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Chaosheng Yu - One of the best experts on this subject based on the ideXlab platform.
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research of silver plating nano graphite filled Conductive Adhesive
Synthetic Metals, 2009Co-Authors: Wei Lin, Xiangrong Xi, Chaosheng YuAbstract:Abstract In this paper, silver plating nano-graphite (Ag plating nano-G) was developed by electroless plating method using nano-graphite prepared from expanded graphite. The silver plating nano-graphite filled Conductive Adhesive prepared was composed of 66 wt% of epoxy resin E-51, 20 wt% of Ag plating nano-graphite as Conductive filler, 9 wt% of triethanolamine as curing agent and 5 wt% of other additives. It took 180 min for the Adhesive to be cured completely at 120 °C. The electrically Conductive Adhesives exhibited two percolation threshold values which were 7 wt% and 17 wt%, respectively. The electrical resistivity of the Conductive Adhesive decreased to 1.50 × 10−3 Ω cm and the tensile lap strength remained at a high level (about 13.2 MPa) when the content of the Conductive filler was 20 wt%. TGA indicated that the Conductive Adhesive exhibited good thermal stability.
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research of silver plating nano graphite filled Conductive Adhesive
Synthetic Metals, 2009Co-Authors: Wei Lin, Xiangrong Xi, Chaosheng YuAbstract:Abstract In this paper, silver plating nano-graphite (Ag plating nano-G) was developed by electroless plating method using nano-graphite prepared from expanded graphite. The silver plating nano-graphite filled Conductive Adhesive prepared was composed of 66 wt% of epoxy resin E-51, 20 wt% of Ag plating nano-graphite as Conductive filler, 9 wt% of triethanolamine as curing agent and 5 wt% of other additives. It took 180 min for the Adhesive to be cured completely at 120 °C. The electrically Conductive Adhesives exhibited two percolation threshold values which were 7 wt% and 17 wt%, respectively. The electrical resistivity of the Conductive Adhesive decreased to 1.50 × 10−3 Ω cm and the tensile lap strength remained at a high level (about 13.2 MPa) when the content of the Conductive filler was 20 wt%. TGA indicated that the Conductive Adhesive exhibited good thermal stability.
Wei Lin - One of the best experts on this subject based on the ideXlab platform.
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research of silver plating nano graphite filled Conductive Adhesive
Synthetic Metals, 2009Co-Authors: Wei Lin, Xiangrong Xi, Chaosheng YuAbstract:Abstract In this paper, silver plating nano-graphite (Ag plating nano-G) was developed by electroless plating method using nano-graphite prepared from expanded graphite. The silver plating nano-graphite filled Conductive Adhesive prepared was composed of 66 wt% of epoxy resin E-51, 20 wt% of Ag plating nano-graphite as Conductive filler, 9 wt% of triethanolamine as curing agent and 5 wt% of other additives. It took 180 min for the Adhesive to be cured completely at 120 °C. The electrically Conductive Adhesives exhibited two percolation threshold values which were 7 wt% and 17 wt%, respectively. The electrical resistivity of the Conductive Adhesive decreased to 1.50 × 10−3 Ω cm and the tensile lap strength remained at a high level (about 13.2 MPa) when the content of the Conductive filler was 20 wt%. TGA indicated that the Conductive Adhesive exhibited good thermal stability.
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research of silver plating nano graphite filled Conductive Adhesive
Synthetic Metals, 2009Co-Authors: Wei Lin, Xiangrong Xi, Chaosheng YuAbstract:Abstract In this paper, silver plating nano-graphite (Ag plating nano-G) was developed by electroless plating method using nano-graphite prepared from expanded graphite. The silver plating nano-graphite filled Conductive Adhesive prepared was composed of 66 wt% of epoxy resin E-51, 20 wt% of Ag plating nano-graphite as Conductive filler, 9 wt% of triethanolamine as curing agent and 5 wt% of other additives. It took 180 min for the Adhesive to be cured completely at 120 °C. The electrically Conductive Adhesives exhibited two percolation threshold values which were 7 wt% and 17 wt%, respectively. The electrical resistivity of the Conductive Adhesive decreased to 1.50 × 10−3 Ω cm and the tensile lap strength remained at a high level (about 13.2 MPa) when the content of the Conductive filler was 20 wt%. TGA indicated that the Conductive Adhesive exhibited good thermal stability.
