The Experts below are selected from a list of 12 Experts worldwide ranked by ideXlab platform
Melvin A. - One of the best experts on this subject based on the ideXlab platform.
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Gasket Assembly for Sealing Mating Surfaces
2003Co-Authors: Melvin A.Abstract:A pair of substantially opposed mating surfaces are joined to each other and sealed in place by means of an electrically-Conductive member which is placed in proximity to the mating surfaces. The electrically-Conductive member has at least one element secured thereto which is positioned to contact the mating surfaces, and which softens when the electrically-Conductive member is heated by passing an electric current therethrough. The softened element conforms to the mating surfaces, and upon cooling of the softened element the mating surfaces are joined together in an effective seal. Of particular significance is an embodiment of the electrically-Conductive member which is a Gasket having an electrically-Conductive Gasket base and a pair of the elements secured to opposite sides of the Gasket base. This embodiment is positioned between the opposed mating surfaces to be joined to each other. Also significant is an embodiment of the electrically-Conductive member which is an electrically-Conductive sleeve having an element secured to its inner surface. This embodiment surrounds cylindrical members the bases of which are the substantially opposed mating surfaces to be joined, and the element on the inner surface of the sleeve contacts the outer surfaces of the cylindrical members
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Gasket Assembly for Sealing Mating Surfaces
2000Co-Authors: Melvin A.Abstract:A Gasket assembly for securing a pair of surface together wherein an electrically Conductive Gasket base having a central opening is provided with a pair of layers secured to opposite sides of the Gasket base, with the layers being a fusible alloy, a brazing alloy or a synthetic, thermoplastic material which will melt, without degrading, when the Gasket base is heated. The surfaces may be secured to each other by a plurality of bolts to squeeze the Gasket assembly there between or by some other clamping means. An electrical current is passed through the Gasket base to heat it to a temperature sufficient to melt the layers to seal the surfaces to opposite sides of the Gasket base
Zhang Xiaotian - One of the best experts on this subject based on the ideXlab platform.
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a semiconductor device package using discrete Conductive layer to re select bonding line path
2012Co-Authors: Lu Jun-an, Anhe Bale, Wang Xiaobin, Zhang Ailun, Hu Mansheng, Zhang XiaotianAbstract:The invention discloses a semiconductor device package that uses discrete Conductive layer to re-select bonding line path, which comprises a lead frame, wherein the lead frame comprises a chip bonding pad and a plurality of pins that coupled to the first chip bonding pad; a vertical semiconductor device is bonded to the chip bonding pad; the vertical semiconductor device is provided with a Conductive Gasket; the Conductive Gasket is connected with a pin through the first bonding line; an electricity isolated Conductive wire is formed on a Conductive material layer of the first semiconductor device; the Conductive wire provides a Conductive path between the first bonding line and the second bonding line; or, the Conductive path is set under the third bonding line to conduct, so as to avoidintercross between the third bonding line and other bonding lines, or the Conductive path makes length of the first and the second bonding line shorter than the maximum preset length.
Lu Jun-an - One of the best experts on this subject based on the ideXlab platform.
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a semiconductor device package using discrete Conductive layer to re select bonding line path
2012Co-Authors: Lu Jun-an, Anhe Bale, Wang Xiaobin, Zhang Ailun, Hu Mansheng, Zhang XiaotianAbstract:The invention discloses a semiconductor device package that uses discrete Conductive layer to re-select bonding line path, which comprises a lead frame, wherein the lead frame comprises a chip bonding pad and a plurality of pins that coupled to the first chip bonding pad; a vertical semiconductor device is bonded to the chip bonding pad; the vertical semiconductor device is provided with a Conductive Gasket; the Conductive Gasket is connected with a pin through the first bonding line; an electricity isolated Conductive wire is formed on a Conductive material layer of the first semiconductor device; the Conductive wire provides a Conductive path between the first bonding line and the second bonding line; or, the Conductive path is set under the third bonding line to conduct, so as to avoidintercross between the third bonding line and other bonding lines, or the Conductive path makes length of the first and the second bonding line shorter than the maximum preset length.
Anhe Bale - One of the best experts on this subject based on the ideXlab platform.
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a semiconductor device package using discrete Conductive layer to re select bonding line path
2012Co-Authors: Lu Jun-an, Anhe Bale, Wang Xiaobin, Zhang Ailun, Hu Mansheng, Zhang XiaotianAbstract:The invention discloses a semiconductor device package that uses discrete Conductive layer to re-select bonding line path, which comprises a lead frame, wherein the lead frame comprises a chip bonding pad and a plurality of pins that coupled to the first chip bonding pad; a vertical semiconductor device is bonded to the chip bonding pad; the vertical semiconductor device is provided with a Conductive Gasket; the Conductive Gasket is connected with a pin through the first bonding line; an electricity isolated Conductive wire is formed on a Conductive material layer of the first semiconductor device; the Conductive wire provides a Conductive path between the first bonding line and the second bonding line; or, the Conductive path is set under the third bonding line to conduct, so as to avoidintercross between the third bonding line and other bonding lines, or the Conductive path makes length of the first and the second bonding line shorter than the maximum preset length.
Wang Xiaobin - One of the best experts on this subject based on the ideXlab platform.
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a semiconductor device package using discrete Conductive layer to re select bonding line path
2012Co-Authors: Lu Jun-an, Anhe Bale, Wang Xiaobin, Zhang Ailun, Hu Mansheng, Zhang XiaotianAbstract:The invention discloses a semiconductor device package that uses discrete Conductive layer to re-select bonding line path, which comprises a lead frame, wherein the lead frame comprises a chip bonding pad and a plurality of pins that coupled to the first chip bonding pad; a vertical semiconductor device is bonded to the chip bonding pad; the vertical semiconductor device is provided with a Conductive Gasket; the Conductive Gasket is connected with a pin through the first bonding line; an electricity isolated Conductive wire is formed on a Conductive material layer of the first semiconductor device; the Conductive wire provides a Conductive path between the first bonding line and the second bonding line; or, the Conductive path is set under the third bonding line to conduct, so as to avoidintercross between the third bonding line and other bonding lines, or the Conductive path makes length of the first and the second bonding line shorter than the maximum preset length.