The Experts below are selected from a list of 13641 Experts worldwide ranked by ideXlab platform
Reiko Shimokawa - One of the best experts on this subject based on the ideXlab platform.
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Optical confinement in thin-film crystalline silicon solar cells by adhesive bonding of Ceramic Substrate
IEEE Electron Device Letters, 2000Co-Authors: Hedetaka Takato, Reiko ShimokawaAbstract:Thin film (5-μm-thick) silicon solar cells by adhesive bonding of a near-Lambertian Al2O3 Ceramic Substrate have been fabricated, and the electrical and optical performance of the cells have been investigated. This cell structure shows a good optical confinement effect. From quantum efficiency measurements, it is found that a short circuit current that is as high as that of water-based cells can be obtained by reducing the surface reflectance. Cell and module fabrication processes can be simplified using this technique.
Hedetaka Takato - One of the best experts on this subject based on the ideXlab platform.
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Optical confinement in thin-film crystalline silicon solar cells by adhesive bonding of Ceramic Substrate
IEEE Electron Device Letters, 2000Co-Authors: Hedetaka Takato, Reiko ShimokawaAbstract:Thin film (5-μm-thick) silicon solar cells by adhesive bonding of a near-Lambertian Al2O3 Ceramic Substrate have been fabricated, and the electrical and optical performance of the cells have been investigated. This cell structure shows a good optical confinement effect. From quantum efficiency measurements, it is found that a short circuit current that is as high as that of water-based cells can be obtained by reducing the surface reflectance. Cell and module fabrication processes can be simplified using this technique.
Mingxiang Chen - One of the best experts on this subject based on the ideXlab platform.
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Low-Temperature Fabrication of Three-Dimensional Ceramic Substrate by Molding Inorganic Aluminosilicate Paste
Journal of Electronic Packaging, 2019Co-Authors: Hao Cheng, Yang Peng, Mingxiang ChenAbstract:In this work, an easy and low-temperature fabrication method of three-dimensional (3D) Ceramic Substrate was proposed. A 3DPC Ceramic Substrate was fabricated by molding alkali-activated aluminosilicate cement (AAAC) to form up a dam (cavity) on direct plated copper (DPC) Ceramic Substrate at low temperature. The effects of viscosity and curing temperature of cement paste on the properties of the 3DPC were investigated. The prepared 3DPC Ceramic Substrate achieved precise dimensions and structure, especially the manufacturing accuracy error was less than 2.5%. By optimizing process parameters, the shear strength between dam and DPC Substrate reached up to 9.5 MPa. Moreover, thermal cycle and heat resistance tests confirmed that 3DPC exhibits excellent thermal reliability. All experimental results demonstrated that 3DPC Ceramic Substrate could satisfy with three dimension packaging and integration.
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White LEDs With High Optical Consistency Packaged Using 3D Ceramic Substrate
IEEE Photonics Technology Letters, 2019Co-Authors: Hao Cheng, Yang Peng, Mingxiang ChenAbstract:Packaging efficiency and optical performances are important indexes for white light-emitting diodes (WLEDs) packaging. In this letter, wafer-level WLEDs packaging were presented by printing phosphor on three-dimensional (3D) Ceramic Substrate to improve packaging efficiency and optical consistency. The 3D Ceramic Substrate was prepared by repeatedly electroplating copper cups on the planar direct plated copper (DPC) Ceramic Substrate. The phosphor concentration was adjusted to realize natural white light. The fabrication errors of the 3D Ceramic Substrate and the optical performances of WLED modules were analyzed to evaluate the optical consistency of the WLED modules packaged by using 3D Ceramic Substrate. Consequently, the fabrication errors of 3D Ceramic Substrate are less than 1%. When the phosphor concentration was set at 12.5 wt%, the packaged LEDs achieve a natural white light with luminous efficiency (LE) of 94.55 lm/W, correlated color temperature (CCT) of 5915 K, and chromaticity coordinate of (0.3166, 0.3345). The WLED modules exhibit small standard deviations in LE (1%), color rendering index (1%), correlated color temperature (98 K), and high reliability. The results indicate that the WLEDs packaged using 3D Ceramic Substrate have excellent optical consistency.
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Three-dimensional Ceramic Substrate prepared by repeated lithography and electroforming
2019 20th International Conference on Electronic Packaging Technology(ICEPT), 2019Co-Authors: Zi Zhou Yang, Hao Cheng, Yang Peng, Mingxiang ChenAbstract:In this work, three dimensional direct plated copper (3DPC) Ceramic Substrate prepared by repeated ultraviolet (UV) depth lithography and electroforming is proposed. The effects of different electroforming parameters including current density, stirring speed, and temperature were evaluated by internal stress and electroforming rate using a L9(34) orthogonal experiment. Range analysis and analysis of variance (ANOVA) were employed to estimate the contribution of each factor to the overall response. The optimal electrodeposition parameters were the current density of 4 ASD, the stirring speed of 1200 rpm, and the temperature of 50°C. Furthermore, the microstructure, hermeticity, and thermal reliability of 3DPC Substrate were researched. The results showed the 3DPC Substrate had excellent hermeticity and the strong bonding strength between dam and flat DPC Substrate even after 30 thermal cycles. The above results demonstrated that 3DPC Substrate could be considered as a reliable Substrate for UV-LED hermetic packaging.
