The Experts below are selected from a list of 11817 Experts worldwide ranked by ideXlab platform
Tsunenobu Kimoto - One of the best experts on this subject based on the ideXlab platform.
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ultrahigh voltage sic mps diodes with hybrid unipolar bipolar operation
IEEE Transactions on Electron Devices, 2017Co-Authors: Hiroki Niwa, Jun Suda, Tsunenobu KimotoAbstract:In this paper, ultrahigh-voltage (UHV) SiC devices with hybrid unipolar/bipolar operation are introduced and demonstrated. As the first step of such a device, a merged p-i-n Schottky (MPS) diode with an epitaxial p+-anode layer is proposed to reduce the conduction loss of a bipolar device in the low current region. A “snapback” phenomenon is intensively investigated by analytical modeling, device simulation, and experiment and a Design Guideline of snapback-free hybrid operating MPS diodes is presented. Using the Design Guideline, snapback-free MPS diodes are fabricated and forward characteristics are investigated. By using a proper edge termination structure, a UHV SiC MPS diode with breakdown voltage of 11.3 kV is demonstrated.
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Ultrahigh-Voltage SiC MPS Diodes With Hybrid Unipolar/Bipolar Operation
IEEE Transactions on Electron Devices, 2017Co-Authors: Hiroki Niwa, Jun Suda, Tsunenobu KimotoAbstract:In this paper, ultrahigh-voltage (UHV) SiC devices with hybrid unipolar/bipolar operation are introduced and demonstrated. As the first step of such a device, a merged p-i-n Schottky (MPS) diode with an epitaxial p+-anode layer is proposed to reduce the conduction loss of a bipolar device in the low current region. A “snapback” phenomenon is intensively investigated by analytical modeling, device simulation, and experiment and a Design Guideline of snapback-free hybrid operating MPS diodes is presented. Using the Design Guideline, snapback-free MPS diodes are fabricated and forward characteristics are investigated. By using a proper edge termination structure, a UHV SiC MPS diode with breakdown voltage of 11.3 kV is demonstrated.
Hiroki Niwa - One of the best experts on this subject based on the ideXlab platform.
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ultrahigh voltage sic mps diodes with hybrid unipolar bipolar operation
IEEE Transactions on Electron Devices, 2017Co-Authors: Hiroki Niwa, Jun Suda, Tsunenobu KimotoAbstract:In this paper, ultrahigh-voltage (UHV) SiC devices with hybrid unipolar/bipolar operation are introduced and demonstrated. As the first step of such a device, a merged p-i-n Schottky (MPS) diode with an epitaxial p+-anode layer is proposed to reduce the conduction loss of a bipolar device in the low current region. A “snapback” phenomenon is intensively investigated by analytical modeling, device simulation, and experiment and a Design Guideline of snapback-free hybrid operating MPS diodes is presented. Using the Design Guideline, snapback-free MPS diodes are fabricated and forward characteristics are investigated. By using a proper edge termination structure, a UHV SiC MPS diode with breakdown voltage of 11.3 kV is demonstrated.
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Ultrahigh-Voltage SiC MPS Diodes With Hybrid Unipolar/Bipolar Operation
IEEE Transactions on Electron Devices, 2017Co-Authors: Hiroki Niwa, Jun Suda, Tsunenobu KimotoAbstract:In this paper, ultrahigh-voltage (UHV) SiC devices with hybrid unipolar/bipolar operation are introduced and demonstrated. As the first step of such a device, a merged p-i-n Schottky (MPS) diode with an epitaxial p+-anode layer is proposed to reduce the conduction loss of a bipolar device in the low current region. A “snapback” phenomenon is intensively investigated by analytical modeling, device simulation, and experiment and a Design Guideline of snapback-free hybrid operating MPS diodes is presented. Using the Design Guideline, snapback-free MPS diodes are fabricated and forward characteristics are investigated. By using a proper edge termination structure, a UHV SiC MPS diode with breakdown voltage of 11.3 kV is demonstrated.
Jun Suda - One of the best experts on this subject based on the ideXlab platform.
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ultrahigh voltage sic mps diodes with hybrid unipolar bipolar operation
IEEE Transactions on Electron Devices, 2017Co-Authors: Hiroki Niwa, Jun Suda, Tsunenobu KimotoAbstract:In this paper, ultrahigh-voltage (UHV) SiC devices with hybrid unipolar/bipolar operation are introduced and demonstrated. As the first step of such a device, a merged p-i-n Schottky (MPS) diode with an epitaxial p+-anode layer is proposed to reduce the conduction loss of a bipolar device in the low current region. A “snapback” phenomenon is intensively investigated by analytical modeling, device simulation, and experiment and a Design Guideline of snapback-free hybrid operating MPS diodes is presented. Using the Design Guideline, snapback-free MPS diodes are fabricated and forward characteristics are investigated. By using a proper edge termination structure, a UHV SiC MPS diode with breakdown voltage of 11.3 kV is demonstrated.
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Ultrahigh-Voltage SiC MPS Diodes With Hybrid Unipolar/Bipolar Operation
IEEE Transactions on Electron Devices, 2017Co-Authors: Hiroki Niwa, Jun Suda, Tsunenobu KimotoAbstract:In this paper, ultrahigh-voltage (UHV) SiC devices with hybrid unipolar/bipolar operation are introduced and demonstrated. As the first step of such a device, a merged p-i-n Schottky (MPS) diode with an epitaxial p+-anode layer is proposed to reduce the conduction loss of a bipolar device in the low current region. A “snapback” phenomenon is intensively investigated by analytical modeling, device simulation, and experiment and a Design Guideline of snapback-free hybrid operating MPS diodes is presented. Using the Design Guideline, snapback-free MPS diodes are fabricated and forward characteristics are investigated. By using a proper edge termination structure, a UHV SiC MPS diode with breakdown voltage of 11.3 kV is demonstrated.
