The Experts below are selected from a list of 2394 Experts worldwide ranked by ideXlab platform

Katsuaki Suganuma - One of the best experts on this subject based on the ideXlab platform.

  • Sn–Ag–Cu Soldering Reliability as Influenced by Process Atmosphere
    IEEE Transactions on Electronics Packaging Manufacturing, 2010
    Co-Authors: Alongheng Baated, Katsuaki Suganuma, Junxiang Jiang, Sharon Huang, Benjamin Jurcik, Shigeyoshi Nozawa, Minoru Ueshima
    Abstract:

    To develop an optimal surface mount reflow soldering process with Sn-Ag-Cu, the influences of atmosphere and Cooling Speed on soldering reliability have been examined by using Sn plated chip components and of Pd plated small outline packages (SOPs) on a printed circuit board (PCB). Typical three Sn-Ag-Cu alloy pastes, i.e., Sn-3.0wt%Ag-0.5wt%Cu, Sn-3.8wt%Ag-0.75wt%Cu, and Sn-4.0wt%Ag-0.9wt%Cu, were used for reflow soldering in air or N2 atmospheres. In the case of chip component joints, the solder compositions, Cooling Speed, and atmospheres during reflow treatment slightly affect the dendritic microstructure of the solder fillets. In contrast, these parameters rarely affect the solder wettability both on boards/components and shear strengths of the solder joints. In the case of the SOP joints, however, the atmospheres in reflow treatment and the fluxes strongly affect the appearances of solder fillet surfaces structure. Despite the types of solder fluxes, N2 process atmosphere obviously improved wettability of the solders on the lead-frames of the SOP. Moreover, the scatter in shear strengths becomes smaller and the wetting of solders on the lead-frames becomes stabler in N2 atmosphere than in air atmosphere.

  • Sn-Ag-Cu Soldering Reliability Influenced by Process Atmosphere
    2007 International Symposium on High Density packaging and Microsystem Integration, 2007
    Co-Authors: Alongheng Baated, Katsuaki Suganuma, Junxiang Jiang, Sharon Huang, Benjamin Jurcik, Shigeyoshi Nozawa, Minoru Ueshima
    Abstract:

    To develop an optimal soldering process of Sn-Ag-Cu soldered joints, the influences of atmosphere and Cooling Speed during reflow treatment on soldering reliability have been examined through the use of Sn plated chip components and of Pd plated small outline packages (SOPs) on a printed circuit board (PCB) soldered with Sn-3wt.%Ag-0.5wt.%Cu, Sn-3.8wt.%Ag-0.75wt.%Cu and Sn-4wt.%Ag-0.9wt.%Cu solder pastes under air or N2 atmospheres. In the case of chip component joints, the solder compositions, Cooling Speed and atmospheres during reflow treatment slightly affect the dendritic microstructure. Those parameters rarely affect the wetting behavior and mechanical properties. In the case of SOP joints, however, the atmospheres during reflow treatment and fluxes strongly affect the appearances of fillet surfaces structure. Despite the types of solder fluxes, N2 process atmosphere obviously improved wettability of solder on lead-frame of the SOP.

  • effects of Cooling Speed on microstructure and tensile properties of sn ag cu alloys
    Materials Science and Engineering A-structural Materials Properties Microstructure and Processing, 2002
    Co-Authors: K S Kim, S H Huh, Katsuaki Suganuma
    Abstract:

    Abstract The microstructures and tensile properties of three typical Sn–Ag–Cu alloys, Sn–3.0wt.%Ag–0.5wt.%Cu, Sn–3.5wt.%Ag–0.7wt.%Cu and Sn–3.9wt.%Ag–0.6wt.%Cu, prepared under three different Cooling conditions were evaluated after casting. The microstructures of all rapidly cooled specimens consisted of the eutectic phase of β-Sn with fine fibrous Ag3Sn dispersion surrounding primary β-Sn grains. The slowly cooled Sn–3.5Ag–0.7Cu and Sn–3.9Ag–0.6Cu alloys exhibited additional large primary Ag3Sn platelets, while the Sn–3.0Ag–0.5Cu did not. For all alloys, both ultimate tensile strength and 0.2% proof stress increased with increasing strain-rates in tensile tests. Lowering Cooling Speed decreased tensile strength. Elongation increased with an increasing strain rate from 10−5 to 10−2 s−1, and decreased slightly at 10−1 s−1 for the rapidly cooled specimens. Elongation remarkably decreased for the slowly cooled Sn–3.5Ag–0.7Cu and Sn–3.9Ag–0.6Cu alloys, a degradation attributable to the formation of large primary Ag3Sn platelets.