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Low Temperature Fabrication of Three-Dimensional Ceramic Substrate by Using Inorganic Alkali Activated Aluminosilicate Cement Paste for UV-LED Packaging
ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, 2018Co-Authors: Hao Cheng, Yang Peng, Zi Zhou Yang, Mingxiang ChenAbstract:In this work, a low temperature method is proposed for the economical fabrication of three-dimensional (3D) Ceramic Substrate for Ultraviolet Light-Emitting Diodes (UV-LED) packaging. The 3D Ceramic Substrate using the inorganic alkali activated aluminosilicate cement paste (IAAACP) is molded by sacrificing the patterned wax mold. By controlling the viscosity, milling time, and curing temperature the of the IAAACP, the high strength 3D Ceramic Substrate is achieved, the corresponding shear strength reaches to 12.5MPa. After thermal shock and heat resistant test, the shear strength changed slightly, indicating the 3D Ceramic Substrate has excellent thermal reliability. These experimental results indicate that the prepared 3D Ceramic Substrate has a potential application for UV-LED packaging.
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A novel copper-coated Ceramic Substrate prepared by nano thermocompression bonding
2017 18th International Conference on Electronic Packaging Technology (ICEPT), 2017Co-Authors: Yang Peng, Hao Cheng, Mingxiang ChenAbstract:In this paper, we propose a feasible and prospective method to prepare copper-coated Ceramic Substrate by using nano thermo-compression bonding technology. Nanoporous copper (NPC) can be prepared by dealloying of Cu-Zn alloy system in L-tartaric acid solution. By controlling the concentration of L-tartaric acid solution and dealloying temperature, NPC presents good homogeneity and open bi-continuous interpenetrating ligament-channel microstructures with the average ligament size of 20 nm. In addition, copper-coated Ceramic Substrates using NPC are successfully prepared under the bonding pressure of 20MPa for 50min at 350°C in the N2 atmosphere resulted in excellent bonding qualities without voids in the bonding layer, the tensile strength reaches 9.2MPa. These testing results confirms that the copper-coated Ceramic Substrate prepared by nano thermocompression bonding is a feasible and promising technology.
Hao Cheng - One of the best experts on this subject based on the ideXlab platform.
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Low-Temperature Fabrication of Three-Dimensional Ceramic Substrate by Molding Inorganic Aluminosilicate Paste
Journal of Electronic Packaging, 2019Co-Authors: Hao Cheng, Yang Peng, Mingxiang ChenAbstract:In this work, an easy and low-temperature fabrication method of three-dimensional (3D) Ceramic Substrate was proposed. A 3DPC Ceramic Substrate was fabricated by molding alkali-activated aluminosilicate cement (AAAC) to form up a dam (cavity) on direct plated copper (DPC) Ceramic Substrate at low temperature. The effects of viscosity and curing temperature of cement paste on the properties of the 3DPC were investigated. The prepared 3DPC Ceramic Substrate achieved precise dimensions and structure, especially the manufacturing accuracy error was less than 2.5%. By optimizing process parameters, the shear strength between dam and DPC Substrate reached up to 9.5 MPa. Moreover, thermal cycle and heat resistance tests confirmed that 3DPC exhibits excellent thermal reliability. All experimental results demonstrated that 3DPC Ceramic Substrate could satisfy with three dimension packaging and integration.
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White LEDs With High Optical Consistency Packaged Using 3D Ceramic Substrate
IEEE Photonics Technology Letters, 2019Co-Authors: Hao Cheng, Yang Peng, Mingxiang ChenAbstract:Packaging efficiency and optical performances are important indexes for white light-emitting diodes (WLEDs) packaging. In this letter, wafer-level WLEDs packaging were presented by printing phosphor on three-dimensional (3D) Ceramic Substrate to improve packaging efficiency and optical consistency. The 3D Ceramic Substrate was prepared by repeatedly electroplating copper cups on the planar direct plated copper (DPC) Ceramic Substrate. The phosphor concentration was adjusted to realize natural white light. The fabrication errors of the 3D Ceramic Substrate and the optical performances of WLED modules were analyzed to evaluate the optical consistency of the WLED modules packaged by using 3D Ceramic Substrate. Consequently, the fabrication errors of 3D Ceramic Substrate are less than 1%. When the phosphor concentration was set at 12.5 wt%, the packaged LEDs achieve a natural white light with luminous efficiency (LE) of 94.55 lm/W, correlated color temperature (CCT) of 5915 K, and chromaticity coordinate of (0.3166, 0.3345). The WLED modules exhibit small standard deviations in LE (1%), color rendering index (1%), correlated color temperature (98 K), and high reliability. The results indicate that the WLEDs packaged using 3D Ceramic Substrate have excellent optical consistency.