Srinivasan Arjun Tekalur - One of the best experts on this subject based on the ideXlab platform.
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crack tortuousity in the nacreous layer topological dependence and biomimetic Design Guideline
International Journal of Solids and Structures, 2014Co-Authors: Abhishek Dutta, Srinivasan Arjun TekalurAbstract:Abstract The nacreous layer in seashells is known for two phenomenal aspects: light-weightiness and superior fracture toughness. Of a multitude of toughening mechanisms, the highly meandering nature of the crack path through its staggered architecture has been reported to contribute approximately a third of its overall toughness. In the current article, we are trying to establish the scientific rationale associated with the influence of overlap length on the crack-tip driving force from a local perspective via development of a simplified analytical model. Characteristic overlap lengths computed showed reasonable agreement with the values reported in the nacreous layer and previously published experimental data. Biomimetic Design Guideline obtained from the current investigation would thereby lead to development of synthetic staggered architecture materials with improved stiffness, load-transfer and toughness.
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Crack tortuousity in the nacreous layer – Topological dependence and biomimetic Design Guideline
International Journal of Solids and Structures, 2014Co-Authors: Abhishek Dutta, Srinivasan Arjun TekalurAbstract:Abstract The nacreous layer in seashells is known for two phenomenal aspects: light-weightiness and superior fracture toughness. Of a multitude of toughening mechanisms, the highly meandering nature of the crack path through its staggered architecture has been reported to contribute approximately a third of its overall toughness. In the current article, we are trying to establish the scientific rationale associated with the influence of overlap length on the crack-tip driving force from a local perspective via development of a simplified analytical model. Characteristic overlap lengths computed showed reasonable agreement with the values reported in the nacreous layer and previously published experimental data. Biomimetic Design Guideline obtained from the current investigation would thereby lead to development of synthetic staggered architecture materials with improved stiffness, load-transfer and toughness.
Winfried Lamersdorf - One of the best experts on this subject based on the ideXlab platform.
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context aware computation offloading for mobile cloud computing requirements analysis survey and Design Guideline
Procedia Computer Science, 2015Co-Authors: Gabriel Orsini, Dirk Bade, Winfried LamersdorfAbstract:Abstract Along with the rise of mobile handheld devices the resource demands of respective applications grow as well. However, mobile devices are still and will always be limited related to performance (e.g., computation, storage and battery life), context adaptation (e.g., intermittent connectivity, scalability and heterogeneity) and security aspects. A prominent solution to overcome these limita- tions is the so-called computation offloading, which is the focus of mobile cloud computing (MCC). However, current approaches fail to address the complexity that results from quickly and constantly changing context conditions in mobile user scenarios and hence developing effective and efficient MCC applications is still challenging. Therefore, this paper first presents a list of re- quirements for MCC applications together with a survey and classification of current solutions. Furthermore, it provides a Design Guideline for the selection of suitable concepts for different classes of common cloud-augmented mobile applications. Finally, it presents open issues that developers and researchers should be aware of when Designing their MCC-approach.
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FNC/MobiSPC - Context-Aware Computation Offloading for Mobile Cloud Computing: Requirements Analysis, Survey and Design Guideline
Procedia Computer Science, 2015Co-Authors: Gabriel Orsini, Dirk Bade, Winfried LamersdorfAbstract:Abstract Along with the rise of mobile handheld devices the resource demands of respective applications grow as well. However, mobile devices are still and will always be limited related to performance (e.g., computation, storage and battery life), context adaptation (e.g., intermittent connectivity, scalability and heterogeneity) and security aspects. A prominent solution to overcome these limita- tions is the so-called computation offloading, which is the focus of mobile cloud computing (MCC). However, current approaches fail to address the complexity that results from quickly and constantly changing context conditions in mobile user scenarios and hence developing effective and efficient MCC applications is still challenging. Therefore, this paper first presents a list of re- quirements for MCC applications together with a survey and classification of current solutions. Furthermore, it provides a Design Guideline for the selection of suitable concepts for different classes of common cloud-augmented mobile applications. Finally, it presents open issues that developers and researchers should be aware of when Designing their MCC-approach.
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The 12th International Conference on Mobile Systems and Pervasive Computing (MobiSPC 2015) Context-Aware Computation Offloading for Mobile Cloud Computing: Requirements Analysis, Survey and Design Guideline
2015Co-Authors: Gabriel Orsini, Dirk Bade, Winfried LamersdorfAbstract:Along with the rise of mobile handheld devices the resource demands of respective applications grow as well. However, mobile de vices are still and will always be limited related to performance (e.g., computation, storage and battery life), context adaptation (e.g., intermittent connectivity, scalability and heterogeneity) and security aspects. A prominent solution to overcome these limitations is the so-called computation offloading, which is the focus of mobile cloud computing (MCC). However, current approaches f ail to address the complexity that results from quickly and constantly changing context conditions in mobile user scenarios and hence developing effective and efficient MCC applications is still challenging. Therefore, this paper first presents a list of requirements for MCC applications together with a survey and classification of current solutions. Furthermore, it provides a Design Guideline for the selection of suitable concepts for different classes of common cloud-augmented mobile applications. Finally, it presents open issues that developers and researchers should be aware of when Designing their MCC-approach. c
