bonding process parameters on microstructure of bonded joint have been analyzed by using an optical microscope, AES, scanning electron microscopy and EDS. The interfacial bond strength of Al/Ti bonded joints was measured by the single lap shear test. The results show that the Bonding at the interface between Al and filler metal proceeds by wetting the Al with molten filler metal, and followed by removal of oxide layer on surface of Al. The interface between Al and filler metal moved during the isothermal solidification of filler metal by the diffusion of Si from filler metal into Al layer. The interface between Al and filler metal became curved in shape with increasing Bonding time due to capillary force at grain boundaries. The Bonding at the interface between Ti and filler metal proceeds by the formation of two different intermetallic compound layers, identified as Al5Si12Ti7 and Al12Si3Ti5, followed by the growth of the intermetallic compound layers. The interfacial bond strength at Al/Ti joint increased with increasing Bonding time up to 25 min at 620 °C. However, the interfacial bond strength of Al/Ti joint decreased after Bonding time of 25 min at 620 °C due to formation of cavities in Al near Al/intermetallic interfaces.

  • microstructure and Bonding Mechanism of al ti bonded joint using al 10si 1mg filler metal
    Materials Science and Engineering A-structural Materials Properties Microstructure and Processing, 2003
    Co-Authors: Woong H. Sohn, Ha H. Bong, Soon Hyung Hong
    Abstract:

    Abstract The microstructures and liquid state diffusion Bonding Mechanism of cp-Ti to 1050 Al using an Al–10.0wt.%Si–1.0wt.%Mg filler metal with 100 μm in thickness have been investigated at 620 °C under 1×10−4 Torr. The effects of Bonding process parameters on microstructure of bonded joint have been analyzed by using an optical microscope, AES, scanning electron microscopy and EDS. The interfacial bond strength of Al/Ti bonded joints was measured by the single lap shear test. The results show that the Bonding at the interface between Al and filler metal proceeds by wetting the Al with molten filler metal, and followed by removal of oxide layer on surface of Al. The interface between Al and filler metal moved during the isothermal solidification of filler metal by the diffusion of Si from filler metal into Al layer. The interface between Al and filler metal became curved in shape with increasing Bonding time due to capillary force at grain boundaries. The Bonding at the interface between Ti and filler metal proceeds by the formation of two different intermetallic compound layers, identified as Al5Si12Ti7 and Al12Si3Ti5, followed by the growth of the intermetallic compound layers. The interfacial bond strength at Al/Ti joint increased with increasing Bonding time up to 25 min at 620 °C. However, the interfacial bond strength of Al/Ti joint decreased after Bonding time of 25 min at 620 °C due to formation of cavities in Al near Al/intermetallic interfaces.

  • Microstructure and Bonding Mechanism of Al/Ti bonded joint using
    2003
    Co-Authors: Woong H. Sohn, Ha H. Bong, Soon Hyung Hong
    Abstract:

    The microstructures and liquid state diffusion Bonding Mechanism of cp-Ti to 1050 Al using an Al � /10.0wt.%Si � /1.0wt.%Mg filler metal with 100 mm in thickness have been investigated at 620 8C under 1 � /10 � 4 Torr. The effects of Bonding process parameters on microstructure of bonded joint have been analyzed by using an optical microscope, AES, scanning electron microscopy and EDS. The interfacial bond strength of Al/Ti bonded joints was measured by the single lap shear test. The results show that the Bonding at the interface between Al and filler metal proceeds by wetting the Al with molten filler metal, and followed by removal of oxide layer on surface of Al. The interface between Al and filler metal moved during the isothermal solidification of filler metal by the diffusion of Si from filler metal into Al layer. The interface between Al and filler metal became curved in shape with increasing Bonding time due to capillary force at grain boundaries. The Bonding at the interface between Ti and filler metal proceeds by the formation of two different intermetallic compound layers, identified as Al5Si12Ti7 and Al12Si3Ti5, followed by the growth of the intermetallic compound layers. The interfacial bond strength at Al/Ti joint increased with increasing Bonding time up to 25 min at 620 8C. However, the interfacial bond strength of Al/Ti joint decreased after Bonding time of 25 min at 620 8C due to formation of cavities in Al near Al/intermetallic interfaces. # 2003 Elsevier Science B.V. All rights reserved.

Yingchun Xie - One of the best experts on this subject based on the ideXlab platform.

  • new insights into the coating substrate interfacial Bonding Mechanism in cold spray
    Scripta Materialia, 2016
    Co-Authors: Yingchun Xie, Shuo Yin, Chaoyue Chen, Marie-pierre Planche, Hanlin Liao, Rocco Lupoi
    Abstract:

    Abstract A new theory was proposed to explain the interfacial Bonding Mechanism of hard Ni coating onto soft Al substrate. The experimental results indicate that the metal-to-metal contact and the consequent metallurgical Bonding at the coating/substrate interface were absent in the single particle depositing but could be achieved in the full coating deposition. Based on this, it is proposed that the particle peening effect breaks the cracked oxides that remained at the coating/substrate interface into nano-pieces and promotes further deformation of materials. Thus, the pores caused by the bridge-like oxides at the interface are filled and the discontinuous metal-to-metal contact is achieved.

  • New insights into the coating/substrate interfacial Bonding Mechanism in cold spray
    Scripta Materialia, 2016
    Co-Authors: Yingchun Xie, Shuo Yin, Chaoyue Chen, Marie-pierre Planche, Hanlin Liao, Rocco Lupoi
    Abstract:

    Abstract A new theory was proposed to explain the interfacial Bonding Mechanism of hard Ni coating onto soft Al substrate. The experimental results indicate that the metal-to-metal contact and the consequent metallurgical Bonding at the coating/substrate interface were absent in the single particle depositing but could be achieved in the full coating deposition. Based on this, it is proposed that the particle peening effect breaks the cracked oxides that remained at the coating/substrate interface into nano-pieces and promotes further deformation of materials. Thus, the pores caused by the bridge-like oxides at the interface are filled and the discontinuous metal-to-metal contact is achieved.