Gerardo G. Naumis - One of the best experts on this subject based on the ideXlab platform.

  • Minimal Cooling Speed for glass transition in a simple solvable energy landscape model
    Physica A-statistical Mechanics and Its Applications, 2016
    Co-Authors: J. Quetzalcóatl Toledo-marín, Isaac Pérez Castillo, Gerardo G. Naumis
    Abstract:

    The minimal Cooling Speed required to form a glass is obtained for a simple solvable energy landscape model. The model, made from a two-level system modified to include the topology of the energy landscape, is able to capture either a glass transition or a crystallization depending on the Cooling rate. In this setup, the minimal Cooling Speed to achieve glass formation is then found to be related with the crystallization relaxation time, energy barrier and with the thermal history. In particular, we obtain that the thermal history encodes small fluctuations around the equilibrium population which are exponentially amplified near the glass transition, which mathematically corresponds to the boundary layer of the master equation. The change in the glass transition temperature is also found as a function of the Cooling rate. Finally, to verify our analytical results, a kinetic Monte Carlo simulation was implemented.

  • Minimal Cooling Speed for glass transition in a simple solvable energy landscape model
    arXiv: Soft Condensed Matter, 2015
    Co-Authors: J. Quetzalcóatl Toledo-marín, Isaac Pérez Castillo, Gerardo G. Naumis
    Abstract:

    The minimal Cooling Speed required to form a glass is obtained for a simple solvable energy landscape model. The model, made from a two-level system modified to include the topology of the energy landscape, is able to capture either a glass transition or a crystallization depending on Cooling rate. In this setup, the minimal Cooling Speed to achieve glass formation is then found to be related with the relaxation time and with the thermal history. In particular, we obtain that the thermal history encodes small fluctuations around the equilibrium population which are exponentially amplified near the glass transition, which mathematically corresponds to the boundary layer of the master equation. Finally, to verify our analytical results, a kinetic Monte-Carlo simulation was implemented.

Minoru Ueshima - One of the best experts on this subject based on the ideXlab platform.

  • Sn–Ag–Cu Soldering Reliability as Influenced by Process Atmosphere
    IEEE Transactions on Electronics Packaging Manufacturing, 2010
    Co-Authors: Alongheng Baated, Katsuaki Suganuma, Junxiang Jiang, Sharon Huang, Benjamin Jurcik, Shigeyoshi Nozawa, Minoru Ueshima
    Abstract:

    To develop an optimal surface mount reflow soldering process with Sn-Ag-Cu, the influences of atmosphere and Cooling Speed on soldering reliability have been examined by using Sn plated chip components and of Pd plated small outline packages (SOPs) on a printed circuit board (PCB). Typical three Sn-Ag-Cu alloy pastes, i.e., Sn-3.0wt%Ag-0.5wt%Cu, Sn-3.8wt%Ag-0.75wt%Cu, and Sn-4.0wt%Ag-0.9wt%Cu, were used for reflow soldering in air or N2 atmospheres. In the case of chip component joints, the solder compositions, Cooling Speed, and atmospheres during reflow treatment slightly affect the dendritic microstructure of the solder fillets. In contrast, these parameters rarely affect the solder wettability both on boards/components and shear strengths of the solder joints. In the case of the SOP joints, however, the atmospheres in reflow treatment and the fluxes strongly affect the appearances of solder fillet surfaces structure. Despite the types of solder fluxes, N2 process atmosphere obviously improved wettability of the solders on the lead-frames of the SOP. Moreover, the scatter in shear strengths becomes smaller and the wetting of solders on the lead-frames becomes stabler in N2 atmosphere than in air atmosphere.

