The Experts below are selected from a list of 65751 Experts worldwide ranked by ideXlab platform
Qing Wang - One of the best experts on this subject based on the ideXlab platform.
-
a study on transient liquid phase diffusion Bonding of ti 22al 25nb alloy
Materials Science and Engineering A-structural Materials Properties Microstructure and Processing, 2009Co-Authors: Aiping Wu, Qing WangAbstract:Abstract Transient liquid phase diffusion Bonding of Ti–22Al–25Nb (at.%) alloy with Ti–15Cu–15Ni (wt.%) was performed. The factors influencing the microstructure and strength of the joints were studied. A suitably long holding time and high Bonding Temperature would benefit the formation of joints with homogeneous compositions and high strength. Nb element is the mainly controlling one to the formation of composition-homogenous Bonding zone. The Bonding zone of joint with a rapid cooling technology after dwelling at Bonding Temperature is composed of B2 phase. Slow cooling technology is beneficial to improving the joint strength. The tensile strength at room Temperature of the joint under the joining conditions of Bonding Temperature 970 °C for 90 min with a slow cooling technology reaches up to 1018 MPa, which is equal to 93% of base material tensile strength, obviously higher than the joint strength of 931 MPa with a rapid cooling technology.
Aiping Wu - One of the best experts on this subject based on the ideXlab platform.
-
a study on transient liquid phase diffusion Bonding of ti 22al 25nb alloy
Materials Science and Engineering A-structural Materials Properties Microstructure and Processing, 2009Co-Authors: Aiping Wu, Qing WangAbstract:Abstract Transient liquid phase diffusion Bonding of Ti–22Al–25Nb (at.%) alloy with Ti–15Cu–15Ni (wt.%) was performed. The factors influencing the microstructure and strength of the joints were studied. A suitably long holding time and high Bonding Temperature would benefit the formation of joints with homogeneous compositions and high strength. Nb element is the mainly controlling one to the formation of composition-homogenous Bonding zone. The Bonding zone of joint with a rapid cooling technology after dwelling at Bonding Temperature is composed of B2 phase. Slow cooling technology is beneficial to improving the joint strength. The tensile strength at room Temperature of the joint under the joining conditions of Bonding Temperature 970 °C for 90 min with a slow cooling technology reaches up to 1018 MPa, which is equal to 93% of base material tensile strength, obviously higher than the joint strength of 931 MPa with a rapid cooling technology.
Alireza Allafchian - One of the best experts on this subject based on the ideXlab platform.
-
effect of Bonding Temperature on the microstructure and mechanical properties of ti 6al 4v to aisi 304 transient liquid phase bonded joint
Materials & Design, 2016Co-Authors: Ehsan Norouzi, M Atapour, M Shamanian, Alireza AllafchianAbstract:Abstract Transient liquid phase (TLP) Bonding process was performed to join Ti–6Al–4V and AISI 304 austenitic stainless steel using a copper interlayer. The effect of the Bonding Temperature on the microstructure and mechanical properties was studied in the range of 870–960 °C. Microstructural characterization was carried out through optical microscopy, scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS). The results showed that the rate of isothermal solidification was increased by increasing the Bonding Temperature. In addition, when the Bonding Temperature was increased to 960 °C, the width of the eutectic and intermetallic zones was completely removed, leading to complete isothermal solidification. According to the results, a minimum hardness value of 216 VHN was measured in the joint zones and the highest shear strength was 374 MPa, as obtained for the sample joined at 960 °C. The fracture analysis showed different fracture morphologies for different Bonding Temperatures.
K-n Chen - One of the best experts on this subject based on the ideXlab platform.
-
Bonding Temperature optimization and property evolution of SU-8 material in metal/adhesive hybrid wafer Bonding.
Journal of Nanoscience and Nanotechnology, 2011Co-Authors: K-n Chen, Chia-yao Cheng, W. C. HuangAbstract:Bonding Temperature optimization of SU-8 material for metal/adhesive hybrid Bonding was investigated. The good bond quality of SU-8 adhesive can be achieved with the Bonding Temperature between 150 degrees C and 250 degrees C, while bond failures of SU-8 wafers are observed starting from 275 degrees C. IR transmittance spectra measurements indicate the crosslinks inside SU-8 break and further bond failure is observed due to the large decomposition of epoxy rings and phenyl in plane bending above 275 degrees C. This research provides guidelines of material selection and Bonding parameters for heterogeneous integration, 3DIC and MEMS applications using metal/adhesive hybrid Bonding.
-
Investigation of Bonding Temperature for SU-8 materials in wafer-level hybrid Bonding technology for 3D IC
The 4th IEEE International NanoElectronics Conference, 2011Co-Authors: C.-a. Cheng, C. T. Ko, K-n ChenAbstract:Significant research has been performed in developing wafer-level metal/adhesive hybrid Bonding technology by investigating Bonding Temperature optimization of SU-8 materials. The SU-8 wafers experience Bonding failure when Bonding Temperature exceeds 275°C. As a result of the significant decomposition of epoxy rings and phenyl in plane bending above 275°C, Fourier Transform IR (FTIR) spectra measurements demonstrate that crosslinking inside SU-8 breaks and results in failed bonds. This research presents an evaluation of Bonding quality and properties of SU-8 materials, which will assist the development of three dimension (3D) integration applications.
-
Investigations of strength of copper-bonded wafers with several quantitative and qualitative tests
Journal of Electronic Materials, 2006Co-Authors: K-n Chen, S. M. Chang, L. C. Shen, Rafael ReifAbstract:The strengths of Cu-bonded wafers with respect to different Bonding Temperatures and Bonding durations by quantitative and qualitative approaches were reviewed and investigated. These investigations include the mechanical dicing test, the tape test, the pull test, and the push test. For all test results, the strength of Cu-bonded wafers increases with increases in Bonding duration or Bonding Temperature. Thermal anneal after Bonding improved the Bonding strength only at the high Bonding Temperature and not at the low Temperature.
Ehsan Norouzi - One of the best experts on this subject based on the ideXlab platform.
-
effect of Bonding Temperature on the microstructure and mechanical properties of ti 6al 4v to aisi 304 transient liquid phase bonded joint
Materials & Design, 2016Co-Authors: Ehsan Norouzi, M Atapour, M Shamanian, Alireza AllafchianAbstract:Abstract Transient liquid phase (TLP) Bonding process was performed to join Ti–6Al–4V and AISI 304 austenitic stainless steel using a copper interlayer. The effect of the Bonding Temperature on the microstructure and mechanical properties was studied in the range of 870–960 °C. Microstructural characterization was carried out through optical microscopy, scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS). The results showed that the rate of isothermal solidification was increased by increasing the Bonding Temperature. In addition, when the Bonding Temperature was increased to 960 °C, the width of the eutectic and intermetallic zones was completely removed, leading to complete isothermal solidification. According to the results, a minimum hardness value of 216 VHN was measured in the joint zones and the highest shear strength was 374 MPa, as obtained for the sample joined at 960 °C. The fracture analysis showed different fracture morphologies for different Bonding Temperatures.