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Three-dimensional Ceramic Substrate prepared by repeated lithography and electroforming
2019 20th International Conference on Electronic Packaging Technology(ICEPT), 2019Co-Authors: Zi Zhou Yang, Hao Cheng, Yang Peng, Mingxiang ChenAbstract:In this work, three dimensional direct plated copper (3DPC) Ceramic Substrate prepared by repeated ultraviolet (UV) depth lithography and electroforming is proposed. The effects of different electroforming parameters including current density, stirring speed, and temperature were evaluated by internal stress and electroforming rate using a L9(34) orthogonal experiment. Range analysis and analysis of variance (ANOVA) were employed to estimate the contribution of each factor to the overall response. The optimal electrodeposition parameters were the current density of 4 ASD, the stirring speed of 1200 rpm, and the temperature of 50°C. Furthermore, the microstructure, hermeticity, and thermal reliability of 3DPC Substrate were researched. The results showed the 3DPC Substrate had excellent hermeticity and the strong bonding strength between dam and flat DPC Substrate even after 30 thermal cycles. The above results demonstrated that 3DPC Substrate could be considered as a reliable Substrate for UV-LED hermetic packaging.
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Low Temperature Fabrication of Three-Dimensional Ceramic Substrate by Using Inorganic Alkali Activated Aluminosilicate Cement Paste for UV-LED Packaging
ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, 2018Co-Authors: Hao Cheng, Yang Peng, Zi Zhou Yang, Mingxiang ChenAbstract:In this work, a low temperature method is proposed for the economical fabrication of three-dimensional (3D) Ceramic Substrate for Ultraviolet Light-Emitting Diodes (UV-LED) packaging. The 3D Ceramic Substrate using the inorganic alkali activated aluminosilicate cement paste (IAAACP) is molded by sacrificing the patterned wax mold. By controlling the viscosity, milling time, and curing temperature the of the IAAACP, the high strength 3D Ceramic Substrate is achieved, the corresponding shear strength reaches to 12.5MPa. After thermal shock and heat resistant test, the shear strength changed slightly, indicating the 3D Ceramic Substrate has excellent thermal reliability. These experimental results indicate that the prepared 3D Ceramic Substrate has a potential application for UV-LED packaging.
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A novel copper-coated Ceramic Substrate prepared by nano thermocompression bonding
2017 18th International Conference on Electronic Packaging Technology (ICEPT), 2017Co-Authors: Yang Peng, Hao Cheng, Mingxiang ChenAbstract:In this paper, we propose a feasible and prospective method to prepare copper-coated Ceramic Substrate by using nano thermo-compression bonding technology. Nanoporous copper (NPC) can be prepared by dealloying of Cu-Zn alloy system in L-tartaric acid solution. By controlling the concentration of L-tartaric acid solution and dealloying temperature, NPC presents good homogeneity and open bi-continuous interpenetrating ligament-channel microstructures with the average ligament size of 20 nm. In addition, copper-coated Ceramic Substrates using NPC are successfully prepared under the bonding pressure of 20MPa for 50min at 350°C in the N2 atmosphere resulted in excellent bonding qualities without voids in the bonding layer, the tensile strength reaches 9.2MPa. These testing results confirms that the copper-coated Ceramic Substrate prepared by nano thermocompression bonding is a feasible and promising technology.
Yang Peng - One of the best experts on this subject based on the ideXlab platform.
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Low-Temperature Fabrication of Three-Dimensional Ceramic Substrate by Molding Inorganic Aluminosilicate Paste
Journal of Electronic Packaging, 2019Co-Authors: Hao Cheng, Yang Peng, Mingxiang ChenAbstract:In this work, an easy and low-temperature fabrication method of three-dimensional (3D) Ceramic Substrate was proposed. A 3DPC Ceramic Substrate was fabricated by molding alkali-activated aluminosilicate cement (AAAC) to form up a dam (cavity) on direct plated copper (DPC) Ceramic Substrate at low temperature. The effects of viscosity and curing temperature of cement paste on the properties of the 3DPC were investigated. The prepared 3DPC Ceramic Substrate achieved precise dimensions and structure, especially the manufacturing accuracy error was less than 2.5%. By optimizing process parameters, the shear strength between dam and DPC Substrate reached up to 9.5 MPa. Moreover, thermal cycle and heat resistance tests confirmed that 3DPC exhibits excellent thermal reliability. All experimental results demonstrated that 3DPC Ceramic Substrate could satisfy with three dimension packaging and integration.