  • Sn-Ag-Cu Soldering Reliability Influenced by Process Atmosphere
    2007 International Symposium on High Density packaging and Microsystem Integration, 2007
    Co-Authors: Alongheng Baated, Katsuaki Suganuma, Junxiang Jiang, Sharon Huang, Benjamin Jurcik, Shigeyoshi Nozawa, Minoru Ueshima
    Abstract:

    To develop an optimal soldering process of Sn-Ag-Cu soldered joints, the influences of atmosphere and Cooling Speed during reflow treatment on soldering reliability have been examined through the use of Sn plated chip components and of Pd plated small outline packages (SOPs) on a printed circuit board (PCB) soldered with Sn-3wt.%Ag-0.5wt.%Cu, Sn-3.8wt.%Ag-0.75wt.%Cu and Sn-4wt.%Ag-0.9wt.%Cu solder pastes under air or N2 atmospheres. In the case of chip component joints, the solder compositions, Cooling Speed and atmospheres during reflow treatment slightly affect the dendritic microstructure. Those parameters rarely affect the wetting behavior and mechanical properties. In the case of SOP joints, however, the atmospheres during reflow treatment and fluxes strongly affect the appearances of fillet surfaces structure. Despite the types of solder fluxes, N2 process atmosphere obviously improved wettability of solder on lead-frame of the SOP.

J. Quetzalcóatl Toledo-marín - One of the best experts on this subject based on the ideXlab platform.

  • Minimal Cooling Speed for glass transition in a simple solvable energy landscape model
    Physica A-statistical Mechanics and Its Applications, 2016
    Co-Authors: J. Quetzalcóatl Toledo-marín, Isaac Pérez Castillo, Gerardo G. Naumis
    Abstract:

    The minimal Cooling Speed required to form a glass is obtained for a simple solvable energy landscape model. The model, made from a two-level system modified to include the topology of the energy landscape, is able to capture either a glass transition or a crystallization depending on the Cooling rate. In this setup, the minimal Cooling Speed to achieve glass formation is then found to be related with the crystallization relaxation time, energy barrier and with the thermal history. In particular, we obtain that the thermal history encodes small fluctuations around the equilibrium population which are exponentially amplified near the glass transition, which mathematically corresponds to the boundary layer of the master equation. The change in the glass transition temperature is also found as a function of the Cooling rate. Finally, to verify our analytical results, a kinetic Monte Carlo simulation was implemented.

  • Minimal Cooling Speed for glass transition in a simple solvable energy landscape model
    arXiv: Soft Condensed Matter, 2015
    Co-Authors: J. Quetzalcóatl Toledo-marín, Isaac Pérez Castillo, Gerardo G. Naumis
    Abstract:

    The minimal Cooling Speed required to form a glass is obtained for a simple solvable energy landscape model. The model, made from a two-level system modified to include the topology of the energy landscape, is able to capture either a glass transition or a crystallization depending on Cooling rate. In this setup, the minimal Cooling Speed to achieve glass formation is then found to be related with the relaxation time and with the thermal history. In particular, we obtain that the thermal history encodes small fluctuations around the equilibrium population which are exponentially amplified near the glass transition, which mathematically corresponds to the boundary layer of the master equation. Finally, to verify our analytical results, a kinetic Monte-Carlo simulation was implemented.

K S Kim - One of the best experts on this subject based on the ideXlab platform.

  • effects of Cooling Speed on microstructure and tensile properties of sn ag cu alloys
    Materials Science and Engineering A-structural Materials Properties Microstructure and Processing, 2002
    Co-Authors: K S Kim, S H Huh, Katsuaki Suganuma
    Abstract:

    Abstract The microstructures and tensile properties of three typical Sn–Ag–Cu alloys, Sn–3.0wt.%Ag–0.5wt.%Cu, Sn–3.5wt.%Ag–0.7wt.%Cu and Sn–3.9wt.%Ag–0.6wt.%Cu, prepared under three different Cooling conditions were evaluated after casting. The microstructures of all rapidly cooled specimens consisted of the eutectic phase of β-Sn with fine fibrous Ag3Sn dispersion surrounding primary β-Sn grains. The slowly cooled Sn–3.5Ag–0.7Cu and Sn–3.9Ag–0.6Cu alloys exhibited additional large primary Ag3Sn platelets, while the Sn–3.0Ag–0.5Cu did not. For all alloys, both ultimate tensile strength and 0.2% proof stress increased with increasing strain-rates in tensile tests. Lowering Cooling Speed decreased tensile strength. Elongation increased with an increasing strain rate from 10−5 to 10−2 s−1, and decreased slightly at 10−1 s−1 for the rapidly cooled specimens. Elongation remarkably decreased for the slowly cooled Sn–3.5Ag–0.7Cu and Sn–3.9Ag–0.6Cu alloys, a degradation attributable to the formation of large primary Ag3Sn platelets.