Xiangrong Xi - One of the best experts on this subject based on the ideXlab platform.
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research of silver plating nano graphite filled Conductive Adhesive
Synthetic Metals, 2009Co-Authors: Wei Lin, Xiangrong Xi, Chaosheng YuAbstract:Abstract In this paper, silver plating nano-graphite (Ag plating nano-G) was developed by electroless plating method using nano-graphite prepared from expanded graphite. The silver plating nano-graphite filled Conductive Adhesive prepared was composed of 66 wt% of epoxy resin E-51, 20 wt% of Ag plating nano-graphite as Conductive filler, 9 wt% of triethanolamine as curing agent and 5 wt% of other additives. It took 180 min for the Adhesive to be cured completely at 120 °C. The electrically Conductive Adhesives exhibited two percolation threshold values which were 7 wt% and 17 wt%, respectively. The electrical resistivity of the Conductive Adhesive decreased to 1.50 × 10−3 Ω cm and the tensile lap strength remained at a high level (about 13.2 MPa) when the content of the Conductive filler was 20 wt%. TGA indicated that the Conductive Adhesive exhibited good thermal stability.
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research of silver plating nano graphite filled Conductive Adhesive
Synthetic Metals, 2009Co-Authors: Wei Lin, Xiangrong Xi, Chaosheng YuAbstract:Abstract In this paper, silver plating nano-graphite (Ag plating nano-G) was developed by electroless plating method using nano-graphite prepared from expanded graphite. The silver plating nano-graphite filled Conductive Adhesive prepared was composed of 66 wt% of epoxy resin E-51, 20 wt% of Ag plating nano-graphite as Conductive filler, 9 wt% of triethanolamine as curing agent and 5 wt% of other additives. It took 180 min for the Adhesive to be cured completely at 120 °C. The electrically Conductive Adhesives exhibited two percolation threshold values which were 7 wt% and 17 wt%, respectively. The electrical resistivity of the Conductive Adhesive decreased to 1.50 × 10−3 Ω cm and the tensile lap strength remained at a high level (about 13.2 MPa) when the content of the Conductive filler was 20 wt%. TGA indicated that the Conductive Adhesive exhibited good thermal stability.
Guochen Duan - One of the best experts on this subject based on the ideXlab platform.
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electrically Conductive Adhesive based on acrylate resin filled with silver plating graphite nanosheet
Synthetic Metals, 2011Co-Authors: Yi Zhang, Shuhua Qi, Xinming Wu, Guochen DuanAbstract:Abstract Silver plating graphite nanosheet (Ag plating NanoG) is an effective approach to obtain the Conductive filler with high electrical conductivity and moderate cost. Ag plating NanoG was prepared by electroless plating method using graphite nanosheet (NanoG) from expanded graphite (EG). Then a novel electrically Conductive Adhesive (ECA), comprising acrylate resin and Ag plating NanoG as Conductive filler, was studied. The microstructures of Ag plating NanoG and ECA were studied by means of scanning electron microscopy (SEM), X-ray diffraction (XRD) and Fourier transmission infrared (FT-IR), transmission electron microscope (TEM). The results showed that the Ag plating NanoG was successfully developed and it was homogeneously dispersed in the acrylate resin. The electrical conductivity of the ECA increased to 2.60 × 10 −2 S/cm and the 180° peel strength and shear strength remained at a high level when the content of the Conductive filler was 40 wt%. From the thermogravimetric analysis, the ECA exhibited good thermal stability.
Katsuaki Suganuma - One of the best experts on this subject based on the ideXlab platform.