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White LEDs With High Optical Consistency Packaged Using 3D Ceramic Substrate
IEEE Photonics Technology Letters, 2019Co-Authors: Hao Cheng, Yang Peng, Mingxiang ChenAbstract:Packaging efficiency and optical performances are important indexes for white light-emitting diodes (WLEDs) packaging. In this letter, wafer-level WLEDs packaging were presented by printing phosphor on three-dimensional (3D) Ceramic Substrate to improve packaging efficiency and optical consistency. The 3D Ceramic Substrate was prepared by repeatedly electroplating copper cups on the planar direct plated copper (DPC) Ceramic Substrate. The phosphor concentration was adjusted to realize natural white light. The fabrication errors of the 3D Ceramic Substrate and the optical performances of WLED modules were analyzed to evaluate the optical consistency of the WLED modules packaged by using 3D Ceramic Substrate. Consequently, the fabrication errors of 3D Ceramic Substrate are less than 1%. When the phosphor concentration was set at 12.5 wt%, the packaged LEDs achieve a natural white light with luminous efficiency (LE) of 94.55 lm/W, correlated color temperature (CCT) of 5915 K, and chromaticity coordinate of (0.3166, 0.3345). The WLED modules exhibit small standard deviations in LE (1%), color rendering index (1%), correlated color temperature (98 K), and high reliability. The results indicate that the WLEDs packaged using 3D Ceramic Substrate have excellent optical consistency.
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Three-dimensional Ceramic Substrate prepared by repeated lithography and electroforming
2019 20th International Conference on Electronic Packaging Technology(ICEPT), 2019Co-Authors: Zi Zhou Yang, Hao Cheng, Yang Peng, Mingxiang ChenAbstract:In this work, three dimensional direct plated copper (3DPC) Ceramic Substrate prepared by repeated ultraviolet (UV) depth lithography and electroforming is proposed. The effects of different electroforming parameters including current density, stirring speed, and temperature were evaluated by internal stress and electroforming rate using a L9(34) orthogonal experiment. Range analysis and analysis of variance (ANOVA) were employed to estimate the contribution of each factor to the overall response. The optimal electrodeposition parameters were the current density of 4 ASD, the stirring speed of 1200 rpm, and the temperature of 50°C. Furthermore, the microstructure, hermeticity, and thermal reliability of 3DPC Substrate were researched. The results showed the 3DPC Substrate had excellent hermeticity and the strong bonding strength between dam and flat DPC Substrate even after 30 thermal cycles. The above results demonstrated that 3DPC Substrate could be considered as a reliable Substrate for UV-LED hermetic packaging.
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Low Temperature Fabrication of Three-Dimensional Ceramic Substrate by Using Inorganic Alkali Activated Aluminosilicate Cement Paste for UV-LED Packaging
ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, 2018Co-Authors: Hao Cheng, Yang Peng, Zi Zhou Yang, Mingxiang ChenAbstract:In this work, a low temperature method is proposed for the economical fabrication of three-dimensional (3D) Ceramic Substrate for Ultraviolet Light-Emitting Diodes (UV-LED) packaging. The 3D Ceramic Substrate using the inorganic alkali activated aluminosilicate cement paste (IAAACP) is molded by sacrificing the patterned wax mold. By controlling the viscosity, milling time, and curing temperature the of the IAAACP, the high strength 3D Ceramic Substrate is achieved, the corresponding shear strength reaches to 12.5MPa. After thermal shock and heat resistant test, the shear strength changed slightly, indicating the 3D Ceramic Substrate has excellent thermal reliability. These experimental results indicate that the prepared 3D Ceramic Substrate has a potential application for UV-LED packaging.
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A novel copper-coated Ceramic Substrate prepared by nano thermocompression bonding
2017 18th International Conference on Electronic Packaging Technology (ICEPT), 2017Co-Authors: Yang Peng, Hao Cheng, Mingxiang ChenAbstract:In this paper, we propose a feasible and prospective method to prepare copper-coated Ceramic Substrate by using nano thermo-compression bonding technology. Nanoporous copper (NPC) can be prepared by dealloying of Cu-Zn alloy system in L-tartaric acid solution. By controlling the concentration of L-tartaric acid solution and dealloying temperature, NPC presents good homogeneity and open bi-continuous interpenetrating ligament-channel microstructures with the average ligament size of 20 nm. In addition, copper-coated Ceramic Substrates using NPC are successfully prepared under the bonding pressure of 20MPa for 50min at 350°C in the N2 atmosphere resulted in excellent bonding qualities without voids in the bonding layer, the tensile strength reaches 9.2MPa. These testing results confirms that the copper-coated Ceramic Substrate prepared by nano thermocompression bonding is a feasible and promising technology.
