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Charles Kappenstein - One of the best experts on this subject based on the ideXlab platform.

  • mechanically stable and corrosion resistant superhydrophobic sol gel coatings on Copper Substrate
    Applied Surface Science, 2011
    Co-Authors: Venkateswara A Rao, Sanjay S. Latthe, Satish A. Mahadik, Charles Kappenstein
    Abstract:

    Abstract Development of the anticorrosion coatings on metals having both passive matrix functionality and active response to changes in the aggressive environment has raised tremendous interest in material science. Using a sol–gel deposition method, superhydrophobic Copper Substrate could be obtained. The best hydrophobic coating sol was prepared with methyltriethoxysilane (MTES), methanol (MeOH), and water (as 7 M NH4OH) at a molar ratio of 1:19.1:4.31 respectively. The surface morphological study showed the ball like silica particles distributed on the Copper Substrate with particle sizes ranging from 8 to 12 μm. The coatings showed the static water contact angle as high as 155° and the water sliding angle as low as 7°. The superhydrophobic nature was maintained even though the deposited Copper Substrate was soaked for 100 h in 50% of HCl solution. The coatings are stable against humidity and showed superhydrophobic behavior even after 90 days of exposure. The coatings are mechanically stable and water drops maintained the spherical shape on the bent Copper Substrate, which was bent more than 90°.

  • Mechanically stable and corrosion resistant superhydrophobic sol–gel coatings on Copper Substrate
    Applied Surface Science, 2011
    Co-Authors: A. Venkateswara Rao, Sanjay S. Latthe, Satish A. Mahadik, Charles Kappenstein
    Abstract:

    Abstract Development of the anticorrosion coatings on metals having both passive matrix functionality and active response to changes in the aggressive environment has raised tremendous interest in material science. Using a sol–gel deposition method, superhydrophobic Copper Substrate could be obtained. The best hydrophobic coating sol was prepared with methyltriethoxysilane (MTES), methanol (MeOH), and water (as 7 M NH4OH) at a molar ratio of 1:19.1:4.31 respectively. The surface morphological study showed the ball like silica particles distributed on the Copper Substrate with particle sizes ranging from 8 to 12 μm. The coatings showed the static water contact angle as high as 155° and the water sliding angle as low as 7°. The superhydrophobic nature was maintained even though the deposited Copper Substrate was soaked for 100 h in 50% of HCl solution. The coatings are stable against humidity and showed superhydrophobic behavior even after 90 days of exposure. The coatings are mechanically stable and water drops maintained the spherical shape on the bent Copper Substrate, which was bent more than 90°.

Sanjay S. Latthe - One of the best experts on this subject based on the ideXlab platform.

  • mechanically stable and corrosion resistant superhydrophobic sol gel coatings on Copper Substrate
    Applied Surface Science, 2011
    Co-Authors: Venkateswara A Rao, Sanjay S. Latthe, Satish A. Mahadik, Charles Kappenstein
    Abstract:

    Abstract Development of the anticorrosion coatings on metals having both passive matrix functionality and active response to changes in the aggressive environment has raised tremendous interest in material science. Using a sol–gel deposition method, superhydrophobic Copper Substrate could be obtained. The best hydrophobic coating sol was prepared with methyltriethoxysilane (MTES), methanol (MeOH), and water (as 7 M NH4OH) at a molar ratio of 1:19.1:4.31 respectively. The surface morphological study showed the ball like silica particles distributed on the Copper Substrate with particle sizes ranging from 8 to 12 μm. The coatings showed the static water contact angle as high as 155° and the water sliding angle as low as 7°. The superhydrophobic nature was maintained even though the deposited Copper Substrate was soaked for 100 h in 50% of HCl solution. The coatings are stable against humidity and showed superhydrophobic behavior even after 90 days of exposure. The coatings are mechanically stable and water drops maintained the spherical shape on the bent Copper Substrate, which was bent more than 90°.

  • Mechanically stable and corrosion resistant superhydrophobic sol–gel coatings on Copper Substrate
    Applied Surface Science, 2011
    Co-Authors: A. Venkateswara Rao, Sanjay S. Latthe, Satish A. Mahadik, Charles Kappenstein
    Abstract:

    Abstract Development of the anticorrosion coatings on metals having both passive matrix functionality and active response to changes in the aggressive environment has raised tremendous interest in material science. Using a sol–gel deposition method, superhydrophobic Copper Substrate could be obtained. The best hydrophobic coating sol was prepared with methyltriethoxysilane (MTES), methanol (MeOH), and water (as 7 M NH4OH) at a molar ratio of 1:19.1:4.31 respectively. The surface morphological study showed the ball like silica particles distributed on the Copper Substrate with particle sizes ranging from 8 to 12 μm. The coatings showed the static water contact angle as high as 155° and the water sliding angle as low as 7°. The superhydrophobic nature was maintained even though the deposited Copper Substrate was soaked for 100 h in 50% of HCl solution. The coatings are stable against humidity and showed superhydrophobic behavior even after 90 days of exposure. The coatings are mechanically stable and water drops maintained the spherical shape on the bent Copper Substrate, which was bent more than 90°.

Satish A. Mahadik - One of the best experts on this subject based on the ideXlab platform.

  • mechanically stable and corrosion resistant superhydrophobic sol gel coatings on Copper Substrate
    Applied Surface Science, 2011
    Co-Authors: Venkateswara A Rao, Sanjay S. Latthe, Satish A. Mahadik, Charles Kappenstein
    Abstract:

    Abstract Development of the anticorrosion coatings on metals having both passive matrix functionality and active response to changes in the aggressive environment has raised tremendous interest in material science. Using a sol–gel deposition method, superhydrophobic Copper Substrate could be obtained. The best hydrophobic coating sol was prepared with methyltriethoxysilane (MTES), methanol (MeOH), and water (as 7 M NH4OH) at a molar ratio of 1:19.1:4.31 respectively. The surface morphological study showed the ball like silica particles distributed on the Copper Substrate with particle sizes ranging from 8 to 12 μm. The coatings showed the static water contact angle as high as 155° and the water sliding angle as low as 7°. The superhydrophobic nature was maintained even though the deposited Copper Substrate was soaked for 100 h in 50% of HCl solution. The coatings are stable against humidity and showed superhydrophobic behavior even after 90 days of exposure. The coatings are mechanically stable and water drops maintained the spherical shape on the bent Copper Substrate, which was bent more than 90°.

  • Mechanically stable and corrosion resistant superhydrophobic sol–gel coatings on Copper Substrate
    Applied Surface Science, 2011
    Co-Authors: A. Venkateswara Rao, Sanjay S. Latthe, Satish A. Mahadik, Charles Kappenstein
    Abstract:

    Abstract Development of the anticorrosion coatings on metals having both passive matrix functionality and active response to changes in the aggressive environment has raised tremendous interest in material science. Using a sol–gel deposition method, superhydrophobic Copper Substrate could be obtained. The best hydrophobic coating sol was prepared with methyltriethoxysilane (MTES), methanol (MeOH), and water (as 7 M NH4OH) at a molar ratio of 1:19.1:4.31 respectively. The surface morphological study showed the ball like silica particles distributed on the Copper Substrate with particle sizes ranging from 8 to 12 μm. The coatings showed the static water contact angle as high as 155° and the water sliding angle as low as 7°. The superhydrophobic nature was maintained even though the deposited Copper Substrate was soaked for 100 h in 50% of HCl solution. The coatings are stable against humidity and showed superhydrophobic behavior even after 90 days of exposure. The coatings are mechanically stable and water drops maintained the spherical shape on the bent Copper Substrate, which was bent more than 90°.

Haiqiang Jia - One of the best experts on this subject based on the ideXlab platform.

  • flexible zno thin film transistors on thin Copper Substrate
    IEEE Transactions on Electron Devices, 2018
    Co-Authors: Wenxing Huo, Bin Zhao, Zengxia Mei, Minglong Zhao, Yanxin Sui, Yonghui Zhang, Tao Wang, Shujuan Cui, Huili Liang, Haiqiang Jia
    Abstract:

    In this paper, we report the fabrication of flexible ZnO thin-film transistors (TFTs) on the 25- $\mu \text{m}$ -thick Copper Substrate. The Cu Substrate compatible with high-temperature processes was deposited by electroplating, which led to a smooth surface. The ZnO layer was deposited at room temperature, and a thermal annealing process was conducted at 300 °C in the air after the fabrication of TFTs. The threshold voltage, hysteresis voltage, and contact resistance are improved after annealing, whereas the mobility, subthreshold swing, and ON/OFF ratio are barely changed. The stabilities of ZnO TFTs are also enhanced, evidenced by the smaller threshold voltage shifts induced by positive and negative gate bias stresses. The field-effect mobility, threshold voltage, and subthreshold swing are stable even when exposed to a mechanical tensile strain up to 1.25% and 10 000 bending cycles.

Fang Liu - One of the best experts on this subject based on the ideXlab platform.

  • laser cladding ni co duplex coating on Copper Substrate
    Optics and Lasers in Engineering, 2010
    Co-Authors: Fang Liu, Changsheng Liu, Suiyuan Chen, Xingqi Tao, Yong Zhang
    Abstract:

    Abstract Ni–Co duplex coating has been successfully cladded on Copper Substrate by continuous wave CO 2 laser. The average microhardness of cladded coating was 635 HV 0.05 , which was about 7 times of Cu Substrate (92 HV 0.05 ). During sliding wear tests, the volume loss of Copper Substrate was about 7 times of Ni–Co duplex coating at 60 min. The high microhardness and crack free advantages of Ni–Co duplex coating, were favorable to reduce the plastic deformation and adhesive wear of Copper Substrate, resulting in the improvement of wear properties.

  • Pulsed Nd:YAG laser post-treatment Ni-based crack-free coating on Copper Substrate and its wear properties
    Surface and Coatings Technology, 2007
    Co-Authors: Fang Liu, Changsheng Liu, Suiyuan Chen, Xingqi Tao, Ming Wang
    Abstract:

    Abstract Laser post-treatment of Ni–Cu plasma-sprayed layer on Copper Substrate was conducted by pulsed Nd:YAG laser, and its sliding wear tests were investigated. Optical microscope (OM) and scanning electron microscope (SEM) observations showed that, after the laser post-treatment processing, the obtained Ni–Cu coating had dense and homogeneous structure, as well as metallurgical combination with Copper Substrate, without cracks found. High microhardness of 347 HV of Ni–Cu coating was obtained, which was almost 3.4 times of Cu Substrate (102 HV). The volume loss of Copper Substrate was nearly 4 times of the laser post-treated sample, under sliding wear tests. With the laser post-treatment of large area crack-free Ni–Cu coating on Copper Substrate, the seizure tendency of Ni–Cu coating was much more suppressed, resulting in the improvement of wear properties.