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electrical resistance and microstructural changes of silver epoxy isotropic Conductive Adhesive joints under high humidity and heat
Journal of Electronic Materials, 2011Co-Authors: Katsuaki Suganuma, Hirokazu TanakaAbstract:In this study, the degradation mechanism of chip resistors mounted with Ag–epoxy isotropic Conductive Adhesive (ICA) under two different environmental conditions, i.e., humidity exposure (85°C/85% relative humidity) and thermal cycling (TC, –40°C to 125°C), was examined by monitoring the change in electrical resistance and by transmission electron microscopy. The effect of the terminal finishes (Sn/Ni or Au/Ni) of the chip components on joint stability during those two tests was also examined. The electrical resistance of the Sn/Ni-plated chip component joined with Ag–epoxy ICA during both environmental tests increased with exposure time. On the other hand, the electrical resistance of the Au/Ni-plated chip component joined with Ag–epoxy ICA remained unchanged during both tests. In the case of the Sn/Ni-plated chip joint, Sn oxides such as SnO, SnO2, and Sn-Cl-O were formed inhomogeneously on the surface of the Sn plating during the humidity exposure test. Under the TC test, microcracks were also observed at the Sn/epoxy and the Ag filler/epoxy interfaces. A Ni3Sn intermetallic compound (IMC) was formed at the interface between Sn and Ni, and the Ni3Sn4 IMC was also formed at the Sn surface. In contrast, no oxide was found in the Au/Ni-plated chip joint during the humidity exposure test. Also, no IMC was found in that joint during the TC test. It is suggested that oxides, microcracks, and IMCs cause the electrical degradation of Sn/Ni-plated chip components joined with Ag–epoxy ICA.
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temperature dependence of electrical and thermal conductivities of an epoxy based isotropic Conductive Adhesive
Journal of Electronic Materials, 2008Co-Authors: Masahiro Inoue, Hiroaki Muta, Takuji Maekawa, Shinsuke Yamanaka, Katsuaki SuganumaAbstract:The temperature dependence of the transport properties, including electrical and thermal conductivities, of a practical isotropic Conductive Adhesive (ICA) including an epoxy-based binder was investigated in order to comprehensively evaluate the physical changes induced during exposure to elevated temperatures. The ICA specimens were cured and post-annealed under various conditions in order to clarify the effect of curing state of the Adhesive binder on the electrical resistivity. The electrical resistivity at ambient temperature tends to decrease with increasing curing temperature, even if the samples exhibit full conversion. In addition, an annealing effect, resulting in a deviation from a linear relationship in the temperature dependence of resistivity, can be induced during the heating process experienced during resistivity measurements. However, the ICA specimens exhibited similar values for the temperature coefficient of resistivity (TCR), regardless of the curing and post-annealing conditions in the temperature range where the annealing effect is rarely induced, although the thermal history of the specimens significantly influences the absolute values of electrical resistivity. The temperature dependence of the thermal conductivity is almost accounted for by the decrease in the contribution of conducting electrons in the temperature range below the glass-transition temperature, T g.
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degradation mechanism of ag epoxy Conductive Adhesive sn pb plating interface by heat exposure
Journal of Electronic Materials, 2002Co-Authors: Munenori Yamashita, Katsuaki SuganumaAbstract:The compatibility between Ag fillers and Sn-Pb plating at elevated temperature was examined by mechanical test, electrical test, and microstructure observation. The degradation at 150°C is caused by the preferential diffusion of Sn from the plating layer into Ag in the Conductive Adhesive. By this diffusion, Ag-Sn intermetallic compounds formed in the Ag fillers adjacent to the plating layer, and many large Kirkendall voids are formed in the Sn-Pb plating layer. Furthermore, an interfacial debonding occurred between the Conductive Adhesive, and the Sn-Pb plating layer is also observed near the free surface after heat exposure.
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Degradation mechanism of ag-epoxy Conductive Adhesive/Sn-Pb plating interface by heat exposure
Journal of Electronic Materials, 2002Co-Authors: Munenori Yamashita, Katsuaki SuganumaAbstract:The compatibility between Ag fillers and Sn-Pb plating at elevated temperature was examined by mechanical test, electrical test, and microstructure observation. The degradation at 150°C is caused by the preferential diffusion of Sn from the plating layer into Ag in the Conductive Adhesive. By this diffusion, Ag-Sn intermetallic compounds formed in the Ag fillers adjacent to the plating layer, and many large Kirkendall voids are formed in the Sn-Pb plating layer. Furthermore, an interfacial debonding occurred between the Conductive Adhesive, and the Sn-Pb plating layer is also observed near the free surface after heat